| Patent application number | Description | Published |
|---|
| 20080253103 | MANUFACTURING METHOD OF A TRAY, A SOCKET FOR INSPECTION, AND A SEMICONDUCTOR DEVICE - The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved. | 10-16-2008 |
| 20090020860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality of leads arranged around the tab, the semiconductor chip mounted over the chip supporting surface of the tab, a plurality of suspending leads for supporting the tab, four bar leads arranged outside the tab so as to surround the tab and coupled to the suspending leads, a plurality of wires for coupling between the semiconductor chip and the leads, and a sealing body for sealing the semiconductor chip and the wires with resin, with first slits being formed respectively in first coupling portions of the bar leads for coupling with the suspending leads. | 01-22-2009 |
| 20090294965 | Method of Manufacturing A Semiconductor Device - Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping. | 12-03-2009 |
| 20090309213 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board. | 12-17-2009 |
| 20110049709 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping. | 03-03-2011 |
| 20110068450 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality of leads arranged around the tab, the semiconductor chip mounted over the chip supporting surface of the tab, a plurality of suspending leads for supporting the tab, four bar leads arranged outside the tab so as to surround the tab and coupled to the suspending leads, a plurality of wires for coupling between the semiconductor chip and the leads, and a sealing body for sealing the semiconductor chip and the wires with resin, with first slits being formed respectively in first coupling portions of the bar leads for coupling with the suspending leads. | 03-24-2011 |
| 20110129325 | MANUFACTURING METHOD OF A TRAY, A SOCKET FOR INSPECTION, AND A SEMICONDUCTOR DEVICE - The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved. | 06-02-2011 |
| 20110133329 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The heat-release properties of semiconductor device are to be improved and the reliability thereof is to be improved. | 06-09-2011 |
| 20110163438 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board. | 07-07-2011 |
| 20120007238 | Method of Manufacturing a Semiconductor Device - Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping. | 01-12-2012 |
| 20120061817 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board. | 03-15-2012 |
| Patent application number | Description | Published |
|---|
| 20080286902 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate. | 11-20-2008 |
| 20090091031 | Semiconductor device - A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon. | 04-09-2009 |
| 20090291529 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate. | 11-26-2009 |
| 20110020984 | Method of Manufacturing A Semiconductor Device - A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate. | 01-27-2011 |
| Patent application number | Description | Published |
|---|
| 20080208995 | ELECTRONIC MAIL PROCESSING METHOD AND ELECTRONIC MAIL PROCESSING SYSTEM - Even when setting a complicated spam judging condition, it is possible to reliably determine a necessary electronic mail in reality (i.e a mail that is not a spam mail), without deleting a necessary electronic mail or the like. Based on the assumption that an electronic mail from a mail address to which transmission was performed in the past has a high possibility of not being a spam mail, a transmission destination mail address of an electronic mail transmitted to outside the organization is recorded as a permitted mail address (Step 506-Step 510), and when a transmission source address of an electronic mail destined to inside the organization matches a mail address registered in a permitted mail address database (Step 511: Yes), processing is performed to unconditionally receive this electronic mail (Step 504). | 08-28-2008 |
| 20090087048 | MEDICAL REPORT SYSTEM, AND MEDICAL REPORT MAKING APPARATUS AND METHOD - On a report making screen, medical images taken from a patient are displayed in a viewer. When an area of concern, such as an abnormal shadow, is designated in any of the displayed medical images, the medical images containing the area of concern are chosen. By drag-and-dropping one of the chosen images to an assigned position in a comment editing zone of the report making screen, a three-dimensional image reconstituted of the chosen images is displayed as a confirmation image, wherein the designated area of concern is displayed distinguishably from other portion, enabling checking whether the choice of the images or the designation of the area of concern is correct or not. When the choice and designation is fixed, group data registering the chosen images as a group and position data relating to positions of the area of concern in the chosen images are memorized in linkage with the assigned position. | 04-02-2009 |
| 20090087049 | MEDICAL REPORTING SYSTEM, APPARATUS AND METHOD - A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note. | 04-02-2009 |
| 20100075343 | NOVEL PEPTIDES - The present invention provides novel peptides with energy-modulating activity or circulatory function-modulating activity. The peptides of the present invention have energy-modulating activity or circulatory function-modulating activity and thus are useful for treating food consumption disorders and diseases of the circulatory system. | 03-25-2010 |
| 20100132333 | EXHAUST EMISSION CONTROL DEVICE - The invention has its object to realize compact arrangement of particulate filter | 06-03-2010 |
| 20100196219 | EXHAUST EMISSION CONTROL DEVICE - In an exhaust emission control device, a selective reduction catalyst | 08-05-2010 |
| 20100248255 | NOVEL PEPTIDES - The present invention provides novel peptides with circulation-modulating activity. These peptides are useful as circulation-modulating agents and vasopressors because of their circulation-modulating activity, and can be used for treating diseases of the circulatory system such as myocardial infarction, ischemic heart disease, cerebral infarction, or the like. | 09-30-2010 |
| 20120096268 | ELECTRONIC FILE SENDING METHOD - An electronic file sending method is provided to securely and easily send en electronic file to a receiver. A receiving apparatus receives from a sending apparatus an electronic mail including an encrypted electronic file. The sending apparatus uses a public key of a management server to encrypt a decryption password that is necessary to decrypt the encrypted electronic file and sends the encrypted decryption password to the management server. In association with a file identifier of the electronic file, the management server stores the decryption password and an electronic mail address of a correct receiver, who is a receiver of the receiving apparatus. The receiving apparatus sends to the management server the file identifier of the electronic file and the electronic mail address of the receiver. The management server uses a public key of the receiving apparatus to encrypt the password and sends the encrypted password to the receiving apparatus. | 04-19-2012 |
| Patent application number | Description | Published |
|---|
| 20080251100 | METHOD FOR CLEANING PHOTO MASK - The present invention provides a method for cleaning a photo mask without the need for removal of the pellicle mounted on the photo mask, without the large scale equipment for washing with a solution, with a small number of steps for cleaning and inspection, and without the increase of the production cost. The method for cleaning a photo mask with a pellicle mounted, in which the pellicle frame has a gas introducing hole and a gas discharging hole, comprises: a step of introducing a gaseous substituting substance from the gas introducing hole in a pellicle inner space surrounded by the photo mask and the pellicle, substituting foreign substances on the photo mask, and discharging the foreign substances from the gas discharging hole; and a step of irradiating an ultraviolet ray to the photo mask, while an air or a nitrogen gas or a rare gas is introduced from the gas introducing hole, for degrading the substituted substituting substance so as to be gaseous, and discharging the same from the gas discharging hole. | 10-16-2008 |
| 20090007939 | METHOD OF CLEANING STORAGE CASE - The present invention provides a method of cleaning a storage case to be used for storing or transporting mask substrates such as photomasks and photomask blanks, semiconductor substrates such as semiconductor wafers, pellicles, or the like. The present invention: facilitates a regular cleaning operation, can be used also for a storage case of a complicated shape, does not require a large scale equipment or an expensive equipment to facilitate an environmental countermeasure, and provides high cleaning effect. The method of cleaning a storage case polluted by adhesion of a foreign substance of an organic material, an ionic foreign substances or an ionic crystal foreign substance physically absorbed, comprises a step of placing the storage case still in air flow of cleaned air or an inert gas in a temperature range from room temperature to 80° C. for desorbing and removing the foreign substance adhered to the storage case. | 01-08-2009 |
