| Patent application number | Description | Published |
|---|
| 20080227394 | RECEIVING APPARATUS - A receiving apparatus is for receiving radio signals including image information transmitted by a mobile transmitting device through a plurality of receiving antennas. The receiving apparatus includes a plurality of frequency converters for outputting modulated signals obtained by converting respective radio signal received through the plurality of receiving antennas by different modulation frequencies; a superposing unit for superposing each of the modulated signals generated by the plurality of frequency converters on a frequency axis; a cable with a single coaxial cable where each of the modulated signals superposed by the superposing unit is transmitted; and a receiving unit for demodulating each modulated signal input through the cable to receive and output the image information. | 09-18-2008 |
| 20090018398 | CAPSULE ENDOSCOPE - A capsule endoscope has a solid image sensor introduced into a subject for picking up an image in the subject. The capsule endoscope includes a light-emitting unit for emitting illumination light for illuminating a view field of the solid image sensor; a lens frame for holding a lens to focus an image in the subject on a light-receiving surface of the solid image sensor, the lens frame having an upper end portion located at a position lower than an upper surface of the light-emitting unit; and a shield unit for shielding, from the illumination light, at least a partial area of the upper end portion of the lens frame which receives the illumination light. | 01-15-2009 |
| 20090244259 | ENDOSCOPE APPARATUS - An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion. | 10-01-2009 |
| 20100016667 | CAPSULE MEDICAL DEVICE AND METHOD OF MANUFACTURING CAPSULE MEDICAL DEVICE - A method of manufacturing a capsule medical device includes mounting one or more functional components on each of a first circuit board group and a second circuit board group, which are separate bodies from each other; mounting a control unit that controls an operation of the one or more functional components, on a control board that is a separate body from the first circuit board group and the second circuit board group; and connecting the first circuit board group and the second circuit board group to the control board. | 01-21-2010 |
| 20100016672 | CAPSULE MEDICAL DEVICE AND METHOD OF MANUFACTURING CAPSULE MEDICAL DEVICE - A capsule medical device includes an optically transparent optical dome forming a part of a capsule casing introduced into a subject; an illuminating board having an illuminating unit that illuminates inside the subject over the optical dome fixedly arranged thereon; an optical unit that forms an image of inside the subject illuminated by the illuminating unit; an imaging unit that is fixedly arranged with respect to the optical unit and captures images of inside the subject; and a positioning unit in which the illuminating board and the optical unit are fixedly arranged, which is fitted and fixed to an inner circumference of the optical dome to determine relative positions of the illuminating board and the optical unit with respect to the optical dome. | 01-21-2010 |
| 20100085466 | IMAGE PICKUP UNIT, OPTICAL UNIT, AND MANUFACTURING METHOD FOR THE IMAGE PICKUP UNIT - A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units. | 04-08-2010 |
| 20100091168 | SOLID-STATE IMAGE PICKUP APPARATUS, AND METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS - A solid-state image pickup apparatus includes a solid-state image pickup device, a microlens member laminated on the solid-state image pickup device, and a flat plate-like cover glass attached onto a region excluding a pixel region on the microlens member as viewed in a planar manner from above the microlens member to seal the pixel region of the solid-state image pickup device. | 04-15-2010 |
| 20100225799 | IMAGE PICKUP UNIT, METHOD OF MANUFACTURING IMAGE PICKUP UNIT AND ELECTRONIC APPARATUS PROVIDED WITH IMAGE PICKUP UNIT - In the image pickup unit according to the present invention, of a lens group, a leg section of a lens at a tail end located closest to an image sensor in an optical axis direction is adhered to the image sensor using a UV adhesive and a light-receiving section of the image sensor is thereby sealed between the lens at the tail end and the light-receiving section via an enclosed space. | 09-09-2010 |
| 20110085076 | IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME - An image pickup unit according to the present invention includes: a lens frame that internally holds an image pickup optical system; and a backside illuminated image pickup device which has a light-receiving section that receives light entering the lens frame via the image pickup optical system and which is held inside the lens frame, wherein a claw portion of the lens frame abuts an opposing surface that opposes a light-entering surface of the image pickup device so as to define a position of the image pickup optical system in an optical axis direction L with respect to the light-receiving section using the opposing surface as a reference. | 04-14-2011 |
