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Ooura, JP
Kouji Ooura, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100187952 | ARRAY SCANNING TYPE ULTRASOUND PROBE - A technology is disclosed which provides an array scanning type ultrasound probe capable of preventing a diminution of ultrasound of a piezoelectric device at the time of transmission and at the time of reception due to its damage and thereby reducing a sensitivity deterioration of a diagnostic image. According to the technology, included are an electroacoustic conversion unit formed by arranging multiple piezoelectric devices and multiple acoustic matching layers in a predetermined direction, each of the multiple piezoelectric devices being an electroacoustic conversion device, the multiple acoustic matching layers being respectively stacked on the multiple piezoelectric devices; and a signal flexible board transferring electric signals to be transmitted to and received from the multiple piezoelectric devices. An incision passing through the multiple piezoelectric devices in respective thickness directions of the piezoelectric devices and extending into the corresponding acoustic matching layers stacked thereon is provided in parallel to the arrangement direction. | 07-29-2010 |
| 20100198077 | ULTRASONIC PROBE - An ultrasonic probe that enables the sensibility irregularity between arrays to be reduced is disclosed. This piezoelectric element contains: a piezoelectric element | 08-05-2010 |
Masahiro Ooura, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100124627 | DOUBLE-COATED PRESSURE SENSITIVE ADHESIVE SHEET FOR FIXING HARD DISK DRIVE COMPONENT AND HARD DISK DRIVE - Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 μm or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm | 05-20-2010 |
| 20110061923 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD - A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board. | 03-17-2011 |
Takafumi Ooura, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100206478 | METHOD FOR PRODUCING MULTILAYER LAMINATED FILM - A method for producing a multilayer laminated film comprising: laminating a resin film having a moisture percentage of 10% by weight to 60% by weight with a first transparent film and a second transparent film each having a moisture percentage of 0.5% by weight to 5% by weight to be bonded to both sides of the resin film through an adhesive or pressure-sensitive adhesive layer interposed therebetween; wherein the laminating comprising steps of: passing the resin film and the first transparent film between a pair of a first metal roll and a first elastic roll in such a manner that the first transparent film is placed on the first metal roll side so that they are bonded to each other under pressure to form a laminated film; and then, using the laminated film without winding up it and passing the laminated film and the second transparent film between a pair of a second metal roll and a second elastic roll in such a manner that the second transparent film is placed on the second metal roll side so that they are bonded to each other under pressure to form a multilayer laminated film. The method can prevent bubbles from being formed between the resin film and the transparent film. | 08-19-2010 |
Takashi Ooura, Aichi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100236578 | CYLINDER HEAD CLEANING METHOD AND CYLINDER HEAD CLEANING DEVICE - A cylinder head cleaning method capable of cleaning a cylinder head with an enhanced foreign matter removing rate. The method is used to clean a cylinder head having therein a water jacket including a narrow space portion having a narrow flow path and a large space having a flow path wider than the narrow space portion, and the cylinder head further including holes communicating with the water jacket. Cleaning nozzles are inserted into the water jacket from the holes selected from the holes, clearing liquid is ejected from the cleaning nozzles toward the narrow space portion, and the cleaning liquid flowing from the narrow space portion to the large space is discharged to the outside of the cylinder head from the hole communicating with the space. | 09-23-2010 |
Takeshi Ooura, Hitachinaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20080296160 | CAPILLARY ELECTROPHORESIS DEVICE - Provided is a capillary electrophoresis device including a holder preventing a septum from coming off when a capillary is pulled out, and also allowing containers to be taken out in any order. In the capillary electrophoresis device for separating and analyzing a sample such as a DNA and a protein by electrophoresis, the holder includes: a septum having a capillary hole through which a capillary penetrates; a container for storing a solution; and a container-accommodation unit for accommodating the container. A hole formed in the septum engages with an engagement portion formed on the container, and thereby the septum is held to cover the container. | 12-04-2008 |
Takuya Ooura, Oobu JP
| Patent application number | Description | Published |
|---|---|---|
| 20110232076 | LAMINATED CORE PUNCHING APPARATUS - A laminated core punching apparatus, configured such that a stator-punching press machine that has a molding die performing a partial punching gradually approaches the shape of the stator core piece. There is a punching die to punching out the stator core piece from a strip-form steel plate, and two stator lamination stations. A rotor-punching press machine and a stator-punching press machine are constructed to operate synchronously. An intermediate loop portion capable of causing a strip-form steel plate to hang down in a loop is provided in order to adjust a length of the strip-form steel plate between the two press machines, and a loop guide portion that guides a loop locus of the strip-form steel plate from above so that the strip-form steel plate does not invert is disposed above the intermediate loop portion to be capable of ascending and descending. | 09-29-2011 |
Toshiya Ooura, Kobe-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100127630 | LAMP LIGHTING DEVICE AND PROJECTOR TYPE PICTURE DISPLAY DEVICE USING SAME - Lamp lighting device serves to light up a selected one of two high pressure mercury lamps, and includes a starting pulse generating circuit for outputting a starting pulse voltage; two step-up transformers having secondary windings connected to trigger windings of the lamps respectively; an inverter for outputting an alternating-current voltage; and relays each for providing the starting pulse voltage to a primary winding of a step-up transformer corresponding to the selected lamp, and each for providing the alternating-current voltage to main electrodes of the selected lamp. Since the step-up transformers are provided at stages coming after the relays as such, relays with low breakdown voltage can be used. | 05-27-2010 |