Patent application number | Description | Published |
20080315244 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - Provided are a light emitting diode (LED) and a method for manufacturing the same. The LED includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The active layer includes a well layer and a barrier layer that are alternately laminated at least twice. The barrier layer has a thickness at least twice larger than a thickness of the well layer. | 12-25-2008 |
20100059735 | LIGHT EMITTING DIODE HAVING BARRIER LAYER OF SUPERLATTICE STRUCTURE - A light emitting diode (LED) having a barrier layer with a superlattice structure is disclosed. In an LED having an active region between an GaN-based N-type compound semiconductor layer and a GaN-based P-type compound semiconductor layer, the active region comprises a well layer and a barrier layer with a superlattice structure. As the barrier layer with the superlattice structure is employed, it is possible to reduce occurrence of defects caused by lattice mismatch between the well layer and the barrier layer. | 03-11-2010 |
20130207147 | UV LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - The present disclosure provides a UV light emitting diode and a method of manufacturing the same. The UV light emitting diode includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer sequentially formed on a substrate, an electrode formed on the second conductive type semiconductor layer, and an opening formed by removing at least portions of the first conductive type semiconductor layer, the active layer, the second conductive type semiconductor layer, the reflective structure and the transparent electrode to expose a portion of the first conductive type semiconductor layer therethrough. In the UV light emitting diode, UV light is emitted from the active layer, passes through the opening, and then travels outside. | 08-15-2013 |
Patent application number | Description | Published |
20120014115 | ASPHERICAL LED LENS AND LIGHT EMITTING DEVICE INCLUDING THE SAME - Exemplary embodiments of the present invention relate to an aspherical light emitting diode (LED) lens and a light emitting device including the same. The aspherical LED lens includes a light exit plane concavely depressed near a central axis, a light entrance plane including a conical plane having a vertex located on the central axis, and a plurality of protrusions arranged on a portion of a side surface of the light exit plane. The aspherical LED lens has a radially symmetrical structure with respect to the central axis. | 01-19-2012 |
20140071696 | ASPHERICAL LED LENS AND LIGHT EMITTING DEVICE INCLUDING THE SAME - Exemplary embodiments of the present invention relate to an aspherical light emitting diode (LED) lens and a light emitting device including the same. The aspherical LED lens includes a light exit plane concavely depressed near a central axis, a light entrance plane including a conical plane having a vertex located on the central axis, and a plurality of protrusions arranged on a portion of a side surface of the light exit plane. The aspherical LED lens has a radially symmetrical structure with respect to the central axis. | 03-13-2014 |
20140312380 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 10-23-2014 |
20150204510 | ASPHERICAL LED LENS AND LIGHT EMITTING DEVICE INCLUDING THE SAME - An aspherical lens includes a light entrance plane configured to receive light emitted from a light source and a light exit plane configured to radiate the light received by the light entrance plane. The light exit plane includes semispherical convex portions disposed on an upper surface of the aspherical lens, a concavely depressed portion comprising an overlapping region where the semispherical convex portions partially overlap each other at a central axis, a side portion connected with the semispherical convex portions, and an upper surface of each of the semispherical convex portions having a first flat portion. | 07-23-2015 |
20150214453 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 07-30-2015 |
Patent application number | Description | Published |
20120025244 | LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTOR - Exemplary embodiments of the present invention provide light-emitting diodes having a distributed Bragg reflector. A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range. The first distributed Bragg reflector has a laminate structure having an alternately stacked SiO | 02-02-2012 |
20130146925 | LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTOR - A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light. | 06-13-2013 |
20130146929 | LIGHT EMITTING DIODE - Disclosed is a light emitting diode (LED) comprising a light emitting stacked structure and an electrode structure formed to have a pattern on the light emitting stacked structure. The electrode structure of the LED includes a cluster of reflectors disposed along the pattern on the light emitting stacked structure, and a pad material layer formed to entirely cover the reflectors. | 06-13-2013 |
20130234192 | LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD - Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area. | 09-12-2013 |
20140117395 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip. | 05-01-2014 |
20140299905 | LIGHT EMITTING DIODE WITH IMPROVED LUMINOUS EFFICIENCY - A light-emitting diode includes a substrate, and a light-emitting structure disposed on the substrate. The light-emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including concave portions and convex portions is disposed on the second conductivity-type semiconductor layer. Micro-lenses are disposed on the transparent electrode layer and completely cover the concave portions, and only partially cover the convex portions that are disposed between the micro-lenses. | 10-09-2014 |
20150014702 | LIGHT-EMITTING DIODE HAVING IMPROVED LIGHT EXTRACTION EFFICIENCY AND METHOD FOR MANUFACTURING SAME - Disclosed are a light-emitting diode having improved light extraction efficiency and a method for manufacturing same. This light-emitting diode includes: a gallium nitride substrate having an upper surface and a lower surface; and a gallium nitride semiconductor multilayer structure disposed on the lower surface of the substrate, and having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. Herein, the gallium nitride substrate has a main pattern having a protruding portion and a concave portion on the upper surface, and a rough surface formed on the protruding portion of the main pattern. The light-emitting diode is capable of improving light extraction efficiency through the upper surface thereof since the rough surface is formed along with the main pattern on the upper surface of the gallium nitride substrate. | 01-15-2015 |
20150144981 | LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTOR - A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light. | 05-28-2015 |
20150236210 | LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD - Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer, a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer, a second electrode pad electrically connected to the second conductive type semiconductor layer, and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area. | 08-20-2015 |
20150236216 | LIGHT EMITTING DIODE - Disclosed is a light emitting diode (LED) comprising a light emitting stacked structure and an electrode structure formed to have a pattern on the light emitting stacked structure. The electrode structure of the LED includes a cluster of reflectors disposed along the pattern on the light emitting stacked structure, and a pad material layer formed to entirely cover the reflectors. | 08-20-2015 |
20150311390 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip. | 10-29-2015 |
Patent application number | Description | Published |
20140353692 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - A light emitting diode includes light emitting cells disposed on a substrate and interconnections connecting the light emitting cells to each other. Each of the light emitting cells includes a first semiconductor layer, a second semiconductor layer, an active layer disposed between the first semiconductor layer and the second semiconductor layer, and a transparent electrode layer disposed on the second semiconductor layer, wherein the first and second semiconductor layers have different conductivity types. The interconnections include a common cathode commonly connecting first and second light emitting cells of the light emitting cells, the first and second light emitting cells share the first semiconductor layer, the transparent electrode layer is continuously disposed between the first and second light emitting cells, and the common cathode is electrically connected to the first and second light emitting cells through the transparent electrode layer. | 12-04-2014 |
20150243706 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - An exemplary light emitting diode includes a substrate; a first light emitting cell and a second light emitting cell disposed over the substrate and separated from each other; and an interconnection electrically connecting the first light emitting cell to the second light emitting cell. Each of the first and second light emitting cells includes a first conductive-type semiconductor layer, a second conductive-type semiconductor layer disposed over the first conductive-type semiconductor layer, and an active layer disposed between the first conductive-type semiconductor layer and the second conductive-type semiconductor layer. At least one of the first light emitting cell and the second light emitting cell includes a side surface inclined with respect to the substrate. The side surface includes a first inclined portion forming an acute angle with respect to the substrate, a second inclined portion forming an obtuse angle with respect to the substrate, and an inclination discontinuity section. | 08-27-2015 |
20160111600 | LIGHT EMITTING DIODE, METHOD OF FABRICATING THE SAME AND LED MODULE HAVING THE SAME - A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer disposed on the first conductive-type semiconductor layer and an active layer interposed between the first and the second conductive-type semiconductor layers; and a first electrode disposed on the mesa, wherein the first conductive-type semiconductor layer includes a first contact region disposed around the mesa along an outer periphery of the first conductive-type semiconductor layer; and a second contact region at least partially surrounded by the mesa, the first electrode is electrically connected to at least a portion of the first contact region and at least a portion of the second contact region, and a linewidth of an adjoining region between the first contact region and the first electrode is greater than the linewidth of an adjoining region between the second contact region and the first electrode. | 04-21-2016 |
Patent application number | Description | Published |
20110116921 | WATER PUMP PROVIDED WITH A BEARING - A water pump that is equipped with a bearing, may include a drive shaft, at least two bearings of an arc type that are mounted around the exterior circumference of the drive shaft and being engaged with each other, a housing that fixes the at least two bearings of the art type therein such that the drive shaft can rotate in the at least two bearings of the arc type. | 05-19-2011 |
20110116947 | Electric water pump - The present invention relates to an electric water pump having improved performance and durability. The electric water pump may include a stator generating a magnetic field according to a control signal, a rotor rotated by the magnetic field, a pump cover having an inlet and an outlet, a body having a front surface forming a volute chamber, a stator chamber, and a rotor chamber, the stator mounted in the stator chamber and the rotor mounted in the rotor chamber, a shaft having a central axis, fixed to the rotor and mounted in the rotor chamber, and an impeller fixed to the shaft so as to rotate together with the shaft, pressurizing the coolant having flowed in through the inlet, and mounted in the volute chamber, wherein the rotor chamber is fluidly connected to the volute chamber, and the stator chamber is fluidly closed and sealed from the rotor chamber. | 05-19-2011 |
20110116948 | METHOD FOR MANUFACTURING STATOR FOR ELECTRIC WATER PUMP - A method for manufacturing a stator for an electric water pump may be used for manufacturing the stator used in the electric water pump. In the electric water pump which includes stator assembly for an electric water pump, wherein the stator assembly including a plurality of core-insulator assemblies generates a magnetic field according to a control signal and a rotor is rotated by the magnetic field generated at the stator assembly to pressurize coolant, the method for manufacturing the stator assembly may include a) stacking a plurality of pieces made of a magnetic material to form a core stack, b) molding an insulator to the core stack, c) coiling a coil to the insulator to form a core-insulator assembly so as to form a magnetic path, and d) connecting the respective core-insulator assembly in an annular shape in sequence to form the stator assembly. | 05-19-2011 |
20110116952 | Electric water pump - An electric water pump apparatus may include a body having a stator chamber and a rotor chamber therein, a stator having a hollow cylindrical shape and being disposed in the stator chamber and generating a magnetic field, wherein the stator fluidly insulates the stator chamber and the rotor chamber, a rotor disposed in the rotor chamber and enclosed by the stator, wherein the rotor is rotated by the magnetic field, and a pump cover connected to the body and forming a volute chamber therein, wherein the volute chamber and the rotor chamber are fluidly-communicated through a connecting hole formed to the body and a coolant is supplied to the rotor chamber through the connection hole, wherein the stator includes a stator groove formed in an inner circumference therein and the stator groove is fluid-connected to the rotor chamber and the volute chamber through the connection hole. | 05-19-2011 |
20110116953 | Electric Water Pump - An electric water pump may include a stator generating a magnetic field, a rotor rotated by the magnetic field, a pump cover, a body having a volute chamber with the pump chamber, a stator chamber and a rotor chamber, the stator being mounted in the stator chamber and the rotor being mounted in the rotor chamber, a shaft fixed to the rotor, an impeller fixed to the shaft in the volute chamber, a driver case mounted at a rear end of the body and having a rear surface opened backward and formed of a driver chamber therein, and a driver mounted in the driver chamber and applying a control signal to the stator, wherein the case surface is provided with an insert portion protruded forward from an external circumference thereof and inserted in a rear end portion of the body, and a fixing groove in which the insert portion is inserted. | 05-19-2011 |
20110116954 | Electric Water Pump - An electric water pump apparatus may include a body, a stator disposed in the body, a rotor in the stator, a pump cover having an inlet and an outlet, wherein a front surface of the body and the pump cover form a volute chamber, wherein a stator chamber is formed at an outer portion in the body in a radial direction and the stator is mounted in the stator chamber, and wherein a rotor chamber is formed at an inner portion in the body and the rotor is mounted in the rotor chamber, a shaft rotatably coupled to the front surface and fixed into the rotor, and an impeller fixed to a front portion of the shaft, wherein the shaft includes a first shaft connecting the impeller and a front end portion of the rotor and a second shaft connected to a rear end portion of the rotor along the central axis of the shaft. | 05-19-2011 |
20140271283 | METHOD FOR MANUFACTURING STATOR FOR ELECTRIC WATER PUMP - A method for manufacturing a stator for an electric water pump may be used for manufacturing the stator used in the electric water pump. In the electric water pump which includes stator assembly for an electric water pump, wherein the stator assembly including a plurality of core-insulator assemblies generates a magnetic field according to a control signal and a rotor is rotated by the magnetic field generated at the stator assembly to pressurize coolant, the method for manufacturing the stator assembly may include a) stacking a plurality of pieces made of a magnetic material to form a core stack, b) molding an insulator to the core stack, c) coiling a coil to the insulator to form a core-insulator assembly so as to form a magnetic path, and d) connecting the respective core-insulator assembly in an annular shape in sequence to form the stator assembly. | 09-18-2014 |