Oda, Saitama
Daizo Oda, Saitama JP
Patent application number | Description | Published |
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20090072399 | SEMICONDUCTOR MOUNTING BONDING WIRE - There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof. | 03-19-2009 |
20110120594 | BONDING WIRE FOR SEMICONDUCTOR - It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %. | 05-26-2011 |
20120094121 | COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR - The present invention is a copper-based bonding wire for use in a semiconductor element. The bonding wire of the present invention can be manufactured with an inexpensive material cost, and has a superior PCT reliability in a high-humidity/temperature environment. Further, the bonding wire of the present invention exhibits: a favorable TCT reliability through a thermal cycle test; a favorable press-bonded ball shape; a favorable wedge bondability; a favorable loop formability, and so on. Specifically, the bonding wire of the present invention is a copper alloy bonding wire for semiconductor manufactured by drawing a copper alloy containing 0.13 to 1.15% by mass of Pd and a remainder comprised of copper and unavoidable impurities. | 04-19-2012 |
20120118610 | BONDING WIRE FOR SEMICONDUCTOR - There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume. | 05-17-2012 |
20130306352 | BONDING WIRE FOR SEMICONDUCTOR - There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume. | 11-21-2013 |
Hisanori Oda, Saitama JP
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20130068542 | WEIGHING DEVICE HAVING A WEIGHING CHAMBER - A weighing device is provided that suppresses air convection currents generated in a weighing chamber in the opening/closing of a door of the chamber with a relatively simple configuration. A weighing space is partitioned into two spaces with a partition plate to form a lower small-capacity weighing chamber, which enables to settle down the convection in a short time if convection is generated in the chamber. Suspended walls adjacent to the doors are attached to the partition plate edge sides along the door opening/closing directions. Even when a door is opened, warm air stagnant in the upper space in the chamber is restricted or blocked to flow out to the outside by the suspended walls, which generates no convection or slight convection, which settles down in a short time, without adverse effect on a weighing operation. The upper space may be utilized for another purpose such as a neutralization chamber. | 03-21-2013 |
Masahiro Oda, Saitama JP
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20080271352 | Traffic Sign Apparatus - There is provided a traffic sign apparatus that can improve the luminance of a sign surface which emits light by ultraviolet irradiation, and the uniformity ratio of illuminance, so as to enhance the visibility thereof in the nighttime. The traffic sign apparatus | 11-06-2008 |
Nobuyuki Oda, Saitama JP
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20080255253 | ANIMAL MODEL FOR PROSTATIC STROMAL HYPERPLASIA - The present invention provides an animal model for prostatic stromal hyperplasia, and a method for screening for a substance effective for preventing/treating human benign prostatic hyperplasia using the animal model. The animal model for prostatic stromal hyperplasia is produced by implanting the fetal urogenital sinus of a non-human animal under the skin or beneath the prostatic capsule of a non-human animal belonging to the species of the same as or different from the said animal. A substance effective for preventing/treating human benign prostatic hyperplasia can be screened by administering a test substance to the animal model and measuring the preventive or therapeutic effect of the test substance upon the implanted tissue (fetal urogenital sinus or tissue derived therefrom). | 10-16-2008 |
Seiji Oda, Saitama JP
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20080308223 | Electronic component and manufacturing method thereof - It is possible to prevent defects arising when resin-sealing electronic components, caused by leakage defects, resin interfusion defects, or the like, and it is possible to easily resin-seal a number of electronic components all together. There is provided a method of manufacturing electronic components on which SAW chips are mounted by face down bonding on wiring electrodes formed on a main face of a collective substrate, comprising the steps of: placing a resin sheet on the main face of the collective substrate, on which the SAW chips have been mounted; accommodating the collective substrate, on which the SAW chips have been mounted, in a flexible and sealed bag, and then seal-closing the sealed bag; submerging the accommodating bag into a pressurized container filled with a liquid, and then sealing off the pressurized container; supplying a pressurizing fluid into the pressurized container, raising the pressure within the pressurized container, carrying out heat application to heat-cure the resin sheet, and thereby tightly adhering the resin sheet onto the main face side of the SAW chips and the collective substrate, on which the SAW chips have been mounted so as to resin-seal the collective substrate; taking out the sealed bag from the pressurized container; taking out the resin-sealed collective substrate, on which the SAW chips have been mounted, from the sealed bag; and cutting the resin-sealed collective substrate, which has been taken out, into individual pieces. | 12-18-2008 |
Tomohiko Oda, Saitama JP
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20090030306 | Endoscope Shape Detecting Apparatus - A detecting apparatus includes: a change-over switch for switching on/off display of a scope model on a liquid crystal monitor; a position calculating portion for calculating respective positions of source coils; a scope model generating portion for generating a scope model of an electronic endoscope based on the respective positions of the source coils calculated by the position calculating portion; and a selector for selectively outputting to the liquid crystal monitor a display-pause-time image stored in a display-pause-time image storing portion and a scope model image from the scope model generating portion; and a control portion for controlling each of these portions. The detecting apparatus thus displays an insertion shape of the endoscope at a timing as needed. | 01-29-2009 |
20090234223 | Surgery Assisting Apparatus and Treatment Assisting Apparatus - According to the invention, an endoscope system as a surgery assisting apparatus includes a surgery apparatus for performing treatment by abdominal operation procedure on a region to be treated in a body of a patient, and a luminal organ shape detecting apparatus used for assisting (supporting) the abdominal operation procedure. The luminal organ shape detecting apparatus is used as blood vessel position notifying means when procedure is performed by inserting a probe as a luminal organ insertion probe into a blood vessel, for example. This allows the luminal organ irrespective of the treatment to be easily and surely detected and enables a smooth procedure to be performed. | 09-17-2009 |
20090287047 | ENDOSCOPE APPARATUS - To facilitate a connection operation between a signal processing device and an endoscope apparatus in which a processing system that performs signal processing of image pickup signals of an electronic endoscope and a processing system that calculates an insertion shape of the endoscope are integrated, a scope connector | 11-19-2009 |
Yuichi Oda, Saitama JP
Patent application number | Description | Published |
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20100022771 | REACTION APPARATUS, AND REACTION METHOD - The present invention is directed at obtaining a high yield of a target substance and simultaneously securing high productivity. | 01-28-2010 |