Patent application number | Description | Published |
20100076516 | REMAINING TIME INDICATION FOR A RECHARGEABLE IMPLANTABLE MEDICAL DEVICE - An implantable medical device for delivering a therapeutic output to a patient, comprising: a rechargeable electrical power source having a useful life; a therapeutic delivery device operatively coupled to the power source and adapted to deliver the therapeutic output to the patient; a power source recharge timing indicator operatively coupled to the power source, wherein the timing indicator includes means for determining and communicating when the remaining usage time before full drainage of the power source drops below a first predetermined level based on measurement of one or more physical characteristics of the power source and of the medical device; and safe mode means operatively coupled to the timing indicator, power source and therapeutic delivery device, wherein the safe mode means, upon activation, is capable of causing one or more actions to reduce the power consumption of the medical device; wherein the safe mode means is activated by receiving communications from the timing indicator that the remaining usage time before full drainage of the power source has dropped below one or more second predetermined levels, thereby preventing excessive power drainage from the power source which would result in damage to the power source and/or medical device and/or injury to the patient. A method for preventing excessive power drainage and indicating the remaining discharge time of the power source of an implantable medical device for delivering a therapeutic output to a patient, which would result in damage to the power source and/or medical device and/or injury to the patient is also disclosed. | 03-25-2010 |
20100152747 | INSERTION SYSTEM AND LEAD FOR TREATMENT OF A TARGET TISSUE REGION - The present disclosure provides for systems and methods enabling the insertion of leads (as used e.g., in a framework of the brain treatment therapies) through a target anatomy for conforming with a target tissue region. An exemplary lead includes at least a partially curved portion for conforming with a geometry defined by the target tissue region. In an exemplary embodiment, the system relates to stimulating targets in the brain for improved post-operative steering of an applied electric field. The leads can be either pre-curved or put under transversal mechanical strain during insertion such that a certain curved curvature of the insertion trajectory is achieved. The system includes at least a first insertion tool removably engaged with respect to the lead for guiding and providing mechanical support to the lead during insertion. | 06-17-2010 |
20110069459 | SUBSTRATE LAYER ADAPTED TO CARRY SENSORS, ACTUATORS OR ELECTRICAL COMPONENTS - This invention relates to a substrate layer structure adapted to carry electronic device, or components, or electro-mechanical, or electro-chemical sensors, or a combination thereof, and adapted to be attached to a surface of a human or animal body or biological species. The surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry-formed by one or more slits, but this geometry being selected such that the stretchability of the substrate layer structure becomes adapted to the geometry of the body surface under it. | 03-24-2011 |
20110213584 | Calibration of Lithographic Apparatus - System parameters are checked through self-assessment of a production wafer without a reference or a monitor wafer. In particular, exposure errors and substrate table positioning errors can be corrected for. | 09-01-2011 |
Patent application number | Description | Published |
20110205510 | Method and Apparatus for Controlling a Lithographic Apparatus - A lithographic exposure process is performed on a substrate using a scanner. The scanner comprises several subsystems. There are errors in the overlay arising from the subsystems during the exposure. The overlay errors are measured using a scatterometer to obtain overlay measurements. Modeling is performed to separately determine from the overlay measurements different subsets of estimated model parameters, for example field distortion model parameters, scan/step direction model parameters and position/deformation model parameters. Each subset is related to overlay errors arising from a corresponding specific subsystem of the lithographic apparatus. Finally, the exposure is controlled in the scanner by controlling a specific subsystem of the scanner using its corresponding subset of estimated model parameters. This results in a product wafer being exposed with a well controlled overlay. | 08-25-2011 |
20110205511 | Lithographic Apparatus and Device Manufacturing Method - A method controls scanning function of a lithographic apparatus. A monitor wafer is exposed to determine baseline control parameters pertaining to the scanning function. The baseline control parameters are retrieved from the monitor wafer. Parameter drift is determined from the baseline control parameters. Compensation is performed based on the determination. A different parameterization is used for control of the scanning control module than for communication between the scanning control module and the lithographic apparatus. | 08-25-2011 |
20110205513 | Lithographic Apparatus and Device Manufacturing Method - A method produces at least one monitor wafer for a lithographic apparatus. The monitor wafer is for use in combination with a scanning control module to periodically retrieve measurements defining a baseline from the monitor wafer thereby determining parameter drift from the baseline. In doing this, allowance and/or correction can be to be made for the drift. The baseline is determined by initially exposing the monitor wafer(s) using the lithographic apparatus, such that the initial exposure is performed while using non-standard alignment model settings optimized for accuracy, such as those used for testing the apparatus. An associated lithographic apparatus is also disclosed. | 08-25-2011 |
20110205515 | Calibration of Lithographic Apparatus - System parameters are checked through self-assessment of a production wafer without using a reference or a monitor wafer. In particular, the wafer is exposed at different orientations, the data from which provides for the calibration of system parameters. | 08-25-2011 |
20110205520 | Lithographic Apparatus and Device Manufacturing Method - A method produces at least one monitor wafer for a lithographic apparatus. The monitor wafer is for use in combination with a scanning control module to periodically retrieve measurements defining a baseline from the monitor wafer, thereby determining parameter drift from the baseline. In doing this, allowance and/or correction can be to be made for the drift. The baseline is determined by initially exposing the monitor wafer(s) using the lithographic apparatus to perform multiple exposure passes on each of the monitor wafer(s). An associated lithographic apparatus is also disclosed. | 08-25-2011 |
20110216293 | Lithographic Apparatus and Device Manufacturing Method - A method controls a scanning function of a lithographic apparatus. A first alignment strategy is used. A monitor wafer is exposed to determine baseline control parameters pertaining to the scanning function. The baseline control parameters are periodically retrieved from the monitor wafer. Parameter drift is determined from the baseline control parameters. Corrective action is taken based on the determination. A production wafer is exposed using a second alignment strategy, different to the first alignment strategy. The corrective action is modified so as to be substantially closer to the correction that would have been made had the second alignment strategy been used in exposing the monitor wafer. | 09-08-2011 |
20110216294 | Lithographic Apparatus, Device Manufacturing Method and Associated Data Processing Apparatus and Computer Program Product - A lithographic apparatus operates by moving a substrate and a patterning device relative to each other in a sequence of movements such that a pattern is applied at a successive portions on the substrate. Each portion of the substrate is patterned by a scanning operation in which the patterning device is scanned through the radiation beam while synchronously scanning the substrate through the patterned radiation beam so as to apply the pattern to the desired portion on the substrate. An intrafield correction is applied during each scanning operation so as to compensate for distortion effects which vary during the scanning operation. The intrafield correction includes corrective variations of one or more properties of the projection system, and optionally out-of-plane movements of the patterning device and/or substrate table. | 09-08-2011 |
20110273687 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - In a solid immersion lithography apparatus, the final element of the projection system is maintained at a distance of less than about 50 nm from the substrate by an actuator system. The final element may be formed as two parts, with a fluid, e.g. a liquid, confined between them. The actuator system may be controlled relative to a reference frame, which may be supported by a bearing. Backscatter detection can be used to determine if the distance between the final element and the substrate is too large. A cleaning device can clean the substrate between exposures. | 11-10-2011 |
20120008127 | Method Of Calibrating A Lithographic Apparatus, Device Manufacturing Method and Associated Data Processing Apparatus and Computer Program Product - A lithographic apparatus is calibrated by reference to a primary reference substrate. Using an apparatus which need not be the same as the one being calibrated, there is obtained an apparatus-specific fingerprint of the primary reference substrate. Using the same set-up there is then obtained an apparatus-specific fingerprint of a secondary reference substrate. The apparatus-specific fingerprint of the primary reference substrate is subtracted from the apparatus-specific fingerprint of the secondary reference substrate to obtain and store an apparatus-independent fingerprint of the secondary reference substrate. The secondary reference substrate and stored apparatus-independent fingerprint are subsequently used together in place of the primary reference substrate as a reference for the calibration of the lithographic apparatus to be calibrated. Initial set-up for a cluster of lithographic tools can be performed with less use of the costly primary reference substrate, and with less interruption to normal production. The initial set-up can be integrated with on-going monitoring and re-calibration of the apparatuses. | 01-12-2012 |