| Patent application number | Description | Published |
|---|
| 20080265252 | Semiconductor device - Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex. | 10-30-2008 |
| 20090108446 | ELECTRODE STRUCTURE FOR SEMICONDUCTOR CHIP - The bump electrode | 04-30-2009 |
| 20090212406 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - When manufacturing a semiconductor device by mounting a semiconductor chip | 08-27-2009 |
| 20090289357 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME - A semiconductor element includes: a substrate having an integrated circuit; and a wire connection electrode and a bump connection electrode which are provided on a same main surface of the substrate as electrodes having a same connection function to the integrated circuit. The wire connection electrode is provided in a periphery of the main surface. The bump connection electrode is provided inside the wire connection electrode on the main surface. When a straight line dividing the main surface into two regions is determined, the wire connection electrode and the bump connection electrode are located opposite to each other with respect to the straight line. | 11-26-2009 |
| 20100117083 | SEMICONDUCTOR DEVICE - Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex. | 05-13-2010 |
| 20100148173 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME - A semiconductor device includes: a semiconductor element ( | 06-17-2010 |
| 20100148812 | SEMICONDUCTOR DEVICE INCLUDING CHIP - A semiconductor device in which a chip | 06-17-2010 |
| 20100155942 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes: a connection electrode formed on a side of a semiconductor element substrate opposed to a bump, where the semiconductor element substrate includes a semiconductor element; a passivation layer covering the semiconductor element substrate and an end portion of the connection electrode; and a barrier metal layer covering the connection electrode and a portion of the passivation layer so as to be electrically connected to the bump. A recess is formed in a portion of the passivation layer connected with the barrier metal layer. | 06-24-2010 |
| 20110037173 | SEMICONDUCTOR DEVICE - Input/output cells are formed so as to be peripherally arranged adjacent to a corner cell on a surface of a semiconductor chip, and electrode pads are formed on the respective input/output cells. The electrode pads are configured in a zigzag pad arrangement so as to form inner and outer pad arrays. However, of the electrode pads forming the inner pad array, those electrode pads in predetermined areas adjacent to the two sides of the corner cell are not disposed, such that an interconnect pattern of a carrier which is bump-bonded to the semiconductor chip and vias are prevented from becoming complex. | 02-17-2011 |
