Patent application number | Description | Published |
20130099395 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. | 04-25-2013 |
20130341671 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray. | 12-26-2013 |
20130345370 | SILICONE RESIN COMPOSITION - A first silicone resin composition is prepared by allowing an organopolysiloxane containing silanol groups at both ends containing silanol groups at both ends of a molecule and a silicon compound containing, in one molecule, at least two leaving groups leaving by a condensation reaction with the silanol groups to undergo the condensation reaction in the presence of a condensation catalyst. The silicon compound contains a trifunctional silicon compound containing, in one molecule, the three leaving groups and a bifunctional silicon compound containing, in one molecule, the two leaving groups. | 12-26-2013 |
20140145230 | ENCAPSULATING SHEET, OPTICAL SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 μm or more. | 05-29-2014 |
20140178677 | ENCAPSULATING SHEET - An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 μm or more and 1,000 μm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer. | 06-26-2014 |
20150076552 | SILICONE RESIN COMPOSITION, SEMI-CURED MATERIAL SHEET, PRODUCING METHOD OF SILICONE CURED MATERIAL, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray. | 03-19-2015 |
Patent application number | Description | Published |
20090204001 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC APPARATUS - A base has a plurality of projections or recesses. Each of the projections or recesses corresponds to one channel of vibration elements. Each of the vibration elements has a plurality of MUT elements. Each of the MUT elements transmits and receives ultrasonic waves. A plurality of MUT elements are arranged in each of the projections or recesses. Consequently, each of the vibration elements can transmit and receive ultrasonic waves having radiation surfaces curved along the surfaces of the projections or recesses. | 08-13-2009 |
20110295124 | ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer. | 12-01-2011 |
20130167342 | ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer. | 07-04-2013 |
20130303917 | ULTRASOUND PROBE AND ULTRASOUND DIAGNOSIS APPARATUS - An ultrasound probe and an ultrasound diagnosis apparatus are provided that are capable of reducing the frequency with which false images are generated in an ultrasound diagnostic image. An ultrasound probe of an embodiment comprises a transducer element unit in which multiple groups of transducer elements are arranged, and a selection means. Each of the multiple groups of transducer elements has a first to n | 11-14-2013 |
20140070668 | ULTRASONIC TRANSDUCER, MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE - The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves. | 03-13-2014 |
20140316272 | ULTRASOUND DIAGNOSIS APPARATUS - The ultrasound diagnosis apparatus is provided capable of preventing visibility of the ultrasound image from being impaired when piercing a puncture needle. The ultrasound diagnosis apparatus according to the embodiments includes an image processor and a display controller. The image processor generates an ultrasound image based on echo signals received by the ultrasound probe. The display controller causes a display unit to display, along with the ultrasound image, a marker which indicates allowable change range for the orientation of the puncture needle defined by the guide mechanism for guiding the puncture needle to the puncture target part. | 10-23-2014 |