Nopper, DE
Guido Nopper, Furtwangen DE
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20080198215 | Printing Device - A printing device ( | 08-21-2008 |
Hans Nopper, Koeln DE
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20150092427 | LUMINAIRE WITH A LENGTH-VARIABLE SUPPORTING STRUT FOR A LIGHT-EMITTING MEANS - The present invention relates to a luminaire | 04-02-2015 |
Herbert Georg Nopper, Kuppenheim DE
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20090235578 | Compressed fuel composed of renewable organic residues and/or raw materials and production thereof - The invention relates to a compressed fuel composed of organic residues and/or raw materials having at least one additive for increasing the calorific value and for decreasing slag formation, which fuel consists of a fuel mixture which contains a) 72 to 83% by weight combustible organic residues and/or raw materials having a moisture of 8 to 20%, b) 15 to 25% by weight natural organic oils and/or fats for increasing the calorific value and c) 2 to 3% by weight sodium perborate for increasing the ash melting point and as oxygen supplier. As organic residues and/or raw materials, use is made of comminuted and naturally aged or artificially aged (by UV irradiation or by the addition of 0.1-0.3% by weight of age-promoting UV additives or UV absorbers) cereal straw of all types, sugar cane, bamboo, cotton plants, jute, sisal, hemp, ramie, rice straw, rice husks, Chinese silver grass, elephant grass, flax, coconut, kenaf, or esparto grass, into which, for improving penetrability, the oil and/or fat fraction with admixed surfactant fraction of 1-5% by weight based on the oil/fat fraction is added. In addition, the fuel mixture can contain 0.4-0.6% by weight of hexamethylenetetramine for supporting ignition and burning acceleration and soot reduction, and also 1.0-1.5 lignin for solidification. This fuel has scarcely any tendency to slag formation, has good burn-up behavior and a calorific value of 6.8 kWh/kg, wherein the exhaust gas is free of fine dust and contains scarcely any measurable pollutants. | 09-24-2009 |
Markus Nopper, Dresden DE
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20090000950 | AUTOMATIC DEPOSITION PROFILE TARGETING - A method of automatic deposition profile targeting for electrochemically depositing copper with a position-dependent controllable plating tool including the steps of depositing copper on a patterned product wafer, measuring an actual thickness profile of the deposited copper and generating respective measurement data, feeding the measurement data to an advanced process control (APC) model and calculating individual corrections for plating parameters in the position-dependent controllable plating tool. | 01-01-2009 |
20090036029 | ADVANCED AUTOMATIC DEPOSITION PROFILE TARGETING AND CONTROL BY APPLYING ADVANCED POLISH ENDPOINT SYSTEM FEEDBACK - The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system. | 02-05-2009 |
20090243109 | METAL CAP LAYER OF INCREASED ELECTRODE POTENTIAL FOR COPPER-BASED METAL REGIONS IN SEMICONDUCTOR DEVICES - A conductive cap material for a copper region may be provided with enhanced etch resistivity by taking into consideration the standard electrode potential of one or more of the species contained therein. For example, instead of a conventionally used CoWP alloy, a modified alloy may be used, by substituting the cobalt species by a metallic species having a less negative standard electrode potential, such as nickel. Consequently, device performance may be enhanced, while at the same time the overall process complexity may be reduced. | 10-01-2009 |
20090325375 | REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS INCLUDING A METAL CAP LAYER IN SEMICONDUCTOR DEVICES - By introducing an additional heat treatment prior to and/or after contacting a sensitive dielectric material with wet chemical agents, such as an electrolyte solution, enhanced performance with respect to leakage currents or dielectric strength may be accomplished during the fabrication of advanced semiconductor devices. For example, metal cap layers for metal lines may be provided on the basis of electroless deposition techniques, wherein the additional heat treatment(s) may provide the required electrical performance. | 12-31-2009 |
20100024724 | APPARATUS AND METHOD FOR REMOVING BUBBLES FROM A PROCESS LIQUID - The present invention is directed to methods and apparatuses for removing bubbles from a process liquid. The process liquid can comprise a plating solution used in a plating tool. The process liquid is supplied to a tank. A plurality of streams of the process liquid are directed towards a surface of the process liquid from below. This can be done by feeding the process liquid to a flow distributor comprising a plurality of openings providing flow communication between an inner volume of the flow distributor and a main volume of the tank. Before leaving the tank through an outlet, the process liquid flows through a flow barrier. | 02-04-2010 |
20100133648 | MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF-ALIGNED AIR GAPS BETWEEN CLOSELY SPACED METAL LINES - In sophisticated metallization systems, air gaps may be formed on the basis of a self-aligned patterning regime during which the conductive cap material of metal lines may be protected by providing one or more materials, which may subsequently be removed. Consequently, the etch behavior and the electrical characteristics of metal lines during the self-aligned patterning regime may be individually adjusted. | 06-03-2010 |
20110156270 | CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A PARTIALLY APPLIED ACTIVATION LAYER - When forming contact levels of sophisticated semiconductor devices, a superior bottom to top fill behavior may be accomplished by applying an activation material selectively in the lower part of the contact openings and using a selective deposition technique. Consequently, deposition-related irregularities, such as voids, may be efficiently suppressed even for high aspect ratio contact openings. | 06-30-2011 |
Reinhard Nopper, Ditzingen DE
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20100134123 | SENSOR SYSTEM HAVING A MAGNETOELASTIC DEFORMATION ELEMENT - A sensor system is provided having an at least partially magnetoelastic deformation element for measuring pressures, caused by a fluid, that are able to be applied to the magnetoelastic deformation element, having a magnetic circuit formed via a magnetic flux feedback and having a sensor unit and an evaluation unit. The sensor unit is positioned at the deformation element and the evaluation unit having an evaluation coil is structurally separated from, yet inductively coupled to the sensor unit. The sensor unit has a sensor coil positioned on the deformation element and the evaluation unit has the evaluation coil that is inductively coupled to the sensor coil, the sensor coil forms a resonant circuit, using its own parasitic capacitance or using an additional capacitance, which is able to be energized by the evaluation coil in free resonance with strong or weak inductive coupling by a magnetic circuit enclosing the two coils. Alternatively, the sensor unit and the evaluation unit may be coupled via a magnetic circuit having a flux feedback, and the evaluation coil may be wound around the fixed or mountable flux feedback, a permeability change effected by the application of pressure to the deformation element, and thus a change in the inductance of the evaluation coil being able to be determined. | 06-03-2010 |
Richard Nopper, Gutach DE
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20090095600 | Apparatus and method for the recording of images of objects moved on a conveyor device - An apparatus, in particular a code reader, for the recording of images of objects ( | 04-16-2009 |
20120261472 | ILLUMINATION APPARATUS FOR A CAMERA-BASED CODE READER - An illumination apparatus ( | 10-18-2012 |
20130062414 | FOCUS ADJUSTMENT APPARATUS FOR A CODE READER - A focus adjustment apparatus ( | 03-14-2013 |
Richard Nopper, Waldkirch DE
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20160119523 | CAMERA AND METHOD FOR THE DETECTION OF OBJECTS | 04-28-2016 |