| Patent application number | Description | Published |
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| 20100124627 | DOUBLE-COATED PRESSURE SENSITIVE ADHESIVE SHEET FOR FIXING HARD DISK DRIVE COMPONENT AND HARD DISK DRIVE - Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 μm or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm | 05-20-2010 |
| 20100143711 | Double-faced pressure-sensitive adhesive tape - Provided is a double-faced pressure-sensitive adhesive tape superior in processability and workability during operation in solar cell modules. | 06-10-2010 |
| 20100183872 | Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board - Disclosed is a double-coated pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which includes at least a pressure-sensitive adhesive unit including a plastic base film having a thickness of 13 μm or less, and pressure-sensitive adhesive layers on both sides of the plastic base film. The pressure-sensitive adhesive layers are formed from an acrylic polymer containing, as essential monomer components, a polar-group-containing monomer and an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm | 07-22-2010 |
| 20100209649 | Double-coated pressure sensitive adhesive sheet - Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 μm, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 μm or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component. | 08-19-2010 |
| 20110061923 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD - A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board. | 03-17-2011 |
| 20110094771 | Electroconductive pressure-sensitive adhesive tape - The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting. In particular, it is an object of the present invention to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting even when the tape is wound into a roll shape or has a long length and that has excellent protective properties for the pressure-sensitive adhesive layer and excellent handling properties. The electroconductive pressure-sensitive adhesive tape of the present invention includes an electroconductive pressure-sensitive adhesive tape main body having a pressure-sensitive adhesive layer on one side of a metal foil and a terminal formed on the metal foil and penetrating the pressure-sensitive adhesive layer, and includes a separator provided on a surface of the pressure-sensitive adhesive layer and having an elongation of 600% or more in the longitudinal direction. | 04-28-2011 |
| Patent application number | Description | Published |
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| 20080248231 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR USE IN WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD HAVING THE DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE - The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved. | 10-09-2008 |
| 20090095516 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR USE IN WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD - The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of total outgas of 250 μg/g or less and a diffusion amount of toluene of 10 μg/g or less. The double-sided pressure-sensitive adhesive tape or sheet has a small generating amount of VOC as well as excellent punching processing property and anti-repulsion property. | 04-16-2009 |
| 20090095517 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD - The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board. | 04-16-2009 |
| 20090263606 | THERMOSETTING ADHESIVE OR PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET - The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 μm or more and less than 20 μm. | 10-22-2009 |
