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Ong, Penang
Hean Kooi Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20110113528 | GLOVE WITH LIQUID STORAGE AND DISPENSATION CAPABILITIES - The present invention is a hand covering such as a glove that is adapted to absorb and store an amount of liquid within an adsorbent layer incorporated into the glove. The liquid can be easily dispensed by certain movements of the hand such as squeezing or grasping. The glove design allows another, external layer purpose-engineered for particular applications to be either permanently or detachably attached on the exterior of the glove. The rubber used is a composite comprising 10-20% nitrile and the remaining 80-90% natural latex. | 05-19-2011 |
Hui-Peng Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20080315906 | FAULTY DANGLING METAL ROUTE DETECTION - A system is provided that facilitates locating long dangling metal routes in a semiconductor chip design. The system includes mechanisms for partitioning metal features of the chip design to discover dangling metal routes that could be potential violations. The system further comprises mechanisms for determining if the dangling metal routes of the chip design exceed a length limit that could result antenna violations, undesired noise in the circuit, circuitry breakdown or the like. The system enables excessively long dangling metal routes to be allowed as exceptional cases. Machine learning is provided to receive feedback to refine the exceptional cases and enable more efficient fault detection. | 12-25-2008 |
Jin Ngee Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20100142718 | NOISE CANCELLING HEADPHONE - A noise cancelling headphone is described. The noise cancelling headphone utilizes a low power consuming noise cancellation circuit wherein an audio input signal is directly fed into the headphone without the use of an additional headphone amplifier. The noise cancelling circuit uses a microphone to pick up ambient noise and produces a signal which is equal in amplitude but opposite in polarity to the ambient noise signal. The resultant signal is mixed with the audio input signal and fed into the speakers of the headphone. This method is advantageous because it uses fewer components than conventional noise cancellation circuits and it also consumes less power due to the use of fewer components. The distortion of the audio input signal is also reduced since no amplification is performed to the audio input signal onboard the noise cancellation circuit. | 06-10-2010 |
Joon-Heong Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20090206386 | DECODING SYSTEM CAPABLE OF CHARGING PROTECTION FOR FLASH MEMORY DEVICES - One embodiment of the present invention relates to a flash memory array. The flash memory array comprises at least two word lines of gate electrode material. At least one of the word lines is connected through a first metal level to a discharge circuit, while other word line(s) may connect to a discharge circuit through a first and second metal level. The memory array further comprises a shorting path between the word lines of the memory array. The shorting path is a high resistance layer of undoped gate electrode material. The resistance value of the gate electrode material is such that the word lines can be used to read, write, or erase without effecting each other, but that during the formation of a first metal level, as charges will build up on a first word line which requires a second metal level to connect to its discharge junction circuit, it will short the first word line to an adjacent second word line that has a connection to its junction circuit on the first metal level. Other methods and circuits are also disclosed. | 08-20-2009 |
Kang Eu Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20090321928 | FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. | 12-31-2009 |
Kiam Soon Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20090129085 | OPTICAL DEVICE - An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die. | 05-21-2009 |
| 20100320485 | MULTI-CHIP PACKAGED LED LIGHT SOURCE - A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer. | 12-23-2010 |
Lay Koon Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20110122630 | Solid State Lamp Having Vapor Chamber - A solid state lamp has a form that replaces a standard screw-in or plug-in type light bulb. One or more LEDs are mounted on a thermally conductive submount, which is mounted on the top surface of a substantially round and flat vapor chamber. The vapor chamber efficiently spreads the heat and also conducts heat vertically. The vapor chamber is affixed to a substantially round mounting base of a metal housing. In this way, the very small LED dies appear to the mounting base as much larger heat sources producing less heat per unit area, and the thermal resistance of the heat path is greatly reduced. The housing has ventilation openings for cooling a bottom surface of the mounting base. The top of the vapor chamber is highly reflective, and the housing has a high emissivity coating. A standard base is attached to the housing for connection to an AC mains voltage. | 05-26-2011 |
Mee-Choo Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20100302846 | CHARGE RETENTION FOR FLASH MEMORY BY MANIPULATING THE PROGRAM DATA METHODOLOGY - A method, system and apparatus for determining whether any un-programmed cell is affected by charge disturb by comparing the voltage threshold of the un-programmed cells against a reference voltage. If the voltage threshold for the un-programmed cell exceeds the reference voltage, the failed or defective un-programmed cell will be then be programmed. This will change the defective un-programmed cell to a new programmed value. To account for the location of the failing memory cell, address syndrome bits are used to identify the location of the defective memory cell. | 12-02-2010 |
Tean Wee Ong, Penang MY
| Patent application number | Description | Published |
|---|---|---|
| 20090321928 | FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed. | 12-31-2009 |