Patent application number | Description | Published |
20090071837 | MASTER ELECTRODE AND METHOD OF FORMING IT - A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to at least one electrode current supply contact; said substrate comprising a top surface in contact with or arranged adjacent said first surface and having conducting material and/or structures of a conducting material arranged thereon, said substrate conducting material being electrically connected to at least one current supply contact; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conducting material and said electrode conducting material, said cells comprising an electrolyte; herein an electrode resistance between said electrode conducting material and said electrode current supply contact and a substrate resistance between said substrate conducting material and said substrate current supply contact are adapted for providing a predetermined current density in each electrochemical cell. | 03-19-2009 |
20090183992 | METHOD OF FORMING A MULTILAYER STRUCTURE - Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material ( | 07-23-2009 |
20090218233 | Method of Forming a Multilayer Structure - Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material ( | 09-03-2009 |
20090229854 | Electrode and method of forming the electrode - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier ( | 09-17-2009 |
20090229855 | ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier ( | 09-17-2009 |
20090229856 | Master Electrode and Method of Forming the Master Electrode - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier ( | 09-17-2009 |
20090229857 | ELECTRODE AND METHOD OF FORMING THE ELECTRODE - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier ( | 09-17-2009 |
20120305390 | ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material. | 12-06-2012 |
20140110265 | Electrode and Method of Forming the Master Electrode - An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material. | 04-24-2014 |