Patent application number | Description | Published |
20090004841 | Forming vias using sacrificial material - In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed. | 01-01-2009 |
20090047783 | METHOD OF REMOVING UNWANTED PLATED OR CONDUCTIVE MATERIAL FROM A SUBSTRATE, AND METHOD OF ENABLING METALLIZATION OF A SUBSTRATE USING SAME - A method of removing unwanted material from a substrate includes providing a system ( | 02-19-2009 |
20090053466 | Heat resistant halogen free substrate core material - In one embodiment, a substrate includes a core material formed from a filler including aluminum trihydrate and a secondary filler material. The secondary filler material has a secondary decomposition reaction that occurs at a temperature higher than a reflow temperature reached during processing of the substrate, or the secondary filler traps water released at reflow temperature by aluminum trihydrate. Other embodiments are described and claimed. | 02-26-2009 |
20090166858 | LGA SUBSTRATE AND METHOD OF MAKING SAME - An LGA substrate includes a core ( | 07-02-2009 |
20090238516 | SUBSTRATES FOR OPTICAL DIE STRUCTURES - Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard. | 09-24-2009 |
20090314538 | Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same - A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface. | 12-24-2009 |
20100301484 | LGA SUBSTRATE AND METHOD OF MAKING SAME - An LGA substrate includes a core ( | 12-02-2010 |
20110123725 | METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE - A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer ( | 05-26-2011 |