Nojo
Haruki Nojo, Tokyo JP
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20100294983 | POLISHING COMPOSITION - A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group: | 11-25-2010 |
Haruki Nojo, Kyoto JP
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20100163787 | POLISHING COMPOSITION - A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows non-selectivity, while being sufficiently suppressed in dishing and erosion. | 07-01-2010 |
Haruki Nojo, Kanagawa JP
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20090197412 | Chemical mechanical polishing composition and process - To provide a polishing slurry composition which effectively reduces the occurrence of scratches, and a method of polishing which reduces the occurrence of scratches while realizing an economical polishing step. The aforementioned object is attained by using a polishing slurry composition for polishing a semiconductor substrate containing a metal oxide particle, at least one water-soluble organic polymer and water, said slurry composition characterized in that, when a test substrate having a metal film, a shallow trench isolation film or dielectric film is polished by varying a rate of a polishing pad equipped in a polishing apparatus under a constant polishing pressure to achieve a maximum polishing rate. | 08-06-2009 |
Haruki Nojo, Kyotanabe-Shi JP
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20150259575 | POLISHING COMPOSITION - A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows nonselectivity, while being sufficiently suppressed in dishing and erosion. | 09-17-2015 |
Haruki Nojo, Uiwang-Si KR
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20160068711 | Organic Film CMP Slurry Composition and Polishing Method Using Same - The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same. | 03-10-2016 |
Hideki Nojo, Kanagawa JP
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20140268251 | STARTUP OPERATION CONTROL APPARATUS, IMAGE PROCESSING APPARATUS, STARTUP OPERATION CONTROL METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM - A startup operation control apparatus includes a main-power-source operation unit, a determining unit, a memory, and a controller. The main-power-source operation unit is operated to supply and shut off power from a power source. The determining unit determines whether or not the main-power-source operation unit has been operated. The memory stores, every time an operation mode of a processing device that operates by receiving power supply from the power source changes, information representing the changed operation mode in an updating manner. If the determining unit determines, upon a shift from a power shutoff state to a power supply state, that the main-power-source operation unit has not been operated, the controller performs control so that the processing device operates in the operation mode represented by the information stored in the memory. | 09-18-2014 |
Kazuhiko Nojo, Shizuoka JP
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20090004401 | Method And Apparatus For Curing Coated Film - According to the method and the apparatus for curing a coated film of the present invention, since an ionization radiation is applied after the O | 01-01-2009 |
20090053418 | Coating Method and Apparatus - According to the coating method of the present invention, the uneven portion on the land of the upstream side makes it possible to increase a contact area between the coating solution and the land, thereby improving the stability of a bead. In other words, according to the coating method of the present invention, it is possible to improve the stability of a bead on the upstream side, the stability having been reduced by the overbite shape of the die. Thus, even when a coating solution having a low viscosity of 10 cp or less is applied with a small coating amount of 10 cc/m2 or less, it is possible to increase the speed of the web without causing an uneven coating. | 02-26-2009 |
Kazuhiko Nojo, Fujinomiya-Shi JP
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20100229417 | METHOD AND APPARATUS FOR CURING COATED FILM AND OPTICAL FILM - The present invention provides a method of curing a coated film which includes irradiating an active ray by a plurality of active ray irradiation devices, wherein the coated film is composed of an active ray-curable resin formed on a surface of a running band-shaped flexible support, including the step of: maintaining the coated film in a deoxidized atmosphere during a period in which the flexible support irradiated with an active ray by the at least one active ray irradiation device is transferred to the active ray irradiation device in a subsequent step. | 09-16-2010 |
Naruyuki Nojo, Yokohama-Shi JP
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20090160908 | SEMICONDUCTOR ELEMENT CHIP, INK JET HEAD EMPLOYING SEMICONDUCTOR ELEMENT CHIP, AND METHOD FOR BONDING ELECTRODES OF SEMICONDUCTOR ELEMENT CHIP - A semiconductor element substrate includes an electrode pad; a semiconductor element; and a connection heater for heating the electrode pad, wherein the connection heater is disposed in a range capable of heating the electrode pad up to a level capable of electrical connection. | 06-25-2009 |
20150343778 | LIQUID DISCHARGING HEAD AND METHOD FOR PRODUCING THE SAME - A method for producing a liquid discharging head includes an element substrate provided with a discharge opening for discharging a liquid and a supporting member that supports the element substrate, the element substrate having a first surface and a second surface opposite to the first surface, the supporting member having a height reference surface and an element-substrate bonding surface to which the first surface is bonded with an adhesive. The method includes the steps of measuring a height h of the element-substrate bonding surface from the height reference surface; applying the adhesive to the element-substrate bonding surface; and causing the first surface to oppose the element-substrate bonding surface with the adhesive being provided therebetween, and disposing the second surface at a predetermined height m from the measured height h to harden the adhesive at a portion between the element-substrate bonding surface and the element substrate. | 12-03-2015 |
Satoshi Nojo, Tochigi JP
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20120062728 | SURFACE INSPECTING DEVICE - The presence or absence of a deep machining work trace is detected, and the position and size of the machining work trace are allowed to be estimated, whereby an inspection time can be shortened. | 03-15-2012 |
20120230579 | SURFACE INSPECTION DEVICE AND SURFACE INSPECTION METHOD - A surface inspection device includes an image generator for generating a digital image achieved by imaging an inner surface of a bore which is subjected to a boring work, a line extraction processor for extracting a line along a horizontal direction set to a line extraction direction from the digital image, and an estimating unit for determining the state of the inner surface of the bore based on the line extracted by the line extraction processor. The line extraction processor extracts lines along the line detection direction from respective digital images before and after rotation which are achieved by rotating the digital image once or over plural times every predetermined angle while the line extraction direction is fixed, and the estimating unit determines the state of the inner surface of the bore based on the lines extracted from the respective digital images before and after the rotation. | 09-13-2012 |