Patent application number | Description | Published |
20100209597 | SELECTIVE OXIDATION PROCESS - Silicon is selectively oxidized relative to a metal-containing material in a partially-fabricated integrated circuit. In some embodiments, the silicon and metal-containing materials are exposed portions of a partially-fabricated integrated circuit and may form part of, e.g., a transistor. The silicon and metal-containing material are oxidized in an atmosphere containing an oxidant and a reducing agent. In some embodiments, the reducing agent is present at a concentration of about 10 vol % or less. | 08-19-2010 |
20100210117 | SELECTIVE REMOVAL OF OXYGEN FROM METAL-CONTAINING MATERIALS - Oxygen is selectively removed from metal-containing materials in a partially-fabricated integrated circuit. In some embodiments, the partially-fabricated integrated circuit has exposed silicon and metal-containing materials, e.g., as part of a transistor. The silicon and metal-containing material are oxidized. Oxygen is subsequently removed from the metal-containing material by an anneal in an atmosphere containing a reducing agent. Advantageously, the silicon oxide formed by the silicon oxidation is maintained while oxygen is removed from the metal-containing material, thereby leaving a high quality metal-containing material along with silicon oxide. | 08-19-2010 |
20100216306 | PROTECTION OF CONDUCTORS FROM OXIDATION IN DEPOSITION CHAMBERS - In some embodiments, after depositing conductive material on substrates in a deposition chamber, a reducing gas is introduced into as the chamber in preparation for unloading the substrates. The deposition chamber can be a batch CVD chamber and the deposited material can be a metal nitride, e.g., a transition metal nitride such as titanium metal nitride. As part of the preparation for unloading substrates from the chamber, the substrates may be cooled and the chamber is backfilled with a reducing gas to increase the chamber pressure. It has been found that oxidants can be introduced into the chamber during this time. The introduction of a reducing gas has been found to protect exposed metal-containing films from oxidation during the backfill and/or cooling process. The reducing gas is formed of a reducing agent and a carrier gas, with the reducing agent being a minority component of the reducing gas. By providing a reducing agent, the effects of oxidation on exposed metal-containing films is reduced, therefore enhancing the conductive properties of the metal films. | 08-26-2010 |
Patent application number | Description | Published |
20110203250 | COMBUSTION DEVICE FOR A GAS TURBINE - A combustion device for a gas turbine includes an interior portion, an inner wall having a plurality of first passages and an outer wall having a plurality of second passages configured to cool the inner wall, each of the plurality of second passages having an outlet opening into a third passage. An intermediate layer is disposed between the inner wall and the outer wall and defines a plurality of chambers, each chamber forming a Helmholtz damper and being connected to the interior portion by at least one of the plurality of first passages and being connected to at least one of the plurality of second passages by at least one of the plurality of third passages | 08-25-2011 |
20110265484 | COMBUSTION DEVICE FOR A GAS TURBINE - A combustion device ( | 11-03-2011 |
20110308630 | HELMHOLTZ DAMPER AND METHOD FOR REGULATING THE RESONANCE FREQUENCY OF A HELMHOLTZ DAMPER - A Helmholtz damper, including an enclosure, a neck extending from the enclosure, and a pipe for inserting into the neck. The portions of the pipe inserted into the neck is adjusted to regulate a resonance frequency of the Helmholtz damper. | 12-22-2011 |
20110308654 | DAMPER ARRANGEMENT AND METHOD FOR DESIGNING SAME - A damper arrangement ( | 12-22-2011 |
20140345284 | DAMPER FOR GAS TURBINE - The invention relates to a damper for reducing pulsations in a gas turbine, which includes an enclosure, a main neck extending from the enclosure, a spacer plate disposed in the enclosure to separate the enclosure into a first cavity and a second cavity and an inner neck with a first end and a second end, extending through the spacer plate to interconnect the first cavity and the second cavity. The first end of the inner neck remains in the first cavity and the second end remains in the second cavity. A flow deflecting member is disposed proximate the second end of the inner neck to deflect a flow passing through the inner neck. | 11-27-2014 |
20140345285 | DAMPER FOR GAS TURBINES - The invention relates to a damper for reducing the pulsations in a combustion chamber of a gas turbine. The damper includes a resonator cavity with an inlet and a neck tube in flow communication with the interior of the combustion chamber and resonator cavity, and a compensation assembly pivotably connected with the neck tube. The compensation assembly is inserted between the resonator cavity and the combustion chamber to permit relative rotation between the combustion chamber and the resonator cavity. With the damper according to the present invention, by way of providing the compensation assembly, it is assured the relative rotation between the combustion chamber and the resonator cavity is compensated, hence operation life is elongated. | 11-27-2014 |
20150059345 | SIMULTANEOUS BROADBAND DAMPING AT MULTIPLE LOCATIONS IN A COMBUSTION CHAMBER - The damper arrangement includes a plurality of interconnected volumes and a plurality of necks for connecting the damper to a combustion chamber at a plurality of contact points. The plurality of necks are connected to the plurality of volumes. | 03-05-2015 |