Ooi, MY
Ban Hin Ooi, Bayan Lepas MY
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20150111622 | SPEAKER AND KEYPAD ASSEMBLY FOR A PORTABLE COMMUNICATION DEVICE - An improved keypad and speaker assembly is provided. The assembly ( | 04-23-2015 |
20150145384 | APPARATUS AND METHOD FOR PROVIDING A SEAL AROUND A PERIMETER OF A BI-MATERIAL ENCLOSURE - An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities. | 05-28-2015 |
Beng Gian Ooi, Gelugor MY
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20150206424 | WIRELESS MULTI-FUNCTION REMOTE CONTROL DEVICE - A portable remote control device ( | 07-23-2015 |
Bok Leong Ooi, Island Park MY
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20140054141 | LINK OR A CONVEYOR CHAIN, A CONVEYOR CHAIN MADE UP OF SAID LINKS AND A METHOD FOR OPERATION OF SAID CONVEYOR CHAIN - A conveyor chain link a main body, a top plate to which a handling product or part thereof is restable thereupon; said main body having a front portion and a rear portion; said front portion and rear portion having means to be interconnected such that one link can be connectable to another in order for the establishment of a multi-linked conveyor chain; a first guide member arrangement including a pair of rotably-supported laterally extending on opposing sides of an underneath side of said top plate, adapted to roll in the direction of movement of said conveyor chain, wherein said rollers of the first guide member arrangement are adapted to rest and rotate along a corresponding top face of a wear strip as part of a conveyor assembly support structure for the conveyor chain; a second guide member arrangement, including two rotably-supportable guide members on opposing sides of said main body, rotably about a longitudinal axis, perpendicular to the top plate, wherein the peripheral edge of the respective guide members are adapted to engage a side edge of a wear strip face of the conveyor support assembly or a similar such configured structure arrangement of said conveyor support assembly; a third guide member arrangement, including a roller member adapted to rest and rotate upon a conveyor bed of the conveyor assembly support or other similar structure of the conveyor support assembly, wherein said roller of the third guide member arrangement is laterally rotatably-supported by an axis substantially in parallel to the top plate; such that the first, second and third guide member arrangements can work independently or in combination to reduce frictional force between the contact positions of the conveyor chain with the conveyor chain support assembly, resulting in a reduced level of power required to drive the conveyor chain upon the conveyor support assembly during operation, along with reduced wear and tear of the link against the conveyor support assembly. | 02-27-2014 |
Boon Hoong Ooi, Sungai Petani MY
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20090237310 | ANTENNA ASSEMBLY AND ELECTRONIC DEVICE WITH A RETRACTABLE RADIO FREQUENCY RADIATING ELEMENT - An electronic device having a housing with a shroud locator socket. There is a retractable elongate radio frequency radiating element passing through an aperture of the shroud locator socket, the retractable elongate radio frequency radiating element being electrically connected to an electrical circuit located in the housing and being movable from a fully retracted position when substantially located in the housing to a fully extended position when substantially protruding outside the housing. An end cap is located on a free end of the retractable elongate radio frequency radiating element and there is a shroud having transverse ribs that are transverse to a longitudinal axis (X) of the retractable elongate radio frequency radiating element. The shroud covers a protected length (L) of the retractable elongate radio frequency radiating element proximal to the end cap. The shroud extends and tapers away from the end cap towards the shroud locator socket and the shroud operatively engages the shroud locator socket when the retractable elongate radio frequency radiating element is in the fully retracted position. | 09-24-2009 |
Boon Hoong Ooi, Bayan Lepas MY
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20110267257 | METHOD AND APPARATUS FOR DISPLAYING AN IMAGE ON A COMMUNICATION DEVICE - A method and apparatus for displaying an image on a communication device are provided. The communication device is formed of a housing ( | 11-03-2011 |
Boon Lee Ooi, Kuala Lumpur MY
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20120160103 | Slug Suppressor Apparatus and Crude Oil Stabilization Assembly and Process Therefor - A slug suppressor apparatus comprising an inlet separator capable of gas-liquid separation of full well stream fluid and expanded inclined liquid pipe for dampening slugs. The inlet separator has an inlet for receiving the full well stream fluid, a separated gas outlet in its upper section, and a separated liquid outlet in its lower section. The separated gas outlet and the separated outlet are operationally connected to a gas bypass line and the expanded inclined liquid pipe respectively. The expanded inclined liquid pipe has means for dampening liquid slugs and is connectable to a 3-Phase separator. | 06-28-2012 |
Chen Ling Ooi, Georgetown MY
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20140020087 | SENSORY ASSOCIATION PASSCODE - A device is secured against unauthorized use with a passcode based on a sensory association of a visual item with one or both of a sound clip and a tactile pattern. The sensory association passcode is encoded from one or more frames containing a user-selected combination of the visual item with the sound clip and/or the tactile pattern. The sensory association passcode can be further encoded with a sequence that indicates an order of the one or more frames of the passcode. Users can retrieve a portion of the sensory association passcode to facilitate recall of a forgotten passcode. The user-selected combination of the visual item with the sound clip and/or the tactile pattern facilitates easier recall of a passcode than might be possible with conventional passcode techniques. | 01-16-2014 |
Ee Mei Ooi, Bayan Lepas MY
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20140145756 | MEMORY INTERFACE CIRCUITRY WITH IMPROVED TIMING MARGINS - Integrated circuits may include memory interface circuitry that communicates with memory. The memory interface circuitry may include latch circuitry that receives a data strobe enable signal from the memory controller and latches the data strobe enable signal using a data strobe signal received from the memory. The integrated circuit may include logic circuitry that gates the data strobe signal using the latched data strobe enable signal. The logic circuitry may pass the data strobe signal in response to activation of the latched data strobe enable signal. The integrated circuit may include counter circuitry that monitors the gated data strobe signal. The counter circuitry may monitor the gated data strobe signal by counting pulses in the gated data strobe signal to produce a counter value. When the counter value reaches a target value, the logic circuitry may block the data strobe signal from passing to the memory controller. | 05-29-2014 |
Eng Hun Ooi, Georgetown MY
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20100169566 | Dynamically switching command types to a mass storage drive - A method, device, and system are disclosed. In one embodiment method begins by receiving a first new mass storage disk access request. The method then determines the total number of access requests to the mass storage disk received in a window of time. If the total number of requests received over the period of time is greater than or equal to a request threshold number then a request frequency counter is decremented. Otherwise, the counter is incremented. The method continues by generating a legacy advanced technology attachment (ATA)-type command for the first new access request when the counter is greater than or equal to a counter threshold number. Otherwise, the method generates a native command queue (NCQ)-type command for the first new access request. | 07-01-2010 |
20110099306 | ENABLING CONSECUTIVE COMMAND MESSAGE TRANSMISSION TO DIFFERENT DEVICES - In one embodiment, the present invention includes a method for transmitting a frame information structure (FIS) message from a host controller or receiving a FIS message at the host controller, transmitting a synchronization signal from the host controller to a port multiplier coupled to the host controller via a link and sustaining a transmit ready signal from the host controller to the port multiplier to thereby lock the link between the host controller and the port multiplier after sending the synchronization signal, and transmitting multiple command FIS messages from the host controller to the port multiplier in a back-to-back manner, where the back-to-back command FIS messages are directed to different devices. Other embodiments are described and claimed. | 04-28-2011 |
20120017011 | OUT-OF-BAND ACCESS TO STORAGE DEVICES THROUGH PORT-SHARING HARDWARE - A method, apparatus, system, and computer program product for enabling out-of-band access to storage devices through port-sharing hardware. Providing out-of-band access to storage devices enables system management functions to be performed when an operating system is non-functional as well as when the operating system is active. Storage commands originating with a management service can be interleaved with storage commands issued by the host operating system. The host operating system maintains ownership and control over its storage devices, but management activities can be performed while the host operating system is operational. | 01-19-2012 |
20140089693 | EFFICIENT LOW POWER EXIT SEQUENCE FOR PERIPHERAL DEVICES - Embodiments of the invention describe methods, apparatuses and systems for providing an efficient low power exit sequence for peripheral devices. In embodiments of the invention, a signal from a host device is transmitted to a SATA peripheral device for exiting a low-power state. An initialization time for OOB transmission and reception logic of the SATA peripheral device is tracked, and a reference time value based on the tracked initialization time is stored. In subsequent transitions from said low-power state, the reference time value for waking a host physical layer is utilized, thereby improving the efficiency of the management and use of said low power state. In some embodiments, the above described tracked initialization comprises a time from a transmission of an OOB signal (from the host to the peripheral device) to receiving an OOB response at the host device from the SATA peripheral device. | 03-27-2014 |
20140095742 | SERIAL STORAGE PROTOCOL COMPATIBLE FRAME CONVERSION, AT LEAST IN PART - An embodiment may include circuitry to (a) convert, at least in part, at least one serial storage protocol compatible frame into at least one packet that is compatible, at least in part, with a multi-lane input/output (I/O) protocol, and/or (b) convert, at least in part, the at least one packet into the at least one frame. The at least one packet may be transmitted via a physical layer that is compatible, at least in part, with the multi-lane I/O protocol. The at least one packet may comprise frame information structure (FIS) information of the at least one frame. | 04-03-2014 |
20150032941 | NON-VOLATILE MEMORY INTERFACE - In an embodiment, a memory interface may send an indication that a request is being sent. The indication may be sent to a non-volatile memory via a point-to-point bus between a memory interface and the non-volatile memory. The memory interface may send the request to the non-volatile memory via the bus. The request may include an address that may be used to identify a location for storing or reading data. The non-volatile memory may acquire the request from the bus and process the request. After processing the request, the non-volatile memory may send an indication to the memory interface that indicates the non-volatile memory has a response to send to the memory interface. The memory interface may grant access to the bus to the non-volatile memory. After being granted access to the bus, the non-volatile memory may send the response to the memory interface. | 01-29-2015 |
20150277930 | IN-SYSTEM PROVISIONING OF FIRMWARE FOR A HARDWARE PLATFORM - A hardware platform includes a nonvolatile storage device that can store system firmware as well as code for the primary operating system for the hardware platform. The hardware platform includes a controller that determines the hardware platform lacks functional firmware to boot the primary operating system from the storage device. The controller accesses a firmware image from an external interface that interfaces a device external to the hardware platform, where the external device is a firmware image source. The controller provisions the firmware from the external device to the storage device and initiates a boot sequence from the provisioned firmware. | 10-01-2015 |
20160034345 | MEMORY LATENCY MANAGEMENT - Apparatus, systems, and methods to manage memory latency operations are described. In one embodiment, an electronic device comprises a processor and a memory control logic to receive data from a remote memory device, store the data in a local cache memory, receive an error correction code indicator associated with the data, and implement a data management policy in response to the error correction code indicator. Other embodiments are also disclosed and claimed. | 02-04-2016 |
Hee Chai Ooi, Nusajaya Johor MY
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20130246276 | METHOD AND SYSTEM FOR MOBILE IDENTIFICATION, COMMERCE AND AGREEMENT TRANSACTIONS - A method and system is described which uses the USSD (Unstructured Supplementary Services Data) protocol to allow users to conduct commerce and agreement transactions, and retrieve identification information in a secure manner. | 09-19-2013 |
Joo Pheng Ooi, Butterworth MY
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20080215493 | Method and system for negotiation - A system and method for negotiating over a network, comprises a selector for selecting a random length of time for negotiation; a receiving component, operably connected to said selector, for receiving an offer to purchase over a network; and a purchase fulfillment component, operably connected to said receiving component, wherein said purchase fulfillment component completes a purchase if said offer to purchase over a network matches or exceeds a threshold criterion and/or the elapsed amount of time for negotiation does not exceed said random length of time. A maximum negotiation iteration approach may be used to allow up to a predetermined number of negotiation proposals. A maximum negotiation time frame approach may be used to allow up to a predetermined period of elapsed time for negotiation proposals. The maximum negotiation iteration approach and the maximum negotiation time frame approach may be used together or with a variety of negotiation approaches. | 09-04-2008 |
Kooi Chi Ooi, Glugor MY
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20120319293 | MICROELECTRONIC DEVICE, STACKED DIE PACKAGE AND COMPUTING SYSTEM CONTAINING SAME, METHOD OF MANUFACTURING A MULTI-CHANNEL COMMUNICATION PATHWAY IN SAME, AND METHOD OF ENABLING ELECTRICAL COMMUNICATION BETWEEN COMPONENTS OF A STACKED-DIE PACKAGE - A microelectronic device comprises a first surface ( | 12-20-2012 |
Kooi Chi Ooi, Bayan Lepas MY
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20080315388 | VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE - In some embodiments, vertical controlled side chip connection for 3D processor package is presented. In this regard, an apparatus is introduced having a substrate, a substantially horizontal, in relation to the substrate, integrated circuit device coupled to the substrate, and a substantially vertical, in relation of the substrate, integrated circuit device coupled to the substrate and adjacent to one side of the substantially horizontal integrated circuit device. Other embodiments are also disclosed and claimed. | 12-25-2008 |
20130341803 | METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGRATED PACKAGING SYSTEM - Semiconductor multi-die structures having intermediate vertical side chips, and packages housing such semiconductor multi-die structures, are described. In an example, a multi-die semiconductor structure includes a first main stacked dies (MSD) structure having a first substantially horizontal arrangement of semiconductor dies. A second MSD structure having a second substantially horizontal arrangement of semiconductor dies is also included. An intermediate vertical side chip (i-VSC) is disposed between and electrically coupled to the first and second MSD structures. | 12-26-2013 |
20140091442 | HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY - An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a grid array including a plurality of conductive posts disposed on respective ones of the plurality of pads of the ultimate conductive layer of the body, at least one of the posts coupled to at least one of the contact points of the die through at least a portion of the conductive material of the body. A method including forming a body of a build-up carrier including a die, the body of the build-up carrier including an ultimate conductive layer and forming a grid array including a plurality of conductive posts on the ultimate conductive layer of the body. | 04-03-2014 |
20160005718 | MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE CHIP AND SEMICONDUCTOR PACKAGE FOR SAME - Semiconductor multi-die structures having intermediate vertical side chips, and packages housing such semiconductor multi-die structures, are described. In an example, a multi-die semiconductor structure includes a first main stacked dies (MSD) structure having a first substantially horizontal arrangement of semiconductor dies. A second MSD structure having a second substantially horizontal arrangement of semiconductor dies is also included. An intermediate vertical side chip (i-VSC) is disposed between and electrically coupled to the first and second MSD structures. | 01-07-2016 |
Kooi Chi Ooi, Teluk Kumbar MY
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20090122702 | Bandwidth allocation for network packet traffic - Bandwidth is allocated among network interfaces of, for example, a switch, router, or server among based on network packet traffic. In one example the network device has a plurality of network interfaces, a performance monitoring unit to monitor buffer events for the network interfaces and to generate an interrupt if a network interface buffer is near an overflow state, and a processor to receive the interrupt and increase a priority of the associated network interface in response thereto. | 05-14-2009 |
Kooi Chi Ooi, Georgetown MY
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20110140268 | HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump. | 06-16-2011 |
20150201497 | HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump. | 07-16-2015 |
Kooi Choon Ooi, Melaka MY
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20120313231 | METHOD AND APPARATUS FOR DICING DIE ATTACH FILM ON A SEMICONDUCTOR WAFER - In one aspect of the present invention, a method of sawing a semiconductor wafer will be described. A semiconductor wafer is positioned in a wafer sawing apparatus that includes a sawing blade and a movable support structure that physically supports the semiconductor wafer. The semiconductor wafer is coupled with the support structure with various layers, including a die attach film, an adhesive and a base film. The die attach film is cut with the sawing blade. During the cutting operation, a contact portion of the sawing blade engages one of the layers and moves at least partly in one direction. While the contact portion of the sawing blade engages the layer, the support structure moves in the opposite direction. Various aspects of the present invention relate to arrangements and a wafer sawing apparatus that involve the aforementioned sawing method. | 12-13-2012 |
20130087901 | DESIGN FOR EXPOSED DIE PACKAGE - In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object. | 04-11-2013 |
20130127029 | TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE - A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the raised die attachment pad, in one example, using ball bonds, the whole sealed in an encapsulant that exposed a bottom portion of the die and a portion of a lead. Two leadframe stacks of such packages are also disclosed as are methods of manufacture. | 05-23-2013 |
Lee Sun Ooi, Kulim MY
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20160040870 | LIGHT EMITTING DIODE (LED) DISPLAY FOR A PORTABLE COMMUNICATION DEVICE - A light emitting diode (LED) display assembly is formed of a translucent plastic housing, a light diffuser film coupled to the translucent plastic housing, a light barrier gasket coupled to the diffuser film, and an LED module coupled to the light barrier gasket. The LED module comprises a plurality LEDs individually controlled for generating a light source to form a graphic on the surface of the translucent plastic housing. | 02-11-2016 |
Pey Hann Ooi, Butterworth MY
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20090291646 | MULTIPLE PTT FUNCTIONALITY - A communication device and method are presented. The device is in a network of devices of different groups. The device contains a push-to-talk (PTT) button, a channel selector, and a keyboard containing hard or soft keys. The channel selector selects an initial frequency at which to receive and transmit, dependent on the group to which the device belongs. The device transmits when the PTT button is pressed. If a multiple PTT function is activated by software in the device, at least some of the keys are used to select a new transmission frequency. The device receives at the initial frequency independent of the transmission frequency. The multiple PTT function can be activated by a dedicated soft or hard key or a key on the keyboard that serves multiple functions. The frequency selection provided by the keys is dependent on the channel and the device group. | 11-26-2009 |
Ping Ping Ooi, Butterworth MY
Patent application number | Description | Published |
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20140001643 | HYBRID PACKAGE TRANSMISSION LINE CIRCUITS | 01-02-2014 |
20150069629 | HYBRID PACKAGE TRANSMISSION LINE CIRCUITS - “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels. | 03-12-2015 |
Thean Hai Ooi, Batu Manung MY
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20120134304 | ACOUSTIC PORTING FOR A PORTABLE COMMUNICATION DEVICE - A portable full duplex communication device ( | 05-31-2012 |
Thean Hai Ooi, Batu Maung MY
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20110136438 | METHOD AND APPARATUS FOR MAINTAINING TRANSMIT AUDIO IN A HALF DUPLEX SYSTEM - A method for maintaining transmit audio quality under harsh environmental conditions, the method includes receiving audio signals into a microphone of a portable communication device and determining at least one parameter associated with the received audio signals. In accordance with an embodiment, the at least one parameter is compared with a received audio parameter threshold. When the at least one parameter falls outside of the received audio parameter threshold, the audio routing is switched from the microphone to the loudspeaker. Subsequent communication may revert back to the microphone or remain at the loudspeaker depending on monitored audio conditions. | 06-09-2011 |
20130136276 | METHOD AND APPARATUS FOR RECEIVING AND PLAYING A SIGNAL IN A RADIO RECEIVER - A method and apparatus for receiving and playing a signal in a radio receiver to suppress microphonic feedback are provided by alternately pitch shifting a received audio signal. The pitch of the received audio signal is alternately shifted up and then down, repeatedly over successive intervals of the audio signal, to produce a pitch swing signal which is then played over a speaker. The alternating pitch shifting prevents the buildup of regenerative feedback normally caused by acoustic vibrations coupling into the radio receiver. | 05-30-2013 |
Thean Song Ooi, Taman Desa Relau Ii MY
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20110045323 | CURRENT LIMITING APPARATUS AND METHOD - A battery pack ( | 02-24-2011 |
Tian Lye Ooi, Kajang MY
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20090215957 | PROCESS FOR REDUCING COLOR OF A POLYGLYCEROL - The present invention relates to a process for reducing color of a polyglycerol. The process includes the steps of treating said polyglycerol with a first bleaching agent such as bleaching earth and treating said treated polyglycerol with a second bleaching agent such as hydrogen peroxide. | 08-27-2009 |
Tian Lye Ooi, Selangor MY
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20080293913 | PROCESS TO PRODUCE POLYOLS - A process for producing oleochemical polyols comprises the steps of epoxidizing unsaturated oil using an organic acid together with oxygenated water or a per-acid to obtain epoxidized oil; washing the epoxidized oil with salt water to remove unused organic acid together with oxygenated water or a per-acid; neutralizing acidic condition of the washed epoxidized oil with a base; washing the neutralized epoxidized oil with a salt solution until the pH of the neutralized epoxidized oil reaching 6.5 to 7.5 to removed the base residue; drying the washed neutralized epoxidized oil under vacuum; and reacting the washed neutralized dried epoxidized oil with polyhydric alcohol in the presence of boron trifluoride-diethylether complex to produce the oleochemical polyols. The oleochemical polyols are then subjected to the same washing, neutralizing, washing and drying process as in preparing the washed neutralized dried epoxidized oil. | 11-27-2008 |
Toong Erh Ooi, Butterworth MY
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20140291866 | EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE - An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate. | 10-02-2014 |
Yeow Thiam Ooi, Butterworth MY
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20120218449 | AUTOFOCUS CAMERA MODULE PACKAGING WITH CIRCUITRY-INTEGRATED ACTUATOR SYSTEM - A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three-dimensional in that it includes a first set of contact pads on one planar surface for connection to the mobile electronic device, a second set of contact pads on a planar surface within the recess for connection to the image sensor, and conductive traces that connect each of the contact pads of the first set with an associated one of the contact pads of the second set by having the trace follow a path from the first planar surface, along a intersecting third planar surface to the second planar surface. | 08-30-2012 |
20120218450 | Autofocus-Zoom Camera Module Integrating Liquid Crystal Device as High Speed Shutter - A camera module having a liquid crystal shutter that controls the time period during which the image sensor is exposed to light directed into the camera module. The shutter is located within the camera module housing, which may include EMI shielding and may include a lens actuator for moving a movable lens group. The shutter may be located before or after the movable lens group and before or after a fixed lens group that may also be included. The camera module may also include an IR filter for reducing the amount of IR light that reaches the image sensor. | 08-30-2012 |
20120218458 | FLASH SYSTEM FOR CAMERA MODULE - A camera module having a flash that is provided therein. The flash may be an LED light source. The LED may come in a package that is generally rectangular, with the exception that one corner is flattened. The camera module includes a housing that receives the light source, an image sensor, and a lens. The housing includes mating features that receive the LED package, those features including a flattened corner so that the LED package can only be received within the housing when it is properly oriented. The housing also includes electrical terminals for connection to the LED that include springs. When the LED package is properly oriented and received within the housing, contact pads on the LED package and the electrical terminals on the housing are pressed together against the resilient force of the spring. | 08-30-2012 |
20120229701 | CAMERA MODULE WITH PROTECTIVE AIR VENTILATION CHANNEL - A camera module with a vent in a housing thereof to allow for fluid communication between an interior of the camera module and an exterior of the camera module. A micro-porous membrane filter having a pore size smaller than 10 um is employed to cover the vent so as to reduce the flow of contaminants into the camera module. | 09-13-2012 |
20120242883 | LOW PROFILE CAMERA MODULE PACKAGING - A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing. | 09-27-2012 |
20120288272 | CAMERA MODULE WITH THREADLESS LENS BARREL ENGAGEMENT DESIGN - A camera module with a lens barrel containing a lens, and a lens carrier that slidably receives the lens barrel. Each of the exterior surface of the lens barrel and the interior surface of the lens carrier include a seating surface formed thereon. One of the exterior surface of the lens barrel and the interior surface of the lens carrier include a plurality of protrusions for controlling the relative position of the lens barrel and the lens carrier. The other of the exterior surface of the lens barrel and the interior surface of the lens carrier include a plurality of channels that are sized and arranged so as to slidably receive the protrusions to allow for the lens barrel to be slid into the lens carrier. The channels also each include a transverse section to allow the lens barrel to be pivoted about an optical axis of the lens barrel. | 11-15-2012 |
20130027600 | CAMERA MODULE WITH PARTICLE TRAP - A camera module including a particle trap. The particle trap may be disposed in the camera module and may be operable to prevent particles from obstructing an optical path defined between a lens assembly and an image sensor. The particle trap may include a particle getter to retain particles in contact with the particle trap. The camera module may be operative to move the lens assembly so as to provide focus on the image sensor for objects at various distances from the camera module. The movement of the lens assembly may be a source of particles retained by the particle trap. | 01-31-2013 |
20130044382 | CAMERA MODULE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing camera modules for use in portable electronic devices, such as mobile phones, is provided. More specifically, in camera modules utilizing lens motion type auto focus actuation, permanent magnets associated with voice coil motors utilized in the auto focus system, generate magnetic flux that can interfere with the process of bonding image sensors to camera modules if the permanent magnets of different voice coil motors are positioned too closely. Incorporating a magnetic shield into the manufacturing process to restrain or control the magnetic flux generated by the permanent magnets permits voice coil motors to be positioned closer together during the manufacturing process. This increases manufacturing throughput and reduces cost. | 02-21-2013 |
20140028898 | AUTO FOCUS-ZOOM ACTUATOR OR CAMERA MODULE CONTAMINATION REDUCTION FEATURE WITH INTEGRATED PROTECTIVE MEMBRANE - A camera module includes a lens system, an image sensor, and an actuator. The actuator is fixed relative to the image sensor, and the actuator moves the lens system relative to the image sensor to achieve focus. Components that move relative to each other result in gaps or spaces between the components, an in particular there is a gap between the lens system and the actuator. Such a gap provides a traveling path for foreign material, or particulates, to enter the camera module and reach the image sensor, or other intermediate optical components between the lens system and the image sensor. A camera contamination reduction apparatus is implemented as a protective membrane that prevents foreign material from reaching the internal optical components through the traveling path. | 01-30-2014 |