| Patent application number | Description | Published |
|---|
| 20110316142 | SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP - A semiconductor module is provided which includes a resin molded package which is made by a resinous mold assembly. The resin molded package is clamped by covers through a fastener to make the semiconductor module. The resinous mold assembly has formed therein a coolant path that is a portion of a coolant passage through which a coolant flows to coal a semiconductor chip embedded in the resin molded package. The resinous mold assembly is made up of a first mold and a second mold. The first mold has the semiconductor chip, heat spreaders, and electric terminals embedded therein. The second mold is wrapped around an outer periphery of the first mold. The second mold is made of resin which is lower in softening temperature than that of the first mold, thereby facilitating ease of removing the first mold from the resin molded package for reusing the resin molded package. | 12-29-2011 |
| 20110316143 | SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF - A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant. | 12-29-2011 |
| 20110318884 | PRODUCTION METHOD OF SEMICONDUCTOR MODULE WITH RESIN-MOLDED ASSEMBLY OF HEAT SPREADER AND SEMICONDUCTOR CHIP - A method of producing a semiconductor module which includes a resin molded package and a coolant passage is provided. The resin molded package is made up of a thermosetting resin-made mold and a thermoplastic resin-made mold. The resin molded package is formed by making the thermoplastic resin-made mold, placing the thermoplastic resin-made mold and a semiconductor sub-assembly made up of a power semiconductor chip, heat spreaders, terminals, etc., and then forming the thermosetting resin-made mold. Specifically, the thermosetting resin-made mold is made after the thermoplastic resin-made mold, thereby creating a high degree of adhesion of the thermosetting resin-made mold to the thermoplastic resin-made mold before the thermosetting resin-made mold is hardened completely, thereby forming firmly an adhered interface between the thermosetting resin-made mold and the thermoplastic resin-made mold. This minimizes the risk of occurrence of air gaps at the adhered interface and avoids the leakage of the coolant outside the resin molded package. | 12-29-2011 |
| 20120001318 | SEMICONDUCTOR DEVICE - A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together. | 01-05-2012 |
| Patent application number | Description | Published |
|---|
| 20090322939 | VIDEO SCAN CONVERTER - A video scan converter processes a video stream including a first coding unit, which has been obtained by encoding a pair of fields N | 12-31-2009 |
| 20110032272 | VIDEO PROCESSING APPARATUS - Even when an OSD video signal is superimposed on a video signal, deterioration in the frequency characteristic or in gradation of the video or OSD video signal superimposed on it is minimized. A graphic image is represented by a video signal that provides color information and degree of transparency information on a pixel basis. The video processor includes: a filtering section, which receives and converts a 4:2:0 format video signal representing the video into a 4:2:2 or 4:4:4 format video signal; a decision section, which determines, by reference to the transparency information, whether the graphic image be superimposed on the video; a synthesizing section, which superimposes a color difference signal representing the graphic image on that of the video signal converted by the filtering section; and a scaling section for performing scaling on the synthetic color difference signal. Depending on the decision result, the filtering and scaling sections change between a mode of processing to retain pixel data and location information of the color difference signal of the 4:2:0 format video signal and another mode of processing to retain not to retain the pixel data and location information. | 02-10-2011 |
| 20110038596 | VIDEO PROCESSING APPARATUS - Color difference signals of demodulated video are vertically filtered to be converted into 4:2:2 signals before subjected to OSD synthesis, after which those signals are once again vertically filtered as a sort of scaling to obtain the output resolution. As filtering is carried out in two stages, the frequency characteristic deteriorates. A video processor superimposes an OSD video signal on a 4:2:0 format video signal, and includes: a converting section for converting the OSD video signal into YUV signals; an OSD luminance signal scaling section for performing scaling on an OSD luminance signal included in the YUV signals; a luminance signal synthesizing section for synthesizing the scaled OSD luminance signal and the luminance signal of the 4:2:0 format video signal; an OSD color difference signal scaling section for performing scaling on OSD color difference signals included in the YUV signals; and a color difference signal synthesizing section for synthesizing the scaled OSD color difference signals and the color difference components of the 4:2:0 format video signal. | 02-17-2011 |
| 20110205336 | THREE-DIMENSIONAL IMAGE REPRODUCING APPARATUS - There is provided a reproducing apparatus that includes a separating unit operable to separate a three-dimensional image signal containing left-eye image data and right-eye image data into left-eye image data and right-eye image data, a decoder operable to decode the left-eye image data to output a left-eye image signal, and decode the right-eye image data to output a right-eye image signal, a first image quality adjustment unit operable to adjust image quality of an image indicated by the left-eye image signal, and a second image quality adjustment unit operable to adjust image quality of an image indicated by the right-eye image signal. Adjustment of the image quality of the image indicated by the left-eye image signal, which is performed by the first image quality adjustment unit, is performed independently from adjustment of the image quality of the image indicated by the right-eye image signal, which is performed by the second image quality adjustment unit. | 08-25-2011 |
