| Patent application number | Description | Published |
|---|
| 20090133900 | ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring. | 05-28-2009 |
| 20090266592 | CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD - A circuit board in which end faces ( | 10-29-2009 |
| 20090314528 | WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD - A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate. | 12-24-2009 |
| 20100052996 | STORAGE MEDIUM WITH BUILT-IN ANTENNA - A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element. | 03-04-2010 |
| 20100080912 | PASTE APPLICATOR AND PASTE APPLICATION METHOD | 04-01-2010 |
| 20100163630 | ANTENNA BUILT-IN MODULE, CARD TYPE INFORMATION DEVICE, AND METHODS FOR MANUFACTURING THEM - An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board ( | 07-01-2010 |
| 20100244283 | METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT - Dummy electrodes ( | 09-30-2010 |
| 20110083793 | METHOD FOR FORMING ARTIFICIAL LIPID MEMBRANE - An object of the present invention is to provide a method for stably forming an artificial lipid membrane while suppressing the leakage and evaporation of an electrolytic solution. | 04-14-2011 |
