Patent application number | Description | Published |
20100330583 | Compositions and methods for identification of PARP function, inhibitors, and activators - The invention provides nucleic acids encoding PARP fusion proteins, PARP fusion proteins, antibodies that bind to one or more of these PARP fusion proteins, and transgenic cells expressing one or more PARP fusion proteins. The invention also provides methods for identifying an agent as a specific PARP inhibitor or activator requiring contacting one or more PARP fusion proteins with a labeled nicotinamide adenine dinucleotide substrate and the agent and measuring the amount of labeled of ADP-ribose covalently attached to the one or more PARP fusion proteins. The invention also provides methods for identifying an agent that specifically binds to one or more PARP fusion proteins and methods for quantitating the level of one or more PARP proteins in a sample. | 12-30-2010 |
20110097328 | METHODS AND COMPOSITIONS FOR INCREASING THE ACTIVITY OF INHIBITORY RNA - The invention provides methods for increasing the activity of an inhibitory RNA (RNAi) in a subject requiring administering one or more poly-ADP-ribose polymerase (PARP) inhibitors and/or one or more PARG activators to the subject. The invention also provides methods for increasing the activity of an inhibitory RNA in a cell or cell population requiring contacting a cell or cell population with one or more PARP inhibitors and/or one or more PARG activators. The invention further provides compositions and kits containing one or more PARP inhibitors and/or one or more PARG activators. | 04-28-2011 |
20110097329 | COMPOSITIONS AND METHODS FOR TREATING CANCER AND MODULATING STRESS GRANULE FORMATION - The invention provides methods for treating or decreasing the likelihood of developing a stress-granule related disorder and/or cancer by administering one or more poly-ADP-ribose polymerase (PARP) inhibitors, one or more PARP activators, one or more poly-ADP-ribose glycosylase (PARG) activators, and/or one or more poly-ADP-ribose glycohydrolase ARH3 activators. The invention also provides corresponding methods of decreasing stress granule formation and/or proliferation in a cell or a population of cells. The invention further provides methods of increasing the number of stress granules and proliferation in a cell or a population of cells by administering one or more PARP activators, one or more PARP inhibitors, one or more PARG inhibitors, and/or one or more ARH3 inhibitors. The invention also provides methods for screening for agents for treating or decreasing the likelihood of developing a stress granule-related disorder or cancer, and methods for determining the propensity for developing a stress granule-related disorder or cancer, as well as compositions and kits containing one or more PARP inhibitors, one or more PARP activators, one or more PARG activators, and one or more ARH3 activators. | 04-28-2011 |
20130156776 | COMPOSITIONS AND METHODS FOR TREATING CANCER AND MODULATING STRESS GRANULE FORMATION - The invention provides methods for treating or decreasing the likelihood of developing a stress-granule related disorder and/or cancer by administering one or more poly-ADP-ribose polymerase (PARP) inhibitors, one or more PARP activators, one or more poly-ADP-ribose glycosylase (PARG) activators, and/or one or more poly-ADP-ribose glycohydrolase ARH3 activators. The invention also provides corresponding methods of decreasing stress granule formation and/or proliferation in a cell or a population of cells. The invention further provides methods of increasing the number of stress granules and proliferation in a cell or a population of cells by administering one or more PARP activators, one or more PARP inhibitors, one or more PARG inhibitors, and/or one or more ARH3 inhibitors. The invention also provides methods for screening for agents for treating or decreasing the likelihood of developing a stress granule-related disorder or cancer, and methods for determining the propensity for developing a stress granule-related disorder or cancer, as well as compositions and kits containing one or more PARP inhibitors, one or more PARP activators, one or more PARG activators, and one or more ARH3 activators. | 06-20-2013 |
20140348857 | METHODS OF DIAGNOSIS AND TREATMENT OF ENDOPLASMIC RETICULUM (ER) STRESS-RELATED CONDITIONS - The present invention relates to methods for treating endoplasmic reticulum (ER) stress-related conditions (e.g., cancer, protein folding/misfolding disease, diabetes mellitus) and for identifying compounds for treating ER stress-related conditions in a subject (e.g., a human). The invention also provides methods for diagnosing an ER stress-related condition in a subject and kits for the treatment of same. | 11-27-2014 |
Patent application number | Description | Published |
20090106714 | METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD - Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design. | 04-23-2009 |
20100207208 | NANOWIRE MESH DEVICE AND METHOD OF FABRICATING SAME - A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region. | 08-19-2010 |
20100297816 | NANOWIRE MESH DEVICE AND METHOD OF FABRICATING SAME - A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region. | 11-25-2010 |
20110082680 | COMPACT MODEL FOR DEVICE/CIRCUIT/CHIP LEAKAGE CURRENT (IDDQ) CALCULATION INCLUDING PROCESS INDUCED UPLIFT FACTORS - A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis. | 04-07-2011 |
20110307846 | METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD - Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design. | 12-15-2011 |
20110309332 | EPITAXIAL SOURCE/DRAIN CONTACTS SELF-ALIGNED TO GATES FOR DEPOSITED FET CHANNELS - A method of forming a self-aligned device is provided and includes depositing carbon nanotubes (CNTs) onto a crystalline dielectric substrate, isolating a portion of the crystalline dielectric substrate encompassing a location of the CNTs, forming gate dielectric and gate electrode gate stacks on the CNTs while maintaining a structural integrity thereof and forming epitaxial source and drain regions in contact with portions of the CNTs on the crystalline dielectric substrate that are exposed from the gate dielectric and gate electrode gate stacks. | 12-22-2011 |
20120138888 | Single Gate Inverter Nanowire Mesh - A FET inverter is provided that includes a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels, wherein the source and drain regions of one or more of the device layers are doped with an n-type dopant and the source and drain regions of one or more other of the device layers are doped with a p-type dopant; a gate common to each of the device layers surrounding the nanowire channels; a first contact to the source regions of the one or more device layers doped with an n-type dopant; a second contact to the source regions of the one or more device layers doped with a p-type dopant; and a third contact common to the drain regions of each of the device layers. Techniques for fabricating a FET inverter are also provided. | 06-07-2012 |
20120168872 | Nanomesh SRAM Cell - Nanowire-based devices are provided. In one aspect, a SRAM cell includes at least one pair of pass gates and at least one pair of inverters formed adjacent to one another on a wafer. Each pass gate includes one or more device layers each having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region and a gate common to each of the pass gate device layers surrounding the nanowire channels. Each inverter includes a plurality of device layers each having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region and a gate common to each of the inverter device layers surrounding the nanowire channels. | 07-05-2012 |
20120208338 | SELF ALIGNED IMPACT-IONIZATION MOS (I-MOS) DEVICE AND METHODS OF MANUFACTURE - A method of forming a semiconductor structure, including forming a gate structure on a substrate; performing a first angled implantation on a first side of the gate structure to form a first doped region in the substrate, the first doped region partially extends within a channel of the gate structure and the gate structure blocks the first angled implantation from affecting the substrate on a second side of the gate structure; forming sidewall spacers on sidewalls of the gate; and forming a second doped region in the substrate on the second side of the gate, spaced apart from the channel. | 08-16-2012 |
20120217479 | Nanowire Mesh FET with Multiple Threshold Voltages - Nanowire-based field-effect transistors (FETs) and techniques for the fabrication thereof are provided. In one aspect, a FET is provided having a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein one or more of the device layers are configured to have a different threshold voltage from one or more other of the device layers; and a gate common to each of the device layers surrounding the nanowire channels. | 08-30-2012 |
20120227019 | METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD - Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design. | 09-06-2012 |
20120292598 | EPITAXIAL SOURCE/DRAIN CONTACTS SELF-ALIGNED TO GATES FOR DEPOSITED FET CHANNELS - A method of forming a self-aligned device is provided and includes depositing carbon nanotubes (CNTs) onto a crystalline dielectric substrate, isolating a portion of the crystalline dielectric substrate encompassing a location of the CNTs, forming gate dielectric and gate electrode gate stacks on the CNTs while maintaining a structural integrity thereof and forming epitaxial source and drain regions in contact with portions of the CNTs on the crystalline dielectric substrate that are exposed from the gate dielectric and gate electrode gate stacks. | 11-22-2012 |
20120326127 | COLLAPSABLE GATE FOR DEPOSITED NANOSTRUCTURES - A disposable material layer is first deposited on a graphene layer or a carbon nanotube (CNT). The disposable material layer includes a material that is less inert than graphene or CNT so that a contiguous dielectric material layer can be deposited at a target dielectric thickness without pinholes therein. A gate stack is formed by patterning the contiguous dielectric material layer and a gate conductor layer deposited thereupon. The disposable material layer shields and protects the graphene layer or the CNT during formation of the gate stack. The disposable material layer is then removed by a selective etch, releasing a free-standing gate structure. The free-standing gate structure is collapsed onto the graphene layer or the CNT below at the end of the selective etch so that the bottom surface of the contiguous dielectric material layer contacts an upper surface of the graphene layer or the CNT. | 12-27-2012 |
20130062709 | Gap-Fill Keyhole Repair Using Printable Dielectric Material - Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities. The gate cavities are filled with a gate dielectric and a gate electrode. | 03-14-2013 |
20130214357 | NON-PLANAR MOSFET STRUCTURES WITH ASYMMETRIC RECESSED SOURCE DRAINS AND METHODS FOR MAKING THE SAME - Non-planar Metal Oxide Field Effect Transistors (MOSFETs) and methods for making non-planar MOSFETs with asymmetric, recessed source and drains having improved extrinsic resistance and fringing capacitance. The methods include a fin-last, replacement gate process to form the non-planar MOSFETs and employ a retrograde metal lift-off process to form the asymmetric source/drain recesses. The lift-off process creates one recess which is off-set from a gate structure while a second recess is aligned with the structure. Thus, source/drain asymmetry is achieved by the physical structure of the source/drains, and not merely by ion implantation. The resulting non-planar device has a first channel of a fin contacting a substantially undoped area on the drain side and a doped area on the source side, thus the first channel is asymmetric. A channel on atop surface of a fin is symmetric because it contacts doped areas on both the drain and source sides. | 08-22-2013 |
20130238263 | METHODS AND SYSTEM FOR ANALYSIS AND MANAGEMENT OF PARAMETRIC YIELD - Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design. | 09-12-2013 |
20130288434 | COLLAPSABLE GATE FOR DEPOSITED NANOSTRUCTURES - A disposable material layer is first deposited on a graphene layer or a carbon nanotube (CNT). The disposable material layer includes a material that is less inert than graphene or CNT so that a contiguous dielectric material layer can be deposited at a target dielectric thickness without pinholes therein. A gate stack is formed by patterning the contiguous dielectric material layer and a gate conductor layer deposited thereupon. The disposable material layer shields and protects the graphene layer or the CNT during formation of the gate stack. The disposable material layer is then removed by a selective etch, releasing a free-standing gate structure. The free-standing gate structure is collapsed onto the graphene layer or the CNT below at the end of the selective etch so that the bottom surface of the contiguous dielectric material layer contacts an upper surface of the graphene layer or the CNT. | 10-31-2013 |
20130320399 | EMBEDDED PLANAR SOURCE/DRAIN STRESSORS FOR A FINFET INCLUDING A PLURALITY OF FINS - Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins. | 12-05-2013 |
20140065774 | EMBEDDED PLANAR SOURCE/DRAIN STRESSORS FOR A FINFET INCLUDING A PLURALITY OF FINS - Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins. | 03-06-2014 |
20140123097 | COMPACT MODEL FOR DEVICE/CIRCUIT/CHIP LEAKAGE CURRENT (IDDQ) CALCULATION INCLUDING PROCESS INDUCED UPLIFT FACTORS - A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis. | 05-01-2014 |
20140131817 | GAP-FILL KEYHOLE REPAIR USING PRINTABLE DIELECTRIC MATERIAL - Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities. The gate cavities are filled with a gate dielectric and a gate electrode. | 05-15-2014 |
20140151638 | HYBRID NANOMESH STRUCTURES - An alternating stack of first and second semiconductor layers is formed. Fin-defining mask structures are formed over the alternating stack. A planarization dielectric layer and first and second gate cavities therein are subsequently formed. The first and second gate cavities are extended downward by etching the alternating stack employing a combination of the planarization layer and the fin-defining mask structures as an etch mask. The second semiconductor material is isotropically etched to laterally expand the first gate cavity and to form a first array of semiconductor nanowires including the first semiconductor material, and the first semiconductor material is isotropically etched to laterally expand the second gate cavity and to form a second array of semiconductor nanowires including the second semiconductor material. The first and second gate cavities are filled with replacement gate structures. Each replacement gate structure laterally can surround a two-dimensional array of semiconductor nanowires. | 06-05-2014 |
20140151639 | NANOMESH COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR FIELD EFFECT TRANSISTORS - An alternating stack of first and second semiconductor layers is formed. Fin-defining mask structures are formed over the alternating stack. A planarization dielectric layer and first and second gate cavities therein are subsequently formed. The first and second gate cavities are extended downward by etching the alternating stack employing a combination of the planarization layer and the fin-defining mask structures as an etch mask. The germanium-free silicon material is isotropically etched to laterally expand the first gate cavity and to form a first array of semiconductor nanowires including the silicon-germanium alloy, and the silicon-germanium alloy is isotropically etched to laterally expand the second gate cavity and to form a second array of semiconductor nanowires including the germanium-free silicon material. The first and second gate cavities are filled with replacement gate structures. Each replacement gate structure laterally can surround a two-dimensional array of semiconductor nanowires. | 06-05-2014 |
20140151756 | FIN FIELD EFFECT TRANSISTORS INCLUDING COMPLIMENTARILY STRESSED CHANNELS - A stressed single crystalline epitaxial semiconductor layer having a first type stress is formed on a single crystalline substrate layer. First and second semiconductor fins are formed by patterning the stressed single crystalline epitaxial semiconductor layer. A center portion of each first semiconductor fin is undercut to form a recessed region, while the bottom surface of each second semiconductor fin maintains epitaxial registry with the single crystalline substrate layer. The center portion of each first semiconductor fin is under a second type of stress, which is the opposite of the first type of stress. A first field effect transistor formed on the first semiconductor fins can include first channels under the second type of stress along direction of current flow, and a second field effect transistor formed on the second semiconductor fins can include second channels under the first type of stress along the direction of current flow. | 06-05-2014 |
20140264276 | NON-REPLACEMENT GATE NANOMESH FIELD EFFECT TRANSISTOR WITH PAD REGIONS - A gate-first processing scheme for forming a nanomesh field effect transistor is provided. An alternating stack of two different semiconductor materials is patterned to include two pad regions and nanowire regions. A semiconductor material is laterally etched selective to another semiconductor material to form a nanomesh including suspended semiconductor nanowires. A stack of a gate dielectric, a gate electrode, and a gate cap dielectric is formed over the nanomesh. A dielectric spacer is formed around the gate electrode. An isotropic etch is employed to remove dielectric materials that are formed in lateral recesses of the patterned alternating stack. A selective epitaxy process can be employed to form a source region and a drain region. | 09-18-2014 |
20140264558 | FACETED INTRINSIC EPITAXIAL BUFFER LAYER FOR REDUCING SHORT CHANNEL EFFECTS WHILE MAXIMIZING CHANNEL STRESS LEVELS - A faceted intrinsic buffer semiconductor material is deposited on sidewalls of a source trench and a drain trench by selective epitaxy. A facet adjoins each edge at which an outer sidewall of a gate spacer adjoins a sidewall of the source trench or the drain trench. A doped semiconductor material is subsequently deposited to fill the source trench and the drain trench. The doped semiconductor material can be deposited such that the facets of the intrinsic buffer semiconductor material are extended and inner sidewalls of the deposited doped semiconductor material merges in each of the source trench and the drain trench. The doped semiconductor material can subsequently grow upward. Faceted intrinsic buffer semiconductor material portions allow greater outdiffusion of dopants near faceted corners while suppressing diffusion of dopants in regions of uniform width, thereby suppressing short channel effects. | 09-18-2014 |
20140312426 | 6T SRAM ARCHITECTURE FOR GATE-ALL-AROUND NANOWIRE DEVICES - A memory device includes a first plurality of semiconductor nanowires tethered between landing pads and suspended over a substrate. A first gate electrode surrounds each of the first plurality of semiconductor nanowires, making them gate-all-around (GAA) semiconductor nanowires. First, second, and third field effect transistors (FETs) are formed by the first plurality of semiconductor nanowires. The memory device also includes a second plurality of semiconductor nanowires tethered between landing pads and suspended over the substrate. A second gate electrode surrounds each of the second plurality of semiconductor nanowires, making them GAA semiconductor nanowires. Fourth, fifth, and sixth FETs are formed by the second plurality of semiconductor nanowires. The first gate electrode is aligned with and cross-coupled to a landing pad of the second plurality of semiconductor nanowires, and the second gate electrode is aligned with and cross-coupled to a landing pad of the first plurality of semiconductor nanowires. | 10-23-2014 |
20140315363 | 6T SRAM Architecture For Gate-All-Around Nanowire Devices - A memory device includes a first plurality of semiconductor nanowires tethered between landing pads and suspended over a substrate. A first gate electrode surrounds each of the first plurality of semiconductor nanowires, making them gate-all-around, (GAA) semiconductor nanowires. First, second, and third field effect transistors (FETs) are formed by the first plurality of semiconductor nanowires. The memory device also includes a second plurality of semiconductor nanowires tethered between landing pads and suspended over the substrate. A second gate electrode surrounds each of the second plurality of semiconductor nanowires, making them GAA semiconductor nanowires. Fourth, fifth, and sixth FETs are formed by the second plurality of semiconductor nanowires. The first gate electrode is aligned with and cross-coupled to a landing pad of the second plurality of semiconductor nanowires, and the second gate electrode is aligned with and cross-coupled to a landing pad of the first plurality of semiconductor nanowires. | 10-23-2014 |
20150084096 | FACETED INTRINSIC EPITAXIAL BUFFER LAYER FOR REDUCING SHORT CHANNEL EFFECTS WHILE MAXIMIZING CHANNEL STRESS LEVELS - A faceted intrinsic buffer semiconductor material is deposited on sidewalls of a source trench and a drain trench by selective epitaxy. A facet adjoins each edge at which an outer sidewall of a gate spacer adjoins a sidewall of the source trench or the drain trench. A doped semiconductor material is subsequently deposited to fill the source trench and the drain trench. The doped semiconductor material can be deposited such that the facets of the intrinsic buffer semiconductor material are extended and inner sidewalls of the deposited doped semiconductor material merges in each of the source trench and the drain trench. The doped semiconductor material can subsequently grow upward. Faceted intrinsic buffer semiconductor material portions allow greater outdiffusion of dopants near faceted corners while suppressing diffusion of dopants in regions of uniform width, thereby suppressing short channel effects. | 03-26-2015 |
Patent application number | Description | Published |
20110279075 | METHOD AND MODULE FOR CONTROLING ROTATION OF A MOTORIZED SPINDLE - In a method and module for controlling rotation of a motorized spindle driven by a driving unit, a sensing unit senses vibration of the spindle and generates a voltage signal corresponding to the vibration of the spindle. A processing unit receives the voltage signal from the sensing unit, generates an adjusting ratio equal to a reference voltage corresponding to a predetermined vibration level of the spindle by the voltage signal upon detecting that the voltage signal is greater than the reference voltage and is less than a predetermined threshold voltage that is greater than the reference voltage, and outputs a control signal corresponding to the adjusting ratio to the driving unit such that the driving unit reduces a rotation speed of the spindle by the adjusting ratio in response to the control signal from the processing unit. | 11-17-2011 |
20120294688 | SPINDLE CONTROL SYSTEM FOR A MILLING MACHINE - A spindle control system for a milling machine is provided. The milling machine includes a column, an overarm, a spindle for mounting a cutter, a first motor mounted on the column for driving movement of the overarm, and a second motor mounted on the overarm for driving rotation of the spindle. The spindle control system includes a distance sensor and a temperature sensor, each to be mounted on the overarm and to be disposed proximate to the end portion of the spindle. The spindle control system further includes a central control unit for determining a compensation parameter based on the displacement sensed by the distance sensor and the temperature sensed by the temperature sensor, and for controlling movement of the overarm by the first motor through a compensation distance based on the compensation parameter to compensate for at least one of the cutter deformation and the spindle deformation. | 11-22-2012 |
20120306420 | CONTROL SYSTEM OF MILLING MACHINE - A control system of a milling machine is disclosed. The milling machine has an overarm, a spindle connected to a cutter, a spindle motor, and an X-axis motor, a Y-axis motor and a Z-axis motor. The control system includes a vibration sensor for detecting a vibration level of the spindle. The control system also includes a central control unit configured to adjust a rotation speed of at least one of the X-axis motor, the Y-axis motor, and the Z-axis motor to bring a load current of at least one of the motors to be within a corresponding current range, and configured to adjust a rotation speed of the spindle motor to bring the vibration level to be within a vibration range. | 12-06-2012 |
20120321406 | DEFLECTION CORRECTION SYSTEM FOR A MILLING MACHINE - A milling machine has a carriage, a main spindle seat extending along an axis, and a motor operable to drive displacement of the main spindle seat relative to the carriage along the axis. A deflection correction system includes a control unit, a displacement sensor, at least one pressure cylinder, and a pressure sensor. The pressure cylinder includes a cylinder body, and a control rod extended retractably into the cylinder body. The control unit is configured to determine a pressure range as a function of displacement detected by the displacement sensor, and to maintain fluid pressure in the pressure cylinder within a pressure range, thereby controlling the control rod via the cylinder body to position the second end portion of the main spindle seat relative to the axis. | 12-20-2012 |
20130004256 | THERMAL COMPENSATION SYSTEM FOR A MILLING MACHINE - A milling machine has a base, a work platform mounted movably on the base, and a ruler mounted on the work platform. The work platform is movable relative to a base axis. The thermal compensation system includes a sensor and a control unit. The sensor is configured to be mounted on the base for sensing a position of each of the work platform and the ruler relative to the base axis. The control unit is coupled to the sensor, and determines a work platform displacement and a ruler displacement according to the positions sensed by the sensor. The control unit further calculates a compensation value based on the work platform displacement and the ruler displacement. The control unit is configured to correct the position of the work platform relative to the base axis according to the compensation value. | 01-03-2013 |
20130265411 | SYSTEM AND METHOD FOR INSPECTING SCRAPED SURFACE OF A WORKPIECE - A system for inspecting a scraped surface of a workpiece performs steps of: a) capturing an image of the scraped surface to obtain a original image section; b) removing high point regions whose areas are outside of a predetermined area range to obtain a base image; c) processing pixels of the base image using a first imaging mask to generate a judgment image; d) determining whether uniformity of the high point regions in the base image conforms a standard; e) determining whether a number of the high point regions in the base image falls within a predetermined number range; and f) evaluating whether or not a portion of the scraped surface conforms with the standard based on results of determinations made in steps d) and e). | 10-10-2013 |