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Ooi, Penang

Eng Hun Ooi, Penang MY

Patent application numberDescriptionPublished
20090006657Enabling consecutive command message transmission to different devices - In one embodiment, the present invention includes a method for transmitting a frame information structure (FIS) message from a host controller or receiving a FIS message at the host controller, transmitting a synchronization signal from the host controller to a port multiplier coupled to the host controller via a link and sustaining a transmit ready signal from the host controller to the port multiplier to thereby lock the link between the host controller and the port multiplier after sending the synchronization signal, and transmitting multiple command FIS messages from the host controller to the port multiplier in a back-to-back manner, where the back-to-back command FIS messages are directed to different devices. Other embodiments are described and claimed.01-01-2009
20090006670Cache for a host controller - In one embodiment, the present invention includes a host controller having a cache memory to store entries each including, at least, a command header (CH) portion having data associated with a command from the host controller to one of multiple devices coupled to a port multiplier, and a physical region descriptor (PRD) portion to store address information associated with a next address for data transfer with regard to the command. Other embodiments are described and claimed.01-01-2009
20090327773SERIAL ATA (SATA) POWER OPTIMIZATION THROUGH AUTOMATIC DEEPER POWER STATE TRANSITION - A host device and a storage device with a Serial ATA (SATA) architecture to independently transition to a deeper low power state after first entering an initial low power state without first transitioning to the Active state. The transition from the Partial state to the Slumber state is direct and the transition may be enabled, but not negotiated through a handshaking process.12-31-2009
20100067133COMMAND SUSPENSION IN RESPONSE, AT LEAST IN PART, TO DETECTED ACCELERATION AND/OR ORIENTATION CHANGE - In an embodiment, an apparatus is provided that may include circuitry to, in response at least in part to detected change in at least one of acceleration and orientation of storage, request suspension of at least one command currently stored in at least one pending command queue that is intended for execution, at least in part, by the storage. The at least one command having been previously issued by the circuitry but being currently unexecuted, at least in part, by the storage. The circuitry also being to store, in response at least in part to the detected change, at least one copy of the at least one command for later re-issuance by the circuitry, and to request replacement of at least one command in the at least one queue with at least one other command to park at least one head of the storage.03-18-2010

Patent applications by Eng Hun Ooi, Penang MY

Giap Yong Ooi, Penang MY

Patent application numberDescriptionPublished
20090158071INTEGRATED POWER MANAGEMENT LOGIC - A device and system are disclosed. In one embodiment the device includes a programmable power supply management logic. The programmable power supply management logic is capable of managing a plurality of voltage regulators present in a computer system. Additionally, the power supply management logic is integrated into an input/output complex in the computer system.06-18-2009
20100077397Input/output (I/O) device virtualization using hardware - According to embodiments of the present invention a computer system that is capable of sharing physical devices among several virtual machines (VM) includes hardware assisted logic to allow requests from guest operating systems (guest OS) to circumvent a virtual machine monitor (VMM) and be processed by the hardware assisted logic.03-25-2010

Patent applications by Giap Yong Ooi, Penang MY

Kooi Chi Ooi, Penang MY

Patent application numberDescriptionPublished
20080237310Die backside wire bond technology for single or stacked die package - Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described.10-02-2008
20080315421Die backside metallization and surface activated bonding for stacked die packages - Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be coupled to an active metal layer of a second die through silicon vias and/or a die backside metallization layer of the second die. Other embodiments are also described.12-25-2008
20090019196Quality of Service (QoS) Processing of Data Packets - The present disclosure provides a method for providing Quality of Service (QoS) processing of a plurality of data packets stored in a first memory. The method may include determining a queue of a plurality of queues causing an interrupt using contents of an interrupt status register, the queue comprising address of at least one data packet of the plurality of data packets. The method may further include performing a logical operation between the contents of the interrupt status register and an interrupt mask of a plurality of interrupt masks, the plurality of interrupt masks stored in a second memory. The method may also include processing the plurality of data packets based on the logical operation and incrementing an interrupt mask address pointer stored in a third memory, thereby pointing to another interrupt mask of the plurality of interrupt masks. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.01-15-2009
20090065951STACKED DIE PACKAGE - The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed.03-12-2009
20100169750FIRMWARE VERIFICATION USING SYSTEM MEMORY ERROR CHECK LOGIC - Embodiments of an invention for verifying firmware using system memory error check logic are disclosed. In one embodiment, an apparatus includes an execution core, firmware, error check logic, non-volatile memory, comparison logic, and security logic. The error check logic is to generate, for each line of firmware, an error check value. The comparison logic is to compare stored error check values from the non-volatile memory with generated error check values from the error check logic. The security logic is to prevent the execution core from executing the firmware if the comparison logic detects a mismatch between the stored error code values and the generated error code values.07-01-2010
20120003792STACKED DIE PACKAGE - The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed.01-05-2012

Patent applications by Kooi Chi Ooi, Penang MY

Sze Mai Ooi, Penang MY

Patent application numberDescriptionPublished
20090278262Multi-chip package including component supporting die overhang and system including same - A microelectronic package and a system including the package. The package includes: a substrate; a stack of dice electrically and mechanically bonded to the substrate, the stack including a second level die and a first level die between the substrate and the second level die, the second level die defining an overhang; and a component disposed between the substrate and the overhang of the second level die and adapted to support the overhang on the substrate.11-12-2009

Wai Kek Ooi, Penang MY

Patent application numberDescriptionPublished
20120103854Devices and Methods for Packing - Devices and methods for packing objects, including information handling systems and other types of electronic devices that may be implemented using a single piece and assembly-free packing device configuration that has one or more foldable and insertable buffer sections that are foldable to increase the overall strength of the packing device against external loads and shocks.05-03-2012