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Norma
Norma Alcantar, Tampa, FL US
| Patent application number | Description | Published |
|---|---|---|
| 20100068264 | NIOSOME-HYDROGEL DRUG DELIVERY SYSTEM - Localized drug delivery systems are effective means to administer therapeutic concentrations and controlled release of drugs. A delivery system consisting of non-ionic surfactant vesicles (niosomes) packaged within a biodegradable, temperature and pH sensitive hydrogel network was developed. Drug behaviors were modeled using a fluorescent dye with similar physical properties as therapeutic drugs for cancer. The niosomes were embedded into a biodegradable hydrogel providing a stable niosome environment. A cross linked chitosan was used as the hydrogel, which is a liquid at room temperature, and gels inside the body. Depending on the conditions to which individual niosomes are exposed, the release rate can be controlled to last from 24 hours to more than 3 months. | 03-18-2010 |
Norma Lovhaugen, Asker NO
| Patent application number | Description | Published |
|---|---|---|
| 20100073454 | COMPUTER-PROCESSOR BASED INTERFACE FOR TELEPRESENCE SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT - A computer-implemented interface for a local telepresence video conferencing facility, pre-assigns displays at the local telepresence video conferencing facility to respective video images from remote telepresence video conference facilities such that respective video images from the remote telepresence video conference facilities will be displayed on corresponding displays at the local telepresence video conferencing facility once communications connections are made. A controller pre-assigns the displays according to control commands from a tactile input device prior to establishing the communication connections with the remote telepresence video conference facilities. A touchscreen display presents avatars of remote conference participants to illustrate pre-assignments of displays to particular remote telepresence video conference facilities prior to the communication connections being made. | 03-25-2010 |
Norma Sosa Cortes, Yorktown Heights, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100307572 | Heterojunction III-V Photovoltaic Cell Fabrication - A method for forming a heterojunction III-V photovoltaic (PV) cell includes performing layer transfer of a base layer from a wafer of a III-V substrate, the base layer being less than about 20 microns thick; forming an intrinsic layer on the base layer; forming an amorphous silicon layer on the intrinsic layer; and forming a transparent conducting oxide layer on the amorphous silicon layer. A heterojunction III-V photovoltaic (PV) cell includes a base layer comprising a III-V substrate, the base layer being less than about 20 microns thick; an intrinsic layer located on the base layer; an amorphous silicon layer located on the intrinsic layer; and a transparent conducting oxide layer located on the amorphous silicon layer. | 12-09-2010 |
| 20110048516 | Multijunction Photovoltaic Cell Fabrication - A method for fabrication of a multijunction photovoltaic (PV) cell includes providing a stack comprising a plurality of junctions on a substrate, each of the plurality of junctions having a respective bandgap, wherein the plurality of junctions are ordered from the junction having the smallest bandgap being located on the substrate to the junction having the largest bandgap being located on top of the stack; forming a top metal layer, the top metal layer having a tensile stress, on top of the junction having the largest bandgap; adhering a top flexible substrate to the metal layer; and spalling a semiconductor layer from the substrate at a fracture in the substrate, wherein the fracture is formed in response to the tensile stress in the top metal layer. | 03-03-2011 |
| 20110048517 | Multijunction Photovoltaic Cell Fabrication - A method for fabrication of a multijunction photovoltaic (PV) cell includes forming a stack comprising a plurality of junctions on a substrate, each of the plurality of junctions having a respective bandgap, wherein the plurality of junctions are ordered from the junction having the largest bandgap being located on the substrate to the junction having the smallest bandgap being located on top of the stack; forming a metal layer, the metal layer having a tensile stress, on top of the junction having the smallest bandgap; adhering a flexible substrate to the metal layer; and spalling a semiconductor layer from the substrate at a fracture in the substrate, wherein the fracture is formed in response to the tensile stress in the metal layer. | 03-03-2011 |
Norma Wigutoff, Seattle, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20110247898 | PORTABLE STEPPING SYSTEM - A stepping platform includes an upper step platform and a lower step platform. The stepping platform may be manually moved from a stored position to a deployed, and vice-versa. The upper step platform includes a tread surface and side walls that cooperate to define a cavity into which the lower step platform fits when the stepping platform is in the stored position. The lower step platform also includes a tread surface and side walls. In one embodiment, a height of the lower step platform is about half of an overall height of the upper step platform. Further, both platforms may include tread surface areas sized to support both feet of a standing adult. | 10-13-2011 |