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Ofner
Bernd Ofner, Hebertshausen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100031936 | Supercharged Internal Combustion Engine and Method for Monitoring Whether the Crankcase Vent Has Been Connected - A supercharged internal combustion engine in a motor vehicle includes a venting device for the crankcase of the internal combustion engine and a compressor for supercharging the internal combustion engine. A discharge opening for discharging the crankcase gas is provided upstream of the compressor and a sensor for determining the charge pressure of the compressor is provided downstream of the compressor. The discharge opening is connected to the crankcase by a first connection for the airflow, in particular a hose connection. In order to cost-effectively monitor the venting of the crankcase of the internal combustion engine, an opening, to which the charge pressure of the compressor is applied, is provided downstream of the compressor. The first connection for the airflow includes a closing device for closing the opening to which the charge pressure is applied, wherein the closing device closes the opening if the first connection is connected to the discharge opening. | 02-11-2010 |
Bertram Ofner, Kapfenberg AT
| Patent application number | Description | Published |
|---|---|---|
| 20110214830 | METHOD AND APPARATUS FOR PRODUCING HOLLOW FUSING BLOCKS - To produce hollow ingots, at least two consumable electrodes having a diameter of at least 1.0 times the wall thickness of the hollow ingots are melted in a short, water-cooled mold that is flared particularly in a T-shape in the area of the consumable electrodes, wherein the inner wall of the hollow ingot is formed by a mandrel with a conicity of at least 1.5% that is installed in the mold from above, and the level of the liquid heel is maintained below the T-shaped flaring of the mold. | 09-08-2011 |
Gerald Ofner US
| Patent application number | Description | Published |
|---|---|---|
| 20110020985 | Integrated Circuit Package and a Method for Forming an Integrated Circuit Package - A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture. | 01-27-2011 |
Gerald Ofner, Singapore SG
| Patent application number | Description | Published |
|---|---|---|
| 20100314721 | Semiconductor Package and Method for Producing the Same - A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface. | 12-16-2010 |
Gerald Ofner, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20080265367 | Magnetically Alignable Integrated Circuit Device - An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate. | 10-30-2008 |
| 20100001396 | REPAIRABLE SEMICONDUCTOR DEVICE AND METHOD - Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer. | 01-07-2010 |
| 20110241218 | Electronic Device and Manufacturing Method - A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers. | 10-06-2011 |
Gerald Ofner, Schierling DE
| Patent application number | Description | Published |
|---|---|---|
| 20090160053 | METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE - A method of manufacturing a semiconductor device is disclosed. One embodiment provides a carrier. Semiconductor chips are placed over the carrier. The semiconductor chips include contact elements. A polymer material is applied over the semiconductor chips and the carrier. The polymer material is removed until the contact elements are exposed. The carrier is removed from the semiconductor chips. | 06-25-2009 |
Hanspeter Ofner, Pucking AT
| Patent application number | Description | Published |
|---|---|---|
| 20080289450 | Conveyor System, Composite System and Method For Coupling Metallurgical Methods - A conveying system comprising elements for conveying lumpy, particularly hot, conveying stock and a cover for shielding the conveying stock. Disclosed are measures for inerting the conveying stock. A combined system encompasses a reduction plant for reducing oxides in a continuous process and processing unit for producing liquid metal in a discontinuous process. The reduction product is deliverable from the reduction plant to the processing unit. A method for coupling a reduction method used for reducing oxides in a continuous process and a method used for producing liquid metal in a discontinuous process. A reduction product from the reduction method is fed to the liquid metal production method for processing. | 11-27-2008 |
| 20110101577 | CONVEYOR SYSTEM, COMPOSITE SYSTEM AND METHOD FOR COUPLING METALLURGICAL METHODS - A conveying system comprising elements for conveying lumpy, particularly hot, conveying stock and a cover for shielding the conveying stock. Disclosed are measures for inerting the conveying stock. A combined system encompasses a reduction plant for reducing oxides in a continuous process and processing unit for producing liquid metal in a discontinuous process. The reduction product is deliverable from the reduction plant to the processing unit. A method for coupling a reduction method used for reducing oxides in a continuous process and a method used for producing liquid metal in a discontinuous process. A reduction product from the reduction method is fed to the liquid metal production method for processing. | 05-05-2011 |
Silvio Ofner, Muenchenstein CH
| Patent application number | Description | Published |
|---|---|---|
| 20080242698 | Organic Compounds - The invention relates to novel diamines of the formula | 10-02-2008 |
Silvio Ofner, Basel CH
| Patent application number | Description | Published |
|---|---|---|
| 20110288057 | SALICYLIC ACID DERIVATIVES BEING FARNESYL PYROPHOSPHATE SYNTHASE ACTIVITY INHIBITORS - The invention relates to the use of and mainly novel compounds of the formula I | 11-24-2011 |