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Oppermann, DE
Christian Oppermann, Amberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20100283554 | CIRCUIT CONFIGURATION FOR ELIMINATING EMC INTERFERENCE - A circuit configuration is disclosed for eliminating EMC interference, and a device includes such a circuit configuration, where a damping member is connected to at least one supply line leading to the consumer or consumers. In at least one embodiment optimal elimination of EMC interference of the electrical consumer or consumers is ensured, and overloading the power supply grid is avoided. To this end, in at least one embodiment the damping member is connected in series with a current-limiting element and can be connected to the consumer in parallel. It is thus possible to compensate for the effect of the current-limiting element and short-circuit said element for the operating state by way of a switch, whereby the element does not cause any loss of power outside of the power circuits and nevertheless has a current-limiting, that is, grid-friendly, effect during the power-up and charging process. | 11-11-2010 |
| 20110001363 | SWITCHING DEVICE AND METHOD FOR OPERATING SAME - A method for operating a switching device and a device for use with the method are provided. In at least one embodiment, an energy storage medium provided for EMC considerations, in particular a capacitor, is energized in a controlled fashion through short-term activation of a switching element even after the respective connected user is turned off, the energy storage medium being thereby discharged. | 01-06-2011 |
Frank Oppermann, Goettingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100072125 | FILTER CARTRIDGE UNIT WITH ADHESIVE INTERCONNECTING FILTER CARTRIDGE AND END PLATES - A filter cartridge unit including a first end plate, at least one second end plate, and a filter cartridge that is arranged between the end plates. The filter cartridge is connected, in a form-fitting and fluid-tight manner, to its adjacent end plates in a circumferential subarea of contact surfaces thereof using an adhesive. | 03-25-2010 |
Hanno Oppermann, Rheine DE
| Patent application number | Description | Published |
|---|---|---|
| 20100224552 | Process for improving the breaking strength and/or tear strength of adsorptive filtering materials - The present invention relates to a process for improving the breaking strength and/or tear strength of a warp-knitted fabric, in particular for use in adsorptive filtering materials having a protective function against chemical poisons and/or warfare agent materials, the process comprising providing the warp-knitted fabric with a multiplicity of wales, a multiplicity of courses and a multiplicity of structural elements. In accordance with the present invention, a portion of the structural elements is configured as to each extend over a plurality of wales, so that in the event of a breaking stress on the warp-knitted fabric or the action of a breaking force the structural elements which each extend over a plurality of wales are pushed together or bundled and an improved breaking force results. | 09-09-2010 |
Hans Oppermann, Bad Vilbel DE
| Patent application number | Description | Published |
|---|---|---|
| 20090195293 | EMITTER-SWITCHED BIPOLAR TRANSISTOR - The invention relates to a power circuit with a emitter-switched bipolar transistor (ESBT) (T | 08-06-2009 |
| 20110058396 | FLYBACK-TYPE INVERTER CIRCUIT FOR NETWORK SUPPLY OR FOR NETWORK-INDEPENDENT OPERATION - An inverter circuit for supplying solar power or wind power to a network or for network-independent operation. The inverter circuit includes a minimum number of components and can therefore be kept very compact. | 03-10-2011 |
Hans-Hermann Oppermann, Berlin DE
| Patent application number | Description | Published |
|---|---|---|
| 20100096439 | SELF-ASSEMBLY OF COMPONENTS - A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one first metal coating of the first element and the second metal coating of the at least one further element being in a solid state, a liquid phase being formed upon contact of the at least one first metal coating with the second metal coating. | 04-22-2010 |
| 20120039056 | Component arrangement and method for production thereof - The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween. An improved electrical conductivity with constant mechanical stability is thus generated. | 02-16-2012 |
Hans-Joachim Oppermann, Gemmrigheim DE
| Patent application number | Description | Published |
|---|---|---|
| 20120036948 | ASSEMBLY DEVICE FOR A MEASURING PROBE FOR MEASURING PROCESS VARIABLES IN A PROCESS - An assembly device, especially a retractable assembly, for a measuring probe for measuring process variables in a process, comprising: an assembly housing with a connection system for connecting the assembly device to a process container; a tubular holder for a measuring probe, wherein the tubular holder is guided in the assembly housing axially displaceably between a measuring position in the process container and a maintenance position outside of the process container; and a damping system to damp axial shifting of the tubular holder. The damping system comprises a fluid filled, damping cylinder within the assembly housing, and a damping piston unit guided within the damping cylinder (15) in operative connection with the tubular holder. | 02-16-2012 |
Hermann Oppermann, Berlin DE
| Patent application number | Description | Published |
|---|---|---|
| 20100270673 | METHOD FOR CONNECTING TWO JOINING SURFACES - The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together. | 10-28-2010 |
| 20100307804 | METHOD FOR CONNECTING A PRECIOUS METAL SURFACE TO A POLYMER - The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured. | 12-09-2010 |
| 20100323518 | METHOD FOR PRODUCING A NANOPOROUS LAYER - The invention relates to a method for producing a nanoporous layer, wherein a layer made of gold and silver is deposited onto a substrate, particularly in an electrochemical or galvanic fashion, wherein the composition of said layer lies between 20% and 40% gold and 80% to 60% silver. The silver is subsequently selectively removed in order to obtain a nanoporous gold layer. | 12-23-2010 |
Joachim Oppermann, Gemmrigheim DE
| Patent application number | Description | Published |
|---|---|---|
| 20110189050 | PROBE SYSTEM FOR MEASURING A VARIABLE OF A MEDIUM IN A CONTAINER, ESPECIALLY FOR STERILE APPLICATIONS - A probe system for measuring a measured variable of a measured medium, especially a measured liquid, contained in a process container; comprises: | 08-04-2011 |
Joerg Oppermann, Berlin DE
| Patent application number | Description | Published |
|---|---|---|
| 20080228869 | METHOD FOR ONLINE DISTRIBUTION OF DRM CONTENT - The invention relates to a method for online distribution of digital content that is protected by digital rights management (DRM). It makes it possible to disseminate such content via peer-to-peer networks, for instance, according to the bitstream principle. According to the invention, the file segments that are identical in terms of the distribution of the same content within different DRM files, are shared peer-to-peer among the terminal devices of the network subscribers under the control of a server, while all of the other specific components of a given DRM file, including the rights labels, are transmitted by a centralized site ( | 09-18-2008 |
| 20110040688 | METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR THE DECENTRALIZED DISTRIBUTION OF DIGITAL CONTENT - A method for the decentralized distribution of digital content via a network includes providing content with a tag configured to allow at least one of an operator of a download portal and a content provider to track distribution of the content so as to collect data about a number of downloads of the content and about distributors of the content. A distributor downloads the content via the download portal and selects a content consumer for further distribution of the content. The content consumer receives the content and, at least in the case of a first-time utilization of the content by the content consumer, transmits information from the tag about utilization of the content to a server specified by the tag. At least one of the operator of the download portal and the content provider receives the information from the tag about the utilization of the content from the server. | 02-17-2011 |
Klaus-Guenter Oppermann, Holzkirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20080197423 | Device and method for reducing a voltage dependent capacitive coupling - A device comprises a first means for separating a conductive layer from a semiconductor substrate and a second means for reducing a voltage dependent capacitive coupling between the conductive layer and the semiconductor substrate. | 08-21-2008 |
| 20080224297 | Apparatus comprising a device and method for producing it - An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure. | 09-18-2008 |
| 20090179333 | SOLDER CONTACTS AND METHODS OF FORMING SAME - An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material. | 07-16-2009 |
| 20090265903 | Coupled Resonator Device and Method for Manufacturing a Coupled Resonator Device - A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate. | 10-29-2009 |
| 20100007016 | DEVICE WITH CONTACT ELEMENTS - A device with contact elements. One embodiment provides an electrical device including a structure defining a main face. The structure includes an array of cavities and an array of overhang regions, each overhang region defining an opening to one of the cavities. The electrical device further includes an array of contact elements, each contact element only partially filling one of the cavities and protruding from the structure over the main face. | 01-14-2010 |
| 20100013032 | Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package - A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate. | 01-21-2010 |
| 20110042764 | APPARATUS COMPRISING A DEVICE AND METHOD FOR PRODUCING SAME - An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure. | 02-24-2011 |