Paek, KR
Chi Hyeon Paek, Gyeongsangbuk-Do KR
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20100321411 | APPARATUS AND METHOD FOR SCROLLING A SCREEN OF A PORTABLE TERMINAL HAVING A TOUCH SCREEN - Provided is a method of scrolling a screen of a portable terminal having a touch screen. The method includes outputting a scrollable image; checking an entire scrolling amount of the image; measuring a drag-related variation when a drag is generated; calculating a scrolling rate based on the measured drag-related event with respect to a preset value; and outputting an image at a position corresponding to the scrolling rate based on the entire scrolling amount when the drag is cancelled. | 12-23-2010 |
20120170807 | APPARATUS AND METHOD FOR EXTRACTING DIRECTION INFORMATION IMAGE IN A PORTABLE TERMINAL - Provided is an apparatus and method for extracting a direction of an image in a portable terminal without using a sensor for extracting direction information of a captured image. An apparatus for extracting direction information of an image in a portable terminal includes a camera unit and a control unit, wherein the control unit extracts a detection direction of an object from the captured image as direction information, and stores the captured image together with the extracted direction information for a subsequent display of the captured image in a normal direction. | 07-05-2012 |
20120265660 | APPARATUS FOR PROVIDING IMAGE SERVICE IN MOBILE TERMINAL, AND SYSTEM AND METHOD FOR PROVIDING AN IMAGE SERVICE - A system for providing an image service includes a Social Networking Service (SNS) server for requesting and collecting data from multiple service users connected through the internet; a map server for providing a regional map in association with a Global Positioning System (GPS); a portal server for providing a content search service; and an image server for managing objects provided from each server in association with the servers, and providing objects acquired from each server to a user terminal in association with each other upon receiving a data request from the user terminal. | 10-18-2012 |
Chi-Hyeon Paek, Gum-Si KR
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20140015839 | DEVICE AND METHOD FOR EXPRESSING STATUS OF TERMINAL USING CHARACTER - A status expression system and method operating the same are provided for presenting a state of the mobile phone by means of a character agent. A status expression system of the present invention includes a memory for storing a plurality of character quotients, information on at least one state transition model, and resources for presenting the character; a character controller for updating the character quotients according to events occurred in the mobile phone, determining a state by analyzing the character quotients and referring to the state transition model, and formatting the state using the resources assigned for the state of the character; and a display for presenting the character with the resources in the state. | 01-16-2014 |
Chin Wook Paek, Gunpo KR
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20150362347 | APPARATUS AND METHOD FOR COMPENSATING FOR POSITION ERROR OF RESOLVER - An apparatus and method are provided for compensating for a position error of a resolver that compensates for positions in the overall speed range using resolver position error measured at a specific speed by providing an angle tracking observer (ATO) for calculating angle information. The ATO compensates for the position errors in the overall speed range based on the position errors measured at the specific speed, to an inside of a resolver-digital converter. The method includes digitalizing detected position information of the motor rotor and receiving the digitalized position information from a resolver-digital converter to measure the position error. An electrical angular velocity of the position error is determined and the position error at the electrical angular velocity 0 is calculated and stored. The position error at a current electrical angular velocity is converted into and compensated for using the calculated position error based on the current electrical angular velocity. | 12-17-2015 |
Chong Kuk Paek, Goyang-Si KR
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20120026112 | IMAGE DISPLAY APPARATUS AND METHOD THEREOF - Provided are a stereographic image display apparatus and a manufacturing method thereof. The stereographic image display apparatus includes an image display unit and a touch sensing unit which is positioned on the image display unit and is configured to interpose a lens array between a first transparent electrode layer and a second transparent electrode layer. The manufacturing method of the stereographic image display apparatus includes: allowing a transparent conductive material to be deposited on both surfaces of a lens array; forming first and second transparent electrode layers by etching the transparent conductive material deposited on the both surfaces of the lens array thereby generating a touch sensing unit; and adhering the touch sensing unit to an upper surface of an image display unit. | 02-02-2012 |
20120026159 | ACTIVE TYPE DISPLAY APPARATUS AND DRIVING METHOD FOR PROVIDING STEREOGRAPHIC IMAGE - An active-type stereographic image display apparatus includes an image display unit; a touch sensing unit to sense a touch position through a first transparent electrode layer and a second transparent electrode layer that are arranged to cross with each other, and to separate an image output from the image display unit through a lens array into a first eye image and a second eye image based on a refractive index of light; and a lens driving control unit to control a focal length by controlling the lens array. The method for driving the active-type stereographic image includes displaying a stereographic image comprising a first eye image and a separate second eye image, sensing a touch position of a user input, separating an image output into a first eye image and a second eye image, and controlling a focal length provided by a lens array. | 02-02-2012 |
Ho-Jeong Paek, Uiwang-Si KR
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20090155717 | Photosensitive Resin Composition with Good Stripper-Resistance for Color Filter and Color Filter Formed Using the Same - The present invention relates to a photosensitive resin composition for a color filter, which has an excellent stripper-resistance and is developed by an alkali aqueous solution, and a color filter formed of the photosensitive resin composition. The photosensitive resin composition includes: (A) a carboxyl-containing acryl-based binder resin; (B) a double bond-containing acryl carboxylate resin represented by the following Formula 1; (C) an acryl-based photopolymerization monomer; (D) a photopolymerization initiator; (E) a pigment; and (F) a solvent. The photosensitive resin composition has excellent stripper resistance, and thus can be used when a color filter is fabricated on a TFT array substrate in order to ensure a high aperture ratio. | 06-18-2009 |
20130143158 | Photosensitive Resin Composition for Color Filter and Color Filter Including the Same - Disclosed is a photosensitive resin composition for a color filter that includes (A) an acrylic-based copolymer including a structural unit represented by the following Chemical Formula 1, wherein R | 06-06-2013 |
20150065598 | Black Photosensitive Resin Composition and Light-Blocking Layer Using the Same - A black photosensitive resin composition includes (A) pigment dispersion including at least two kinds of carbon black having different oil absorption from each other; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent. A light-blocking layer can be formed using the same. | 03-05-2015 |
20150147700 | Black Photosensitive Resin Composition and Light Blocking Layer Using the Same - Disclosed are a black photosensitive resin composition including (A) a binder resin; (B) a colorant including a pigment and a silica nanoparticle; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein the silica nanoparticle is included in an amount of about 1 part by weight to about 11 parts by weight based on about 100 parts by weight of the pigment, and a light blocking layer and a color filter using the same. | 05-28-2015 |
Hoon Paek, Seongnam-Si KR
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20120167126 | SLAVE DISPLAY DEVICE, SET-TOP BOX, AND DIGITAL CONTENTS CONTROL SYSTEM - A digital contents control system includes: a set-top box which generates a video for a master display device and a video for a slave display device with a received broadcasting signal and sends the generated videos to the master display device and the slave display device, respectively; the master display device for receiving the video generated for the master display device from the set-top box and displaying the received video; and the slave display device for receiving the video generated for the slave display device from the set-top box, displaying the received video and providing a control video area for control of the master display device or the slave display device to a separate display area, wherein, when a control instruction is input through the control video area provided in the slave display device, the input control instruction is sent to the set-top box and the set-top box controls the video for the master display device or the slave display device according to the input control instruction. | 06-28-2012 |
20150074110 | PLATFORM SYSTEM FOR OBJECT TAGGING AND METHOD THEREOF - The present invention relates to a platform system for object tagging and a method thereof. According to the platform system for object tagging of the present invention, since a user can add information in person, which he/she has about an individual object in contents provided by a website, into the contents of the website, as tag information, it is possible to enable an individual user to accurately, freely, and conveniently express information about an object in contents and to enable a plurality of users to actively create information and share more information by providing more users with information. | 03-12-2015 |
Ho-Sun Paek, Yongin-Si KR
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20090181484 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor light emitting device having a nano pattern and a method of manufacturing the semiconductor light emitting device. The semiconductor light emitting device includes: a semiconductor layer comprising a plurality of nano patterns, wherein the plurality of nano patterns are formed inside the semiconductor layer; and an active layer formed on the semiconductor layer. The optical output efficiency is increased and inner defects of the semiconductor light emitting device are reduced. | 07-16-2009 |
Hyun Paek, Gyeonggi-Do KR
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20130069722 | MULTI-BAND AMPLIFIER AND METHOD OF AMPLIFYING MULTI-BAND - Provided is a multi-band amplifier and a method of amplifying a multi-band. The multi-band amplifier includes a wireless signal input terminal into which a first frequency band signal and a second frequency band signal are input, a first impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a first frequency band, a second impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a second frequency band, a common source amplifier to which the first impedance matching part and the second impedance matching part, and a common gate amplifier connected to the common source amplifier. Accordingly, performance degradation can be reduced in comparison with a conventional amplifier, broadband amplification as well as narrow band amplification can be performed, and an amplification gain can be adjusted. | 03-21-2013 |
20130127575 | TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a transformer and a method of manufacturing the same. The transformer includes: a primary side winding having a loop shape; a secondary side winding formed on the same plane as that of the primary side winding in a remaining section except for at least a section at which it intersects with the primary side winding and having the same loop shape as that of the primary side winding so as to be electromagnetically coupled to the primary side winding; and an intersecting section formed so that the primary side and secondary side windings having the sum of the turn numbers of 3 or more intersect with each other in a two-layer structure, wherein the intersecting section includes at least one point of intermediate node having one side connected in a first layer and the other side connected in a second layer. | 05-23-2013 |
20140167823 | POWER ON RESET (POR) CIRCUIT - Disclosed herein is a power on reset (POR) circuit, including: a current mirror circuit adjusting ratio of current flowing in a circuit according to voltage supplied from power; an inverter driven according to output of the current mirror circuit to output a POR signal; a brown out detection (BOD) comparator electrically connected to the current mirror circuit and comparing the voltage supplied from the power with reference voltage to output a corresponding voltage signal according to the comparison result; a BOD controlling switch driven when the output of the BOD comparator is zero voltage (0V) to again operate a POR; and a current controlling switch installed in the current mirror circuit and driven when the output of the BOD comparator is zero voltage (0V) to control and supply current of the POR. | 06-19-2014 |
Hyun Paek, Suwon, Gyunggi-Do KR
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20140176031 | BACK ELECTROMOTIVE FORCE DETECTION CIRCUIT AND MOTOR DRIVING CONTROL APPARATUS USING THE SAME - There are provided a back electromotive force detection circuit and a motor driving control apparatus using the same. The back electromotive force detection circuit includes a duty determining unit and a delay compensation unit. The duty determining unit outputs a differential level according to a duty of a driving control signal of a motor. The delay compensation unit performs delay compensation differently on each differential level to compensate for a delay in back electromotive force of the motor regardless of a variation in a duty of the driving control signal. | 06-26-2014 |
In Chan Paek, Incheon KR
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20090305197 | Apparatus and System For Simulating of Shooting a Grenade Launcher - A grenade launcher simulation apparatus and a grenade launcher simulation system are provided. The grenade launcher simulation system includes a grenade launcher simulation apparatus, a central control device, and at least one or more personal sensing terminals. When shooting information according to shooting of the grenade launcher simulation apparatus is received, the personal sensing terminal to which the personal sensing terminal is registered transmits impact point location information to the central control device or the personal sensing terminal. The central control device transmits the received impact point location information to other personal sensing terminals, and the personal sensing terminals that receive the impact point location information personal sensing terminal compare location information of the personal sensing terminals with the impact point location information to generate damage information and transmit the damage information to the central control device or the personal sensing terminal to which the grenade launcher simulation apparatus is registered. The personal sensing terminal that receives the damage information displays shooting location and damage location of the personal sensing terminal and damage location on a display unit. Accordingly, it is possible to simulate an actual grenade launcher by using a wireless communication network. | 12-10-2009 |
20100273131 | LASER TRANSMITTER FOR SIMULATING A FIRE WEAPON AND MANUFACTURING METHOD THEREOF - The present invention relates to a laser transmitter for simulation training, which is mounted on a firearm. The laser transmitter for simulation training includes an infrared laser diode | 10-28-2010 |
In-Hyuk Paek, Incheon KR
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20110311573 | Method for Preparing Recombinant Antigen Complex Using Rotavirus Nanoparticle - Disclosed are a construct for expressing a rotavirus antigen complex loaded with a heterologous virus epitope, a vaccine composition containing the rotavirus antigen complex, a virus-like particle of rotavirus containing the rotavirus antigen complex, and a vaccine composition containing the virus-like particle of rotavirus. According to the present disclosure, an antigen complex containing a rotavirus antigen as well as a heterologous virus epitope and a virus-like particle of rotavirus containing the antigen complex can be produced in large scale at low cost. Thus, the present disclosure may be applied for research and development of novel complex vaccines for rotavirus and heterologous virus. | 12-22-2011 |
Jae-Seung Paek, Gyeonggi-Do KR
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20110256626 | METHOD FOR PRODUCING INDUCED PLURIPOTENT STEM CELLS WITH HIGH EFFICIENCY AND INDUCED POLURIPOTENT STEM CELLS PROUCED THEREBY - The present invention provides a method for producing customized pluripotent stem cells. Specifically, the present invention comprises following steps: extracting proteins from any of the dedifferentiated stem cells or induced pluripotent stem cells, the said dedifferentiated or pluripotent stem cells being prepared by any known method; introducing the protein extract into the adult somatic cells; and culturing the adult somatic cells to produce pluripotent stem cells having the same pluripotency as that of embryonic stem cells. In addition, pluripotent stem cells produced according to the present method and cell therapeutics comprising the same are provided. The method allows pluripotent stem cells to be produced very easily and at a significantly higher yield, compared to typical methods. | 10-20-2011 |
Jae-Seung Paek, Gunpo-Si KR
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20150361391 | METHOD FOR INDUCING TAILORED PLURIPOTENT STEM CELLS USING EXTRACT OF PLANT STEM CELLS OR PLANT DEDIFFERENTIATED STEM CELLS, AND PLURIPOTENT STEM CELLS PRODUCED BY MEANS OF THE METHOD - A method for inducing tailored pluripotent stem cells by reprogramming differentiated cells of an adult by using an extract of plant stem cells and plant dedifferentiated stem cells (callus); pluripotent stem cells produced by means of the method; and a cell therapy agent comprising the pluripotent stem cells are disclosed. It is possible to overcome ethical problems since eggs are not used in the making of pluripotent stem cells having abilities like embryonic stem cells. It is possible to produce pluripotent stem cells of ensured safety because a plant stem cell extract which above all has been verified to be harmless to the body is used. It is possible to develop an immunocompatible cell therapy agent tailored to different individuals. | 12-17-2015 |
Jang Woon Paek, Daegu KR
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20110126117 | REMOTE COMPUTER CONTROL DEVICE USING VEHICLE TERMINAL AND METHOD THEREOF - A remote computer control device that controls a remote computer, using a vehicle terminal, receives control information and a connection request including connection information from the terminal, and connects with the terminal on the basis of the connection information. Further, the remote computer control device controls the remote computer on the basis of the control information, and converts the control result to correspond to the size of the picture of the terminal and provides it to the terminal. | 05-26-2011 |
20120167071 | SOFTWARE UPDATE APPARATUS AND METHOD OF VEHICLE - A software update apparatus of a vehicle includes: a network unit configured to perform internal communications with a plurality of electronic control devices inside the vehicle; a near field communication (NFC) module configured to wirelessly access a mobile communication terminal; and a client control unit configured to manage software versions of the electronic control devices collected through the network unit, provide the software version information to the mobile communication terminal through the NFC module, download software requiring update, transmits the downloaded software to the electronic control devices through the network unit, and receive an update state to transmit to the mobile communication terminal. | 06-28-2012 |
20140136826 | METHOD AND APPARATUS FOR UPDATING BOOT LOADER - Disclosed is an apparatus and method for updating a boot loader of an embedded system for a vehicle, the method including receiving and storing an update file, checking validities of a primary boot program and a secondary boot program based on update information according to the update file, and sequentially executing updates of the primary boot program and the secondary boot program. Since the secondary boot program, which is a backup boot program, maintains an executable state all the times, even if an error occurs during a boot program update, the update is executed again by use of the secondary boot program, thereby securing the safety of an embedded system for a vehicle. | 05-15-2014 |
Ji-Seon Paek, Gyeonggi-Do KR
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20160065139 | METHOD AND APPARATUS FOR SUPPLYING POWER TO A RADIO FREQUENCY POWER AMPLIFIER - A method and a supply modulator (SM) are provided for supplying power from a wireless transmitter to a radio frequency (RF) power amplifier. A power control signal input from a modem is received. A reference voltage is determined. An operating mode of the SM is changed by controlling a level of the reference voltage. A voltage is determined based on the level of a reference voltage. When the operating mode of the SM is an ET mode, a first output signal from a linear regulator and a second output signal from a switching regulator are combined to obtain a combined result, and the combined result is output. The first output signal is based on the voltage. When the operating mode of the SM is an APT mode, the voltage based on the reference voltage is output. | 03-03-2016 |
20160065142 | PARALLEL COMBINED OUTPUT LINEAR AMPLIFIER AND OPERATING METHOD THEREOF - A parallel output linear amplifier is provided that includes a transconductance amplifier configured to receive an analog input signal from an input terminal and amplify the analog input signal. The parallel output linear amplifier also includes a first pre-amplifier connected to the transconductance amplifier and operated using a floating drive voltage, and a cascode class AB amplifier connected to the first pre-amplifier and configured to provide an amplified signal to an output terminal. The parallel output linear amplifier further includes a second pre-amplifier configured connected to the transconductance amplifier and operated using the floating drive voltage, and a cascade class AB amplifier connected to the second pre-amplifier and configured to provide an amplified signal to the output terminal. | 03-03-2016 |
Jong-Hyub Paek, Anjung KR
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20150175574 | Ligands And Their Preparation - The present invention relates to secondary amines suitable for the preparation of ligands for organometallic complexes, their preparation and their use. | 06-25-2015 |
Jongsik Paek, Incheon KR
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20150021764 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS - A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface. | 01-22-2015 |
Jong Sik Paek, Gyeonggi-Do KR
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20140124949 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided are a semiconductor device and a method of manufacturing the same. The method may, for example, comprise forming an interposer on a dummy substrate; forming a conductive pillar on the interposer; contacting the top of the interposer with at least one semiconductor die; encapsulating the conductive pillar and the at least one semiconductor die with an encapsulant; forming a redistribution layer that is electrically connected to the conductive pillar, on the semiconductor die; removing the dummy substrate from the interposer; attaching the interposer, which has the at least one semiconductor die in contact, to a substrate and testing the at least one semiconductor die; and contacting a stacked semiconductor device with the redistribution layer. | 05-08-2014 |
20140131856 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer. | 05-15-2014 |
20140131886 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness. | 05-15-2014 |
20140138817 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer. | 05-22-2014 |
20150021791 | SEMICONDUCTOR DEVICE - Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die. | 01-22-2015 |
20150200179 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer. | 07-16-2015 |
Jong Sik Paek, Incheon KR
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20140284785 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Disclosed are a semiconductor device and a manufacturing method thereof, which can achieve miniaturization and improvement in the integration level by forming a substrate using a pattern layer implemented on a wafer in a semiconductor fabrication (FAB) process. In one exemplified embodiment, the manufacturing method of the semiconductor device includes preparing a first semiconductor die including a plurality of through electrodes and a plurality of first conductive pillars, mounting the first semiconductor die to connect the first conductive pillars to the pattern layer provided on a wafer, forming a first encapsulant to cover the pattern layer and the first semiconductor die, mounting a second semiconductor die to electrically connect second conductive pillars provided in the second semiconductor die to the plurality of through electrodes exposed to a second surface of the first semiconductor die, and removing the wafer from a first surface of the pattern layer. | 09-25-2014 |
20150014830 | SEMICONDUCTOR DEVICE UTILZING REDISTRIBUTION LAYERS TO COUPLE STACKED DIE - A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer. | 01-15-2015 |
20150021751 | SEMICONDUCTOR DEVICE WITH PLATED PILLARS AND LEADS - A semiconductor device with plated pillars and leads is disclosed and may include a semiconductor die comprising a conductive pillar, a conductive lead electrically coupled to the conductive pillar, a metal plating layer covering the conductive lead and conductive pillar, and an encapsulant material encapsulating the semiconductor die and at least a portion of the plating layer. The pillar, lead, and plating layer may comprise copper, for example. The plating layer may fill a gap between the pillar and the lead. A portion of the metal plating layer may, for example, comprise an external lead. The metal plating layer may cover a side surface of the pillar and a top surface, side surface, and at least a portion of a bottom surface of the lead. The metal plating layer may cover side and bottom surfaces of the pillar and top, side, and at least a portion of bottom surfaces of the conductive lead. | 01-22-2015 |
20150021767 | SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLING - A semiconductor device with plated conductive pillar coupling is disclosed and may include a semiconductor die comprising a conductive pillar formed on a bond pad on the die, a substrate comprising an insulating layer with conductive patterns formed on a first surface of the substrate and a second surface opposite to the first surface, and a plating layer electrically coupling the conductive pillar and the bond pad on the first surface of the die to the conductive pattern on the first surface of the substrate. The conductive pillar, the conductive patterns, and the plating layer may comprise copper. The plating layer may fill a void between the copper pillar and the conductive pattern on the first surface of the substrate. The substrate may comprise a rigid circuit board, a flexible circuit board, a ceramic substrate, a semiconductor die, or semiconductor wafer. | 01-22-2015 |
20150041980 | Semiconductor Package with Reduced Thickness - A method for forming a reduced thickness semiconductor package is disclosed and may include providing a first die with an active layer, a through-silicon via (TSV), and a pattern and an under bump metal (UBM) in a dielectric layer on the active layer. A carrier may be bonded to the dielectric layer and the UBM. The first die may be thinned to expose the TSV. A bump pad may be formed on the exposed TSV and a second die may be bonded to the bump pad. The first die, the second die, and an outer surface of the dielectric layer may be encapsulated utilizing a first encapsulant. The carrier may be removed from the dielectric layer and the UBM, and a solder ball may be formed on the UBM. A groove may be formed through the dielectric layer and into the first die. | 02-12-2015 |
20150049421 | ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FABRICATING THE SAME - In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad. | 02-19-2015 |
20150206807 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly. | 07-23-2015 |
20150221573 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate. | 08-06-2015 |
20150221586 | SEMICONDUCTOR DEVICE WITH REDUCED THICKNESS - A semiconductor device with reduced thickness is disclosed and may include forming a back end of line (BEOL) comprising a redistribution layer on a dummy substrate. A first semiconductor die may be bonded to a first surface of the BEOL and a second semiconductor die may be bonded to the first semiconductor die. The first and second semiconductor dies may be electrically coupled to the BEOL. The first and second semiconductor dies and the BEOL may be encapsulated utilizing a first encapsulant. The dummy substrate may be removed thereby exposing a second surface of the BEOL opposite to the first surface. A solder ball may be placed on the exposed second surface of the BEOL. The second semiconductor may be stacked stepwise on the first semiconductor and may be flip-chip bonded. The semiconductor dies may be electrically coupled to the BEOL utilizing a lateral plating layer or conductive wires. | 08-06-2015 |
20150262945 | Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die - A method for a semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include bonding a first semiconductor die to a second semiconductor die, the first semiconductor die having a first surface comprising bond pads, a second surface opposite the first surface that is bonded to a first surface of the second semiconductor die, and sloped sides surfaces between the first and second surfaces of the first semiconductor die, such that a cross-section of the first semiconductor die is trapezoidal in shape. A passivation layer may be formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die. A redistribution layer may be formed on the passivation layer formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die. | 09-17-2015 |
Jong Sik Paek, Seongnam-Si KR
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20150255422 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer. | 09-10-2015 |
Jongwon Paek, Suwon KR
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20090055912 | USER AUTHENTICATION SYSTEM USING IP ADDRESS AND METHOD THEREOF - A method for authenticating a user by IP address check includes: receiving a URL and a session cookie from a client; determining whether or not an IP address of the client has been changed based on the session cookie; resetting the session cookie, if the IP address has been changed, by adding the changed IP address as a temporary IP address thereto; determining whether or not the URL is required to perform IP address check; requesting a re-login to the client if it is determined that the URL is required to perform IP address check; and adding the temporary IP address to a valid IP address list for the user if the re-login is successful. | 02-26-2009 |
Jong Won Paek, Seongnam-Si KR
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20150067772 | APPARATUS, METHOD AND COMPUTER-READABLE STORAGE MEDIUM FOR PROVIDING NOTIFICATION OF LOGIN FROM NEW DEVICE - An apparatus for providing a notification of a login to a user account from a device includes an information analysis unit for determining whether the device is a new device, in response to a login request received from the device, and a login notification unit for providing a notification of a login from the new device using a preset notification method, based on results of determination by the information analysis unit. A login notification is provided when a user logs in via a new device other than devices usually used thereby, thus allowing the user to promptly cope with an illegal login so that the illegal use of the user's account can be prevented if an illegal login is performed. | 03-05-2015 |
Jong-Won Paek, Gyeonggi-Do KR
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20090259839 | SECURITY AUTHENTICATION SYSTEM AND METHOD - Authentication system and method are provided. The authentication system includes: a server configured to provide at least two security levels and configured to transmit one of at least two security modules corresponding to the security level of a user terminal, via communications network, to the user terminal based, at least in part, upon an environment of the user terminal; and an authentication server communicatively linked with the server and configured to perform a user authentication in response to a user authentication request from the user terminal. Accordingly, various hackings can be prevented and the user authentication can be accomplished with user's convenience and security. | 10-15-2009 |
Kang-Min Paek, Hwaseong-Si KR
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20140000661 | SINGLE TYPE APPARATUS FOR DRYING A SUBSTRATE AND SINGLE TYPE SYSTEM FOR CLEANING A SUBSTRATE INCLUDING THE SAME | 01-02-2014 |
Ki Ho Paek, Chungcheongbuk-Do KR
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20110090031 | MOLDED CASE CIRCUIT BREAKER HAVING INSTANTANEOUS TRIP MECHANISM - Disclosed is a molded case circuit breaker having an instantaneous trip mechanism capable of instantaneously breaking a circuit upon occurrence of a fault current, the circuit breaker comprising: a main circuit unit present in a lower compartment of the molded case circuit breaker, and configured to open or close a circuit by having a stationary contactor and a movable contactor rotatable to contact with or separated from the stationary contactor; a switching mechanism present in an upper compartment of the molded case circuit breaker, and having an open position where the switching mechanism is connected to the main circuit unit to drive the main circuit unit to open a circuit, and a closing position where the switching mechanism drives the main circuit unit to close a circuit; an instantaneous trip mechanism present in the upper compartment, and operating by an electromagnetic attraction in response to generation of a fault current on a circuit so as to trigger the switching mechanism to the open position; and an intermediate insulation barrier installed between the upper compartment and the lower compartment for electrical insulation by partitioning the lower compartment having the main circuit unit and the upper compartment having the instantaneous trip mechanism and the switching mechanism. | 04-21-2011 |
Ki Hyun Paek, Goyang-Si KR
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20150081460 | METHOD AND SYSTEM FOR INTEGRATING AUTHENTICATION AND APPROVAL USING ONE BUTTON DIFFERENT BARCODE - The present invention relates to a system and method for one button-based heterogeneous barcode integration authentication/approval which is capable of providing a one-button integration authentication/approval service for a heterogeneous barcode with existing barcode authentication affiliated stores infrastructures utilized as they are, and exchanging barcodes of existing gift certificates, coupons, pre-paid cards, credit cards, etc. possessed by a user for heterogeneous barcodes through a gateway operator server. | 03-19-2015 |
Kmm Ki Paek, Cheongju-Si KR
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20150149665 | POLLING METHOD OF COMMUNICATION SYSTEM - The present disclosure relates to a polling method of communication system configured to reduce a polling time by receiving responses from a plurality of auxiliary devices using one time of response request signal by a main device during polling, the method including, requesting, by a main device, transmission of response request signals from a plurality of auxiliary devices connected to the main device (request step), | 05-28-2015 |
Seung Hak Paek, Yongin-Si KR
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20140078689 | CARD KEY FOR VEHICLE AND MAKING METHOD OF THE SAME - Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin. | 03-20-2014 |
Seung-Hak Paek, Seongnam-Si KR
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20100162048 | APPARATUS AND METHOD FOR AUTOMATIC SELF-DIAGNOSIS USING UNIVERSAL SERIAL BUS PORT IN DIGITAL EQUIPMENT - An apparatus and a method for automatically performing self-diagnosis are provided. In the method, when an external storage unit is connected, files stored in the external storage unit are searched for. When a diagnosis file for self diagnosis is stored in the external storage unit, information of at least one item required by the diagnosis file is collected. The collected information is stored as an output file in the external storage unit. | 06-24-2010 |
Seunghan Paek, Bucheon-Si KR
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20120293857 | Electrophoretic Display Apparatus and Method for Manufacturing the Same - Disclosed are an electrophoretic display device and a manufacturing method thereof, which can enhance display quality and manufacturing efficiency. The electrophoretic display device includes a plurality of partition walls, sealing materials, a display solvent, and a second substrate. The partition walls are formed at a first substrate, and respectively define a plurality of unit pixel regions. The sealing materials are formed on the partition walls. The display solvent includes a plurality of charged particles and a solvent, and is filled into the unit pixel regions. The second substrate is adhered to the sealing materials to seal the unit pixel regions. | 11-22-2012 |
Seung Han Paek, Gyeonggi-Do KR
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20120008190 | ELECTROPHORETIC DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electrophoretic display device includes a lower substrate having a plurality of pixel electrodes on the lower substrate, having a lower organic layer on the pixel electrodes and the lower substrate, and having partition walls formed on the lower organic layer to surround the pixel electrodes, the pixel electrodes and partition walls defining a plurality of sub-pixels; an upper substrate bonded with the lower substrate, the upper substrate having a common electrode formed thereon with an upper organic layer on the common electrode; and electrophoretic dispersion liquid comprising a plurality of charged particles colored to display colors, the electrophoretic dispersion liquid disposed in the plurality of the sub-pixels defined by the pixel electrodes and the partition walls. | 01-12-2012 |
20120008191 | ELECTROPHORETIC DISPLAY DEVICE AND METHOD OF FABRICATION THEREOF - Disclosed is an electrophoretic display (EPD) device and fabrication method thereof that has a simplified fabrication process and reduced fabrication costs. In the EPD device, a partition wall is formed directly on a first substrate having a pixel electrode and extended up a lateral surface of the partition wall to prevent dead areas in the pixel region, provide increased aperture ratio, and enhanced image quality. | 01-12-2012 |
20120013970 | ELECTROPHORETIC DISPLAY DEVICE AND FABRICATION METHOD THEREOF - An electrophoretic display device in which a barrier defining a unit pixel is directly formed on a first substrate and the unit pixel is filled with an electrophoretic material, and a fabrication method thereof are provided. A barrier surrounding a display area is formed on a non-display area and a sealant is filled between the barrier and a partition wall to facilitate an attachment of first and second substrates. | 01-19-2012 |
20120073116 | Method for Manufacturing Electrophoretic Display Device - A method for manufacturing an electrophoretic display device includes forming partition walls for defining a plurality of pixel regions on a lower substrate; filling charged particles into the plurality of pixel regions; filling a pixel solvent in the plurality of pixel regions having been filled with the charged particles; and attaching the lower substrate and an upper substrate to each other. | 03-29-2012 |
Seung Hun Paek, Seongnam-Si KR
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20100208919 | ELECTRET CONDENSER MICROPHONE FOR NOISE ISOLATION AND ELECTROSTATIC DISCHARGE PROTECTION - An electret condenser microphone reinforces electrostatic discharge protection and noise isolation by adding a series of components in the electret condenser microphone. It is possible to block TDMA noise by embodying an RC circuit using series resistors and a varistor having a capacitor component in an electret condenser microphone, and to provide ESD protection effect when testing air or contact ESD by mounting two transient voltage suppressor (TVS) diodes. It is possible to block RF noises in various frequency bands, and to reduce TDMA noise level when making a cal with a maximum power level, by applying an electret condenser microphone for ESD protection and noise isolation to a mobile communication terminal. Further, since the electret condenser microphone may use an internal analog ground, an artwork of a PCB substrate or isolations from other parts is possible. | 08-19-2010 |
Seung Hwan Paek, Chungcheongnam-Do KR
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20120070923 | FABRICATION METHOD OF ORGANIC ELECTROLUMINESCENCE DISPLAY HAVING A GETTER LAYER - Provided herein is a method of manufacturing an organic electroluminescence display device, including the steps of: forming a getter layer on a unit sealing substrate using a dry method; providing a device substrate including a device array formed thereon, the device array including a plurality of unit organic electroluminescence devices; attaching the device substrate to the unit sealing substrate such that the getter layer faces the device array, thus forming a module; and imparting fluidity to the getter layer such that the getter layer covers upper and lateral sides of the device array. The method is advantageous in that fluidity is imparted to the getter layer, so that the upper and lateral sides of the device array is covered by the getter layer, thereby greatly improving the moisture resistance of the organic electroluminescence device. | 03-22-2012 |
Seung-Hyuck Paek, Yongin-Si KR
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20120043939 | CHARGER AND DISCHARGER FOR SECONDARY BATTERY - A charger and discharger for a secondary battery includes a secondary battery coupled to an output stage of the charger and discharger, a first converter circuit including a first pulse voltage generator that outputs a first pulse voltage according to a first duty ratio, and a first inductor that outputs a first current in proportion to a value of an integral of the outputted first pulse voltage with respect to time to a positive electrode terminal of the secondary battery, a second converter circuit including a second pulse voltage generator that outputs a second pulse voltage according to a second duty ratio, and a second inductor that outputs a second current in proportion to a value of an integral of the outputted second pulse voltage with respect to time to a negative electrode terminal of the secondary battery, and first and second controllers controlling the duty ratios of the first and second pulse voltage generators, respectively. | 02-23-2012 |
Seung-Weon Paek, Yongin-Si KR
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20150137252 | LAYOUT DESIGN SYSTEM, LAYOUT DESIGN METHOD, AND SEMICONDUCTOR DEVICE FABRICATED BY USING THE SAME - A layout design system includes a processor; a storage unit configured to store a first unit design having a first area, wherein in the first unit design, a termination is not placed on a border thereof; and a design module configured to generate a second unit design having a second area larger than the first area by placing the termination on a border of the first unit. | 05-21-2015 |
Seungwoo Paek, Yongin-Si KR
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20150235939 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES - Three-dimensional (3D) semiconductor devices are provided. The 3D semiconductor device includes a plurality of dummy pillars penetrating each cell pad of an electrode structure and the electrode structure disposed under each cell pad. Insulating patterns of a mold stack structure for formation of the electrode structure may be supported by the plurality of dummy pillars, so transformation and contact of the insulating patterns may be minimized or prevented. | 08-20-2015 |
20160027795 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a substrate, a stack structure, peripheral gate structures and residual spacers. The substrate includes a cell array region and a peripheral circuit region. The stack structure is disposed on the cell array region, having electrodes and insulating layers alternately stacked. The peripheral gate structures are disposed on the peripheral circuit region, being spaced apart from each other in one direction and having a peripheral gate pattern disposed on the substrate, and a peripheral gate spacer disposed on a sidewall of the peripheral gate pattern. The residual spacers are disposed on sidewalls of the peripheral gate structures, having a sacrificial pattern and an insulating pattern that are stacked. The insulating pattern includes substantially the same material as the insulating layers of the stack structure. | 01-28-2016 |
Seung-Woo Paek, Yongin-Si KR
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20130175663 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes linear patterns disposed between isolation trenches extending in a first direction in a semiconductor device and having a first crystal direction the same as the semiconductor substrate. A bridge pattern connects at least two adjacent linear patterns and includes a semiconductor material having a second crystal direction different from the first crystal direction. A first isolation layer pattern is disposed in at least one of the isolation trenches in a field region of the semiconductor substrate. Memory cells are disposed on at least one of the linear patterns. | 07-11-2013 |
20130256781 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - In a method of manufacturing a semiconductor device, a dielectric layer structure and a control gate layer can be formed sequentially on a substrate. The control gate layer can be partially etched to form a plurality of control gates. A gate spacer and a sacrificial spacer sequentially can be stacked on a sidewall of the control gate and on a portion of the dielectric layer structure. The dielectric layer structure can be partially etched using the sacrificial spacer and the gate spacer as an etching mask to form a plurality of dielectric layer structure patterns. The sacrificial spacer can be removed. An insulating interlayer can be formed on the substrate to form an air gap. The insulating interlayer can cover the dielectric layer structure pattern, the gate spacer and the control gate. The air gap can extend between the adjacent gate spacers and between the adjacent dielectric layer structure patterns. | 10-03-2013 |
20140284695 | VERTICAL CELL-TYPE SEMICONDUCTOR DEVICE HAVING PROTECTIVE PATTERN - According to example embodiments of inventive concepts, a semiconductor device includes: a substrate, and a stacked structure including interlayer insulating layers and gate electrodes alternately stacked on the substrate. The stacked structure defines a through-hole over the substrate. The gate electrodes each include a first portion between the through-hole and a second portion of the gate electrodes. A channel pattern may be in the through-hole. A tunneling layer may surround the channel pattern. A charge trap layer may surround the tunneling layer, and protective patterns may surround the first portions of the gate electrodes. The protective patterns may be between the first portions of the gate electrodes and the charge trap layer. | 09-25-2014 |
Se Yong Paek, Gumi-Si KR
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20140063407 | LIQUID CRYSTAL PANEL AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A liquid crystal panel and a liquid crystal display device using the same are disclosed, in which an alignment layer the same as that of a display area is formed in a light-transmitting portion of a non-display area, the light-transmitting portion being provided with a through hole. The liquid crystal panel comprises a color filter substrate; a driving device array substrate; a seal surrounding the outside of the light-transmitting portion and the display area; and a liquid crystal injected into the display area and the light-transmitting portion, which are surrounded by the seal, in a state that the driving device array substrate and the color filter array substrate are bonded to each other by the seal. | 03-06-2014 |
Soo-Jin Paek, Gyeonggi-Do KR
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20110193214 | SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT SPREADING PERFORMANCE - A semiconductor package having a structure in which heat produced in the interior of the package is effectively spread to the outside of the package is provided. The semiconductor package includes one or more semiconductor chips, one or more substrates (PCBs) having the semiconductor chips respectively attached thereto, a plurality of conductive balls such as a plurality of solder balls to provide voltages and signals to the one or more semiconductor chips, and a heat sink positioned to spread heat produced in the interior of the package to the outside and directly connected to at least one of the plurality of solder balls. | 08-11-2011 |
Sung-Kwan Paek, Changwon-City KR
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20110079887 | LEAD FRAME AND METHOD OF MANUFACTURING THE SAME - A lead frame having improved connectivity with a molded portion and a method of manufacturing the lead frame are provided. The lead frame includes a die pad on which a semiconductor chip is to be disposed; at least one lead portion arranged to be connected to the semiconductor chip; and at least one plating layer formed on at least one of the at least one lead portion and the die pad, wherein a top surface of the at least one plating layer has an uneven portion having a first average surface roughness. | 04-07-2011 |
20120175758 | LEAD FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A lead frame and a semiconductor package including the lead frame are provided. The lead frame includes: a base material; a first metal layer which is formed on at least one side of the base material, of which a surface is roughly formed, and which includes copper or nickel; a second metal layer which is formed on a surface of the first metal layer, of which a surface is roughly formed, and which includes palladium or a palladium alloy; a third metal layer which is formed on a surface of the second metal layer, of which a surface is roughly formed, and which includes gold or a gold alloy; and a fourth metal layer which is formed on a surface of the third metal layer, of which a surface is roughly formed, and which includes metal that includes silver. | 07-12-2012 |
20140319666 | LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THE SAME - The present invention provides a lead frame having excellent solder wettability and solderability, that is well-bonded to a copper wire, and manufactured with low cost, and a semiconductor package manufactured by using the same. The lead frame includes: a base material; a first metal layer formed on at least one surface of the base material, the first metal layer comprising nickel; a second metal layer formed on a surface of the first metal layer, the second metal layer comprising palladium; and a third metal layer formed on a surface of the second metal layer, the third metal layer comprising silver. | 10-30-2014 |
Woon-Jung Paek, Yongin-Si KR
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20090026928 | PHENYLPHENOXAZINE OR PHENYLPHENOTHIAZINE- BASED COMPOUND AND ORGANIC ELECTROLUMINESCENT DEVICE USING THE SAME - Provided are a phenylphenoxazine- or phenylphenothiazine-based compound and an organic electroluminescent device using the same. The phenylphenoxazine- or phenylphenothiazine-based compound is easily prepared, easily dissolved, and has excellent hole injection properties and excellent thermal stability. Accordingly, the compound is suitable for an organic layer of the organic electroluminescent device, specifically, a hole injection layer or a hole transport layer. In addition, the compound is suitable for an organic pigment or an electronic material, such as a nonlinear optical material. | 01-29-2009 |
20090026930 | Aromatic compound, organic light-emitting diode including organic layer including the aromatic compound, and method of manufacturing the organic light-emitting diode - An aromatic compound represented by Formula 1 below and an organic light-emitting diode including the same: | 01-29-2009 |
20090098397 | Indene derivative compound and organic light emitting device comprising the same - Provided are an indene derivative compound represented by Formula 1 below and an organic light emitting device including the same: | 04-16-2009 |
20090149649 | Aromatic hetrocyclic compound, organic light-emitting diode including organic layer comprising the aromatic hetrocyclic compound, and method of manufacturing the organic light-emitting diode - The present invention provides an aromatic heterocyclic compound represented by Formula 1 below, an organic light-emitting diode including an organic layer comprising the aromatic heterocyclic compound, and a method of manufacturing the organic light-emitting diode: | 06-11-2009 |
Woon-Jung Paek, Hwaseong-Si KR
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20150155561 | ANODE AND LITHIUM BATTERY INCLUDING THE SAME - An anode including a current collector; an anode active material layer disposed on the current collector, and a lithium-containing organic compound disposed on a surface of the anode active material layer | 06-04-2015 |
Woon-Jung Paek, Busan KR
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20130112915 | COMPOSITE CATHODE ACTIVE MATERIAL, CATHODE AND LITHIUM BATTERY THAT INCLUDE THE COMPOSITE CATHODE ACTIVE MATERIAL, AND METHOD OF PREPARING THE COMPOSITE CATHODE ACTIVE MATERIAL - A composite cathode active material, a cathode and a lithium battery that include the composite cathode active material, and a method of preparing the composite cathode active material, the composite cathode active material including a compound having an olivine crystal structure; and an inorganic material, the inorganic material including at least one selected from the group of a metal carbonitride and a carbonitride. | 05-09-2013 |
Young-Cheon Paek, Goyang-Si KR
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20120092368 | APPARATUS AND METHOD FOR PROVIDING AUGMENTED REALITY (AR) INFORMATION - Provided are a server, a terminal, and a method of providing Augmented Reality (AR) using a mobile tag in the terminal which is accessible to the server through a wired/wireless communication network. The method includes writing content in response to a tag creation request to create a tag; setting location information of the tag; setting, if the tag is a mobile tag, the location information of the mobile tag to a variable state and setting movement information of the mobile tag; and transmitting information about the mobile tag including the content, the location information, and the movement setting information of the mobile tag to the server, and requesting the server to register the mobile tag. | 04-19-2012 |
Yun-Ju Paek, Busan KR
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20090213008 | Multiple RF receiver and locating method using the same - A multiple RF receiver and locating method using the same have developed. The multiple RF receiver includes: a clock generator for generating a clock according to multiple RF receiving modules included in a multiple RF receiving unit; a phase distributor for dividing the clock into clocks having different phases, and providing the clocks to the multiple RF receiving unit as clock sources; the multiple RF receiving unit for generating SFD (Start of Frame Delimiter) signals by using the phases of the clocks provided as the clock sources; and a time measuring unit for measuring the SFD signals for use as data for location measurement. | 08-27-2009 |