Pathi
Chandrakumar R. Pathi, San Jose, CA US
Patent application number | Description | Published |
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20120002573 | DATA SIGNAL TRANSCEIVER CIRCUITRY FOR PROVIDING SIMULTANEOUS BI-DIRECTIONAL COMMUNICATION VIA A COMMON CONDUCTOR PAIR - Interface circuitry and method for transmitting and receiving downstream and upstream data signals simultaneously via a common conductor pair. The composite signal containing the downstream and upstream data signal components being conveyed by the common conductor pair is isolated, e.g., via signal filtering or buffering, and combined with an appropriately scaled inverse replica of the outgoing upstream data signal to subtract out upstream data signal components and thereby provide the downstream data signal substantially free of any upstream data signal components. | 01-05-2012 |
20150188689 | DATA SIGNAL TRANSCEIVER CIRCUITRY FOR PROVIDING SIMULTANEOUS BI-DIRECTIONAL COMMUNICATION VIA A COMMON CONDUCTOR PAIR - Interface circuitry and method for transmitting and receiving downstream and upstream data signals simultaneously via a common conductor pair. The composite signal containing the downstream and upstream data signal components being conveyed by the common conductor pair is isolated, e.g., via signal filtering or buffering, and combined with an appropriately scaled inverse replica of the outgoing upstream data signal to subtract out upstream data signal components and thereby provide the downstream data signal substantially free of any upstream data signal components. | 07-02-2015 |
Pragyansri Pathi, Portland, OR US
Patent application number | Description | Published |
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20140084370 | THREE-DIMENSIONAL GERMANIUM-BASED SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES - Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional germanium-containing body is disposed on a semiconductor release layer disposed on the insulating structure. The three-dimensional germanium-containing body includes a channel region and source/drain regions on either side of the channel region. The semiconductor release layer is under the source/drain regions but not under the channel region. The semiconductor release layer is composed of a semiconductor material different from the three-dimensional germanium-containing body. A gate electrode stack surrounds the channel region with a portion disposed on the insulating structure and laterally adjacent to the semiconductor release layer. | 03-27-2014 |
20150255280 | THREE-DIMENSIONAL GERMANIUM-BASED SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES - Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional germanium-containing body is disposed on a semiconductor release layer disposed on the insulating structure. The three-dimensional germanium-containing body includes a channel region and source/drain regions on either side of the channel region. The semiconductor release layer is under the source/drain regions but not under the channel region. The semiconductor release layer is composed of a semiconductor material different from the three-dimensional germanium-containing body. A gate electrode stack surrounds the channel region with a portion disposed on the insulating structure and laterally adjacent to the semiconductor release layer. | 09-10-2015 |
Srinivas Laxminarayan Pathi, Karnataka IN
Patent application number | Description | Published |
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20090187020 | Process And Intermediate For Preparation Of Donepezil - The invention relates to new compounds of formula (III): | 07-23-2009 |
20090326028 | Process for the preparation of temozolomide and analogs - A process for the preparation of compounds of formula IA, where R═CH | 12-31-2009 |
20100081688 | Process for the preparation of montelukast, and intermediates therefor - The invention relates to processes for making montelukast and to intermediates for use in the process, in particular compounds of formulas 2-7: L=OAc, OTs, OTf5OMs; where X=Cl, Br, I. | 04-01-2010 |
20100160643 | Process for Preparing Trityl Olmesartan Medoxomil and Olmesartan Medoxomil - A process for the preparation of trityl olmesartan comprising (a) condensing 4-(1-hydroxy-1-methylethyl)-2-propyl-imidazol-5-carboxylic acid alkyl ester with trityl biphenyl bromide in the presence of a polar aprotic solvent and a base selected from the group consisting of alkali metal carbonates, alkali metal hydroxides, alkali metal alkoxides, and tertiary amines to obtain a compound of formula V, | 06-24-2010 |
20130150588 | Salts and Polymorphs of Dexrabeprazole - The present invention provides dexrabeprazole magnesium hydrate and a process for its preparation. The present invention also provides a magnesium, calcium or potassium salt of dexrabeprazole, optionally in amorphous form, and processes for its preparation. | 06-13-2013 |
Srinivas Laxminarayan Pathi, Karnataka, Bangalore IN
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20150359898 | Pemetrexed Complexes and Pharmaceutical Compositions Containing Pemetrexed Complexes - A complex comprises pemetrexed and a coformer. A pharmaceutical composition comprises a complex of pemetrexed and a co-former and one or more pharmaceutically acceptable excipients. | 12-17-2015 |
Viraj Kumar Pathi, Secunderabad IN
Patent application number | Description | Published |
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20140292538 | INTELLIGENT COUPLER DEVICE FOR UTILITY METER AND METHOD FOR OPERATING THEREOF - An intelligent coupler device for utility meters comprising a communication module to maintain a two-way communication with its network gateway and other neighboring devices through respective communication channels; a control unit configured for processing and flow control of any communication events; an oscillator in connection with the control unit via interface to maintain the instruction clock; a memory unit for storing and processing the incoming and outgoing data; a Real Time Clock (RTC) in connection with control unit to fetch and/or set current date, time and the like; a primary power port configured for supplying power to all components. | 10-02-2014 |