Patent application number | Description | Published |
20090156272 | MOBILE TERMINAL - Disclosed is a mobile terminal including a ring section having a plurality of operation devices provided on a substantially circular enclosure, a terminal body section having at least a display device,a pair of hinge sections which have a rotation axis substantially parallel to a tangent line of a ring circumference direction of the ring section and rotatably journal the terminal body section at a rotation angle of at least 90 degrees with respect to the ring section, and a body-ring interface section which performs at least signal transmission between the ring section and the terminal body section. | 06-18-2009 |
20110279897 | COVER UNIT AND MOBILE TERMINAL INCLUDING THE SAME - A cover unit includes a first cover that is movable between a cover position and an exposed position. A second cover slidably is movable in a direction perpendicular to its visible surface. A cover moving mechanism moves the second cover, wherein, when the first cover is at the cover position, the second cover is at such a height that the visible surface of the second cover is substantially coplanar with a visible surface of the first cover. When the first cover is moved from the cover position to the exposed position, the second cover is moved to such a height such that the visible surface of the second cover is moved by at least an amount that corresponds with the thickness of the first cover. When the first cover is at the exposed position, the first cover is above the visible surface of the second cover. | 11-17-2011 |
20120262857 | TERMINAL APPARATUS AND HINGE STRUCTURE - A terminal apparatus that includes a first housing, a second housing, and a hinge mechanism that slidably couples the first housing to the second housing in each of an open state and a closed state with respect to the second housing. The hinge mechanism includes a base portion and a movable portion, the movable portion being slidable with respect to the base portion in a direction which the first housing moves away from the second housing when the first housing transitions from the closed state to the open state with respect to the second housing. | 10-18-2012 |
Patent application number | Description | Published |
20100130019 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method for a semiconductor device includes: forming a first layer on a member to be etched; forming a first hard mask that includes a first hard mask pattern, in the first layer; forming a second layer on the first hard mask and on an exposed surface of the member to be etched; removing by selective etching the second layer to form a side wall core that includes a core pattern; forming side wall spacers on side walls of the side wall core; and using the side wall spacers and the first hard mask to remove by etching the member to be etched. | 05-27-2010 |
20100155802 | Semiconductor device and method of forming semiconductor device - A method of forming a semiconductor device includes the following processes. First grooves are formed in a first insulating layer. A conductive material is formed which fills in each of the first grooves. A first mask is formed over the first insulating layer and the conductive material. The first mask has openings that define second grooves crossing the first grooves in plan view. The second grooves are formed in the first insulating layer and the conductive material by using the first mask. A plurality of conductive pillars are formed by removing a part of the conductive material in each of the first grooves. | 06-24-2010 |
20110086477 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method may include the following processes. A semiconductor substrate is partially removed using a first insulating film having first and second portions as a mask to form first and second pillars of the semiconductor substrate. A second insulating film is formed on side surfaces of the first and second pillars. A silicon film is formed on the first and second insulating films. A first part of the silicon film, which is on upper surfaces of the first and second portions, is removed. A coating film, which covers the upper surfaces of the first and second portions, is formed over the semiconductor substrate. The coating film is partially removed to expose the first insulating film and a second part of the silicon film. The second part is on side surfaces of the first and second portions. The second part is removed by dry etching. | 04-14-2011 |
20110207330 | Method of manufacturing semiconductor device - A sidewall core that is slimmed is formed in a memory cell array area by patterning a polysilicon layer formed over a silicon nitride layer. A silicon oxide layer that at least covers side surfaces of the sidewall core and the polysilicon layer are sequentially formed and an embedded hard mask is formed by etching back the polysilicon layer. Thereafter, the silicon nitride layer within the memory cell array area that does not overlap with the sidewall core or the embedded hard mask and the silicon nitride layer within a peripheral circuit area that overlaps with a positioning monitor mark are exposed by etching the silicon oxide layer, and then the silicon nitride layer that is to be etched is patterned. | 08-25-2011 |
20110217824 | ELECTRODE STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes the following processes. A first groove is formed in a first insulating film. A first conductive film is formed on inner surfaces of the first groove. A second groove is formed in the first insulating film to remove a part of the first conductive film. The second groove intersects the first groove. | 09-08-2011 |
Patent application number | Description | Published |
20100025710 | Semiconductor device and fabrication method thereof - There is provided a semiconductor device including: a semiconductor chip having a penetrating electrode penetrating through from a first main surface of the semiconductor chip to a second main surface on the opposite side thereof, a photoreceptor portion formed on the first main surface, and a first wire at a periphery of the photoreceptor portion; a light transmitting chip adhered to the first main surface at the periphery of the light transmitting chip, with a bonding layer interposed between the light transmitting chip and the first main surface, the light transmitting chip covering the light transmitting chip; and a light blocking resin layer formed only on the side surfaces of the light transmitting chip and the bonding layer. | 02-04-2010 |
20100055834 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - An improved method of manufacturing a semiconductor device. The resulting semiconductor device operates properly even when a plurality of semiconductor chips is mounted. One or more semiconductor chips are mounted on the bottom surface of a mounting substrate, the semiconductor chips are fixed to a supporting substrate with adhesive, and then the semiconductor chips are sealed with resin. Subsequently, another semiconductor chips are mounted on the top surface of the mounting substrate. | 03-04-2010 |
20100197079 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE - A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder. | 08-05-2010 |
20110287585 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE - A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder. | 11-24-2011 |
Patent application number | Description | Published |
20090300918 | METHODS OF MANUFACTURING ROTOR CORE FOR MOTOR-DRIVEN VALVE, ROTOR FEED SCREW AND ROTOR - To improve methods of manufacturing a rotor core, a rotor feed screw, and a rotor for motor-driven valves and reduce manufacturing cost of the motor-driven valves. A method of manufacturing the rotor core comprising the steps of: using an openable/closable die device | 12-10-2009 |
20110315906 | FEMALE SCREW MEMBER, MOTOR OPERATED VALVE USING THE SAME, AND METHOD FOR PRODUCING FEMALE SCREW MEMBER FOR MOTOR OPERATED VALVE - A female screw member includes a female screw part with a female screw, and a projection part projecting in the direction of a center shaft of the female screw and having a working face in the rotating direction centering on the center shaft. The female screw part and projection part are integrally molded with a resin. The projection part has a spiral inclination face spirally inclining by one round from the working face centering on the center shaft of the female screw. The height H of the working face is equal to or smaller than a pitch P of the female screw. Using the projection part as a fully opening fixing stopper, a motor operated valve includes a valve main body having a valve seat, the female screw member attached to the valve main body, a motor having a rotator and stator, and a valve shaft. The valve shaft is screwed to a female screw of the female screw member, and is rotated and driven by the rotor, and has a fully opening movable stopper capable of contacting the fully opening fixing stopper. | 12-29-2011 |
20140231684 | STEPPING MOTOR AND MOTORIZED VALVE USING IT - To provide a stepping motor which can precisely and reliably detect stopping of a rotor with respect to a stopper with a simple structure, i.e., positioning of a base point of the rotor, and provide a motorized valve using it. | 08-21-2014 |
20140319391 | FEMALE SCREW MEMBER, MOTOR OPERATED VALVE USING THE SAME, AND METHOD FOR PRODUCING FEMALE SCREW MEMBER FOR MOTOR OPERATED VALVE - A female screw member includes a female screw part with a female screw, and a projection part projecting in the direction of a center shaft of the female screw and having a working face in the rotating direction centering on the center shaft. The female screw part and projection part are integrally molded with a resin. The projection part has a spiral inclination face spirally inclining by one round from the working face centering on the center shaft of the female screw. The height H of the working face is equal to or smaller than a pitch P of the female screw. Using the projection part as a fully opening fixing stopper, a motor operated valve includes a valve main body having a valve seat, the female screw member attached to the valve main body, a motor having a rotator and stator, and a valve shaft. The valve shaft is screwed to a female screw of the female screw member, and is rotated and driven by the rotor, and has a fully opening movable stopper capable of contacting the fully opening fixing stopper. | 10-30-2014 |