Patent application number | Description | Published |
20090086449 | OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. The recess has a two-level structure of a bottom recess and a portion located over the bottom recess. A stepped portion extends from an upper end of a first side surface of the bottom recess to a lower end of a second side surface of the bottom recess. | 04-02-2009 |
20090086769 | SEMICONDUCTOR DEVICE - A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C. | 04-02-2009 |
20090097139 | OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape. | 04-16-2009 |
20090154321 | SEMICONDUCTOR DEVICE AND OPTICAL PICKUP DEVICE - By increasing the width of a lead terminal | 06-18-2009 |
20100001174 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams. | 01-07-2010 |
20100008203 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND OPTICAL PICKUP MODULE - A semiconductor element is mounted on a rectangular base of a package including the base and ribs provided on a pair of opposite external edges of the base. Electrode pads of the semiconductor element and connection electrodes provided on rib upper surfaces are connected to each other by metal wires. On the rib upper surfaces, spacers are provided at locations closer to the outside than the connection electrodes. A transparent lid adheres to the upper surfaces of the spacers to cover the entire surface of the package. The height of the spacers is greater than the diameter of the metal wires. | 01-14-2010 |
20100046564 | SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT USING SAME - A semiconductor device includes: a first lead having an element mounting portion; a second lead located in a same plane as the first lead, with a predetermined space left between the first lead and the second lead; a molding encapsulant made of a resin for fixing the leads; and a semiconductor element affixed to a top surface of the element mounting portion of the first lead. The molding encapsulant covers at least part of each of upper and lower surfaces of the leads. A resin injection hole mark, which is a mark of a hole through which the encapsulant has been injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead. | 02-25-2010 |
20100091630 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE - A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices. | 04-15-2010 |
20100091633 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE - A flat pre-board plate including connection electrodes, internal interconnections, and external-connection portions is prepared. This pre-board plate is cut at portions each located between adjacent ones of the connection electrodes, thereby forming trenches. A plurality of semiconductor elements are placed in each of the trenches. Electrode pads and the connection electrodes are connected to each other by metal wires. Transparent lids are placed on, and bonded to, spacers to cover the semiconductor elements. Thereafter, two lines of the connection electrodes arranged between adjacent ones of the trenches are separated from each other. Subsequently, adjacent ones of the semiconductor elements are also separated from each other. | 04-15-2010 |
20100157629 | SEMICONDUCTOR LASER APPARATUS - A switching power supply includes: a blanking period generating circuit for prohibiting a main switching element from being turned on from the time the main switching element is turned on to the time a blanking time elapses; a soft start period generating circuit for generating a soft start period from the start of the oscillation of the main switching element to the lapse of a soft start time; and a blanking time adjusting circuit for generating a signal for shortening the blanking time in the soft start period as compared with after the lapse of the soft start period. | 06-24-2010 |
20100158059 | SEMICONDUCTOR LASER APPARATUS - A semiconductor laser apparatus of the present invention includes: a semiconductor laser chip | 06-24-2010 |
20100308468 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - In a semiconductor device made of a plurality of materials, if the device is fabricated through a step of cutting the bonded plurality of materials, a boundary line of the plurality of materials is exposed on a cutting plane. Internal stress in the cutting remains at this boundary line to allow moisture and corrosive gas to easily enter into the device. In order to reduce the entrance of the moisture, the gas, and the like, the boundary appearing on the cutting plane is covered by a covering layer. At this time, partial cutting exposing the boundary line and not separating semiconductor devices are performed so that the covering layer can be formed with the plurality of semiconductor devices attached to the substrate. | 12-09-2010 |
20110001208 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - An insulation is provided in a portion surrounding a light receiving portion in a semiconductor element, and a sealing resin is provided around the insulation, thereby warping the insulation outward when viewed from the light receiving portion to prevent diffuse light from returning to the light receiving portion of the semiconductor element. | 01-06-2011 |
20110080928 | LASER DEVICE - To provide a laser device having high strength against mechanical stress. The laser device includes: a laser element; a plate-like lead frame including through-holes, and on whose front plane the laser element is mounted; lead terminals; trenches provided between an end of the lead frame in a laser emission direction of the laser element and the through-holes; and a resin dam formed on the front plane of the lead frame using a molding resin to protrude in an area surrounding the laser element including positions of the through-holes, and having an open part in the laser emission direction. The molding resin further fills the through-holes and the trenches, and bonds the lead frame and the resin dam by sealing together a part of each of the lead terminals and a part of the front plane and the back plane of the lead frame, in a vicinity of the lead terminals. | 04-07-2011 |
20110215343 | Semiconductor device and optical pickup device - By increasing the width of a lead terminal | 09-08-2011 |