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Onishi, Kyoto-Shi

Hiroaki Onishi, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090027739Image sensor - An image sensor includes an elongated case, a light source provided in the case, a light guiding member elongated in a longitudinal direction of the case and configured to direct light emitted from the light source toward a document to be read, an optical system for collecting light reflected by the document, a sensor IC chip for receiving the light collected by the optical system, and a substrate attached to the case. The substrate is provided with a wiring pattern and carries the sensor IC chip. The case is provided with a plurality of supporting projections spaced apart from each other in the longitudinal direction. The supporting projections are held in contact with the side surface of the light guiding member.01-29-2009
20090080213Light guide and image sensor module - An elongated and generally columnar light guide includes a light receiving surface provided at an longitudinal end portion of the light guide, a reflecting surface elongated in the longitudinal direction of the light guide for reflecting light entering through the light receiving surface in a light emitting direction, a ridge elongated in the longitudinal direction of the light guide, and a light emitting surface for emitting reflected light from the reflecting surface as linear light extending in the longitudinal direction of the light guide. The reflecting surface is provided on a distal end portion of the ridge.03-26-2009
20090201675Linear light source device - A linear light source device includes a transparent light guide member of an elongate shape having a longitudinal axis. The light guide member includes a first end, a second end and a main body sandwiched between the first end and the second end. The linear light source device further includes a light emission unit arranged to face a light incident surface of the first end. The first end includes an entering-light controlling portion having a diameter which increases as progressing from the light incident surface toward the main body. The entering-light controlling portion changes the direction of the light emitted from the light emission unit.08-13-2009
20090310365LIGHTING APPARATUS - A lighting apparatus is used, for example, to illuminate a traffic space in which people is supposed to move about, typically walk back and forth. The lighting apparatus includes a light source unit which may be disposed in the traffic space, and a light guide provided with a light incident surface at an end and a light emitting portion at the other end. The light guide is elongated to extend from the light incident surface to the light emitting portion. The light incident surface is arranged to receive the light emitted from the light source unit. The light emitting portion is arranged to emit the inwardly guided light toward the traffic space.12-17-2009
20100321497VEHICLE-MOUNTED CAMERA - A vehicle-mounted camera includes a camera module mounted on a vehicle such as an automobile, and further includes a mirror occupying at least a part of an imaging range of the camera module. The camera module may be arranged to face a forward vehicle traveling direction. The mirror may occupy a lower part of the vertical direction in the imaging range. The camera module and the mirror may both be disposed in the vehicle.12-23-2010

Kensaku Onishi, Kyoto-Shi JP

Patent application numberDescriptionPublished
20110222994SUBSTRATE PROCESSING APPARATUS, STORAGE DEVICE, AND METHOD OF TRANSPORTING SUBSTRATE STORING CONTAINER - In a substrate processing apparatus, a storage device, an indexer block, a processing block and an interface block are arranged to line up in this order. The storage device includes a plurality of openers on which a carrier storing a plurality of substrates can be placed. The carrier is carried in the storage device. In the storage device, the carrier is transported among the plurality of openers by a transport device. The transport device includes first and second hands configured to be able to hold the carrier and move in a horizontal direction and a vertical direction. The second hand is provided below the first hand.09-15-2011

Takahisa Onishi, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090099937Product ordering apparatus - In one embodiment of a product ordering apparatus, information of a service entrusted from a service-providing company is selected from an operating unit, and when product information in that service is selected from the operating unit, the service-providing company is designated, the format of an order form is determined by designating the service-providing company, personal information and store information are automatically input along with product information to data of the determined order form, and after a payment procedure in a settlement device, order form data in which the information has been automatically entered is automatically sent by facsimile to a device of the service-providing company due to a request from the settlement device, and after sending the facsimile, when outputting a communications results report, the contents of the order form are printed on paper as a copy together with the communications results report.04-16-2009

Yohei Onishi, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090102093METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD - A molded product (consisting of resin compact and substrate) is formed by sealing and molding an electronic component mounted on a substrate in a resin compact by injecting/charging a heated/molten resin material into a cavity. Then, when a pressing member presses an ejector plate urged in a return direction (downward) in an ejective direction (upward) through a presser, a return pin guides mold releasing pins fixedly provided on the ejector plate, thereby ejecting and releasing the molded product from a mold with the mold releasing pins. Upon defective sliding of the mold releasing pins, the mold releasing pins can be returned to return positions by pressing the return pin with an upper mold section.04-23-2009
20090258189OPTICAL ELECTRONIC COMPONENT - There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.10-15-2009

Patent applications by Yohei Onishi, Kyoto-Shi JP