Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Okushima, JP

Kentaro Okushima, Higashiomi JP

Patent application numberDescriptionPublished
20100237225Ingot Mold for Silicon Ingot and Method for Making the Same - A method for forming a mold comprises forming a body by kneading a ceramic powder comprising a silicon nitride powder and a first binder solution; forming a slurry by adding a second binder solution to the body; and forming a release layer by attaching the slurry to a surface of a mold base. A method for manufacturing a solar cell element comprises forming a silicon ingot by solidifying a silicon melt in the mold obtained by the above-described method for forming a mold; slicing the silicon ingot into substrates each having a predetermined thickness; forming a diffusion layer on each of the substrates; and forming an electrode on a surface of the diffusion layer.09-23-2010

Kentaro Okushima, Shiga JP

Patent application numberDescriptionPublished
20090159230Mold Forming and Molding Method - A mold forming and molding technology operable to produce a silicon ingot suitable for obtaining a solar cell substrate is disclosed. A slurry is prepared comprising particles with surface oxide layers operable to bond the particles to each other. An external force is applied to the slurry to eliminate cohesion of the particles to form a de-cohesive slurry, and an inner surface of a mold base is coated with the de-cohesive slurry to form a releasing layer that reduces defects in the silicon ingot.06-25-2009

Motohiro Okushima, Tokyo JP

Shingo Okushima, Kawasaki-Shi JP

Patent application numberDescriptionPublished
20090273124NANOIMPRINTING METHOD AND MOLD FOR USE IN NANOIMPRINTING - A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other.11-05-2009
20100072653IMPRINTING APPARATUS AND METHOD THEREFOR - There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.03-25-2010
20100072664IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.03-25-2010
20100072667IMPRINTING METHOD - An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled.03-25-2010
20100078840IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage.04-01-2010
20120113197RECORDING APPARATUS AND LIQUID EJECTION HEAD - A recording apparatus including an ink tank and a recording head having a flow path forming portion that has an ejection orifice plate having plural ink ejection orifices and a liquid chamber provided for each orifice to supply ink to the orifices, and an energy generating element for ejecting ink in the chamber. A surface layer of the flow path forming portion opposes to the outside of the plate. An opening is provided opposing to the orifices in the surface layer. An ink reservoir is provided between the plate and the opening. A circulation flow path communicating with the ink reservoir is provided. The area of the opening is larger than that of the orifice. Both ends of the circulation flow path are respectively connected to inlet and outlet portions connected to the circulation flow path. The inlet and outlet portions and liquid chamber are connected to the ink tank.05-10-2012

Patent applications by Shingo Okushima, Kawasaki-Shi JP

Tomoyasu Okushima, Kyoto JP

Patent application numberDescriptionPublished
20130057915PRINTING APPARATUS AND PRINTING METHOD - A printing apparatus for performing printing under control of a head controller which receives image data, and which is connected to a print head for printing. The head controller includes an image data shaping unit for shaping the image data into print data corresponding to the print head, a sequence information generating unit for generating sequence information, based on the print data, showing operation at a time of printing by the print head, a data guarantee information adding unit for adding data guarantee information to the print data and the sequence information, for error detection based on the print data and the sequence information, a readout unit for reading print information including the print data, the sequence information, and the data guarantee information, and an information inspecting unit for inspecting propriety of the print information based on the data guarantee information and the sequence information read by the readout unit.03-07-2013

Yoshiki Okushima, Nagano-Shi JP

Patent application numberDescriptionPublished
20100032196MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a multilayer wiring board having a wiring layer, a pad, an insulating layer provided between the wiring layer and the pad, and a plurality of connecting vias provided on the insulating layer and connecting the wiring layer to the pad, the connecting vias are provided on a peripheral edge of the pad.02-11-2010