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| 20090253044 | Nonaqueous Electrolyte and Lithium ion Secondary Battery Using Same - Obtained are a nonaqueous electrolyte solution suitable for a lithium secondary battery having a high energy density, wherein a decrease in the capacity due to charge/discharge cycles is remarkably small and no gas is generated when charging or storing the battery; and a lithium secondary battery using the same. This nonaqueous electrolyte solution is a solution containing a nonaqueous solvent, the nonaqueous solvent containing a fluorinated solvent including a linear fluorinated carbonate (a1) and a fluorinated ethylene carbonate (a2), and the total amount of the fluorinated solvent in the nonaqueous solvent is in the range of from 50 to 100 weight %. | 10-08-2009 |
| 20110136006 | NON-AQUEOUS ELECTROLYTIC SOLUTION AND LITHIUM SECONDARY BATTERY - The present invention provides a non-aqueous electrolytic solution for a lithium secondary battery, wherein the lithium secondary battery includes, as a cathode active material, a composite oxide in which at least 35% by mole of a transition metal included in the composite oxide is manganese, and wherein the non-aqueous electrolytic solution includes an unsaturated sultone. | 06-09-2011 |
| 20110136018 | NON-AQUEOUS ELECTROLYTIC SOLUTION, LITHIUM SECONDARY BATTERY AND METHOD FOR PRODUCING SAME, AND MIXED-TYPE NON-AQUEOUS ELECTROLYTIC SOLUTION - The present invention provides a non-aqueous electrolytic solution including an organosilicon compound having a metal atom, a phosphorus atom or a boron atom, and a fluorine-containing alkali metal salt, wherein the content of a fluorinated organosilicon compound generated by reaction of the organosilicon compound and the fluorine-containing alkali metal salt in the non-aqueous electrolytic solution is 0.2% by mass or less. | 06-09-2011 |
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| 20110110751 | VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE - A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the first vacuum transfer chamber is restricted to one. | 05-12-2011 |
| 20110110752 | VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE - The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein. | 05-12-2011 |
| 20110144792 | SEMICONDUCTOR PROCESSING SYSTEM AND PROGRAM - In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained. | 06-16-2011 |
| 20110217148 | VACUUM PROCESSING APPARATUS AND PROGRAM - The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled. | 09-08-2011 |
| 20110218662 | VACUUM PROCESSING APPARATUS AND PROGRAM - Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules. | 09-08-2011 |
| 20110229289 | VACUUM PROCESSING APPARATUS - The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum; vacuum transport chambers connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated mutually; transfer means for transferring the workpiece between each of the process chambers and the load lock via the corresponding vacuum transport chamber; load lock valves adapted to switch between interrupt and opening at a position between the load lock and the corresponding vacuum transport chambers; process chamber valves adapted to switch between interrupt and opening at a position between the process chambers and the corresponding vacuum transport chambers; and control means for controlling timing of the opening and closing of the valves whose timings are controlled in synchronization with the transfer of the workpieces. | 09-22-2011 |
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| 20100119312 | PARTICULATE WATER ABSORBING AGENT AND METHOD FOR PRODUCING THE SAME - A method includes the steps of: adding an organic surface cross-linking agent to a water absorbent resin having a cross-linked structure; adding a liquid permeability improving agent to the water absorbent resin concurrently with or after the addition of the organic surface cross-linking agent; and then adding a lubrication improving agent to the water absorbent resin. This provides a particulate water absorbing agent and a method for producing it, the particulate water absorbing agent being suitable for pneumatic transportation, suffering no decrease in the effect of the liquid permeability improving agent, and excelling in properties such as fluidity and damage resistance after the pneumatic transportation. | 05-13-2010 |
| 20110003926 | PROCESS FOR PRODUCING WATER-ABSORBING RESIN - In obtaining a water-absorbing resin with high property in high productivity, produced a production method for a water-absorbing resin in high property and stably. Provided is a production method for a water-absorbing resin, comprising: a step for polymerizing an acrylic acid aqueous solution; a step for drying the resultant water-containing gel; a step for pulverizing and classifying the dried substance; and a step for surface cross-linking after classification, wherein a hopper having an inclination angle of a cone part of equal to or larger than 45 degree, and a drawing rate of 30 to 80% is used. | 01-06-2011 |
| 20110015351 | METHOD OF MANUFACTURING A PARTICULATE WATER-ABSORBING AGENT COMPOSED PRINCIPALLY OF A WATER-ABSORBING RESIN - Provided is a production method for the particulate water-absorbing agent, which can collecting the fine powders generated during the producing process efficiently without worsening working environment, and also the particulate water-absorbing agent produced by the production method thereof. This production method includes (1) a polymerization step for obtaining a polymer gel, (2) a drying step for drying said polymer gel to obtain a particulate water-absorbing resin, (3) a classification step for sieving said particulate water-absorbing resin, (4) a surface cross-linking step for cross-linking the neighborhood of the surface of said particulate water-absorbing resin (5) a packaging step for filling a packaging material container with said particulate water-absorbing agent for packaging and (6) a transportation step for transporting the products produced in each of the steps to the other steps. In this production method, the fine powders contained in gas composed principally of air, in any of the steps, can be collected by use of a trapping material. | 01-20-2011 |
| 20110028670 | PROCESS FOR PRODUCTION OF WATER-ABSORBING RESINS - There is provided a production method for a water-absorbing resin for stably and continuously producing the water-absorbing resin with industrially high property, in particular, the water-absorbing resin with high liquid permeation. A method of the present invention relates to a production method for a water-absorbing resin including: a polymerization step of an aqueous solution of an unsaturated monomer; a drying step of the resultant hydrogel polymer; and a surface cross-linking step after drying; characterized by including a pneumatic transportation step for pneumatic transporting the water-absorbing resin powder substance in a pipeline with a surface roughness (Rz) of the inner surface of equal to or smaller than 800 nm, by using gas with a dew point of −5° C. to −100° C. | 02-03-2011 |
| 20110088806 | METHOD OF TRANSPORTING ABSORBENT RESIN POWDER - Provided is a method of transporting an absorbent resin powder, said method being suitable for long-distance transport, and being able to inhibit the deterioration of the properties of the absorbent resin powder while also inhibiting obstructions. During the manufacturing process, the absorbent resin powder is transported pneumatically via transport pipes. This transport method involves two or more air transport devices (A, B, C) within one transport section, and the air transport devices (A, B, C) are connected in series by transport pipes (P | 04-21-2011 |
| 20110110730 | TRANSPORT METHOD FOR ABSORBEND RESIN POWDER - [Problem] To provide a pneumatic conveyance method for a water-absorbing resin powder substance, which is capable of suppressing property decrease of the water-absorbing resin powder substance, while suppressing obstruction phenomenon. | 05-12-2011 |
| 20110166300 | WATER-ABSORBENT RESIN MANUFACTURING METHOD AND LIQUID PERMEABILITY IMPROVEMENT METHOD - A method for the production of a water-absorbing resin is to be provided which permits enhancement and stabilization of property, for example, liquid permeability, of a water-absorbing resin by a simple and convenient method without requiring change of raw materials or expensive facility investment. The method comprises a polymerization step for polymerizing an aqueous solution of acrylic acid (or salt thereof) to obtain a hydrogel cross-linked polymer; a drying step for drying the hydrogel cross-linked polymer to obtain a water-absorbing resin powder; a classification step for classifying the water-absorbing resin powder; and a surface cross-linking step for surface cross-linking the water-absorbing resin powder before or after the classification step, wherein electricity is eliminated in the classification step. | 07-07-2011 |
| 20110313113 | Polyacrylic water-absorbent resin powder and method for producing the same - A production method of the present invention is a polyacrylic water-absorbent resin powder production method including the steps of: producing an acrylic monomer solution in which gas is dissolved and/or dispersed; polymerizing the acrylic monomer solution in the absence of a surface active agent or in the presence of not more than 300 ppm of a surface active agent; during or after the step of polymerizing, fragmenting a hydrated gel crosslinked polymer obtained by polymerizing the acrylic monomer solution; and drying by heat the hydrated gel crosslinked polymer thus fragmented, the gas being dissolved and/or dispersed in the acrylic monomer solution by at least one of the methods (a) to (c): (a) applying pressure to the acrylic monomer solution and the gas; (b) creating swirling flows of the acrylic monomer solution and the gas; and (c) introducing the gas with the acrylic monomer solution via fine holes. Accordingly, the production method of the present invention makes it possible to efficiently produce a water-absorbent resin having an excellent water-absorption rate without deteriorating a liquid-absorbent property of a sanitary product or the like. | 12-22-2011 |
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| 20090054552 | FIBER-REINFORCED COMPOSITE MATERIAL AND PROCESS FOR PRODUCING THE SAME - Disclosed is a highly transparent fiber-reinforced composite material including an assembly of cellulose fibers of 4 to 200 nm average fiber diameter impregnated with a matrix material so as to not only remedy the moisture absorbency attributed to cellulose fibers but also further improve transparency. There is provided a fiber-reinforced composite material including an assembly of cellulose fibers impregnated with a matrix material. In the fiber-reinforced composite material, hydroxyl groups of cellulose fibers are chemically modified through a reaction with one or more chemical modifiers selected from the group consisting of an acid, an alcohol, a halogenating reagent, an acid anhydride, and an isocyanate so that the ratio of a functional group introduced by the chemical modification is 5 to 40 percent by mole based on the hydroxyl groups of cellulose fibers before the chemical modification. The chemical modification of hydroxyl groups of cellulose fibers can reduce the hydrophilicity of cellulose fibers to thereby reduce the moisture absorbency of fiber-reinforced composite material. Further, the affinity between cellulose fibers and matrix material can be enhanced to thereby further improve transparency. | 02-26-2009 |
| 20090264036 | NANOFIBER SHEET, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided is a nanofiber sheet that sufficiently refined by fibrillation and has high crystallinity of cellulose fiber and can realize a fiber-reinforced composite material exhibiting high transparency, a high elastic modulus, a low coefficient of linear thermal expansion, and high heat resistance and being high in flatness and smoothness. This nanofiber sheet includes crystalline cellulose as the main component and a lignin in an amount of from 10 ppm to 10 wt %. When a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20 J/cm | 10-22-2009 |
| 20090298976 | Fiber-Reinforced Composition Resin Composition, Adhesive and Sealant - An object of the present invention is to provide a fiber-reinforced composite resin composition for use as a sealant, adhesive, or filler, having a high transparency, and enabled to adequately meet recently required levels of low thermal expansion property, high strength, light weight, high thermal conductivity, and especially high, isotropic thermal conductivity. With the fiber-reinforced composite resin composition, the fibers have an average fiber diameter of 4 to 200 nm, a total light transmittance at wavelengths of 400 to 700 nm as measured with a 50 μm-thickness cured product, resulting from curing the composition to a plate-like form, is no less than 70%, both a thermal conductivity coefficient in a thickness direction and a thermal conductivity coefficient in a plate surface direction of the cured product are no less than 0.4 W/m·K, and the fibers are oriented randomly in the composition. | 12-03-2009 |
| 20090305033 | FIBER COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A highly transparent fiber composite material is provided that can be manufactured through a simplified process using reduced amounts of raw materials and that has high flexibility and low thermal expansivity and retains good functionality of the fiber material. The fiber composite material includes: a fiber assembly having an average fiber diameter of 4 to 200 nm and a 50 μm-thick visible light transmittance of 3% or more; and a coating layer that coats and smoothes the surface of the fiber assembly, wherein the fiber composite material has a 50 μm-thick visible light transmittance of 60% or more. With this fiber assembly, the scattering of light caused by the irregularities on the surface can be suppressed by coating the surface with the coating layer to smooth the surface, whereby a highly transparent fiber composite material can be obtained. | 12-10-2009 |
| 20100143681 | FLEXIBLE SUBSTRATE - A flexible substrate | 06-10-2010 |
| 20110117319 | NANOFIBER SHEET AND METHOD FOR MANUFACTURING THE SAME - A nanofiber sheet that has a high degree of transparency, a high modulus of elasticity, a low coefficient of linear thermal expansion as well as high degrees of flatness and smoothness, in particular, a nanofiber sheet produced as a uniform and flat sheet having a high optical transmittance with cellulose as the only component. This sheet has the following characteristics: Calculated for a thickness of 60 μm, the transmittance for parallel rays of light having a wavelength of 600 nm is equal to or higher than 70%; The Young's modulus measured in accordance with the JIS K7161 method is equal to or greater than 10 GPa; The coefficient of linear thermal expansion measured in accordance with the ASTM D606 method is equal to or smaller than 10 ppm/K. | 05-19-2011 |
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| 20080239724 | Illuminating Device - An illuminating device that is improved in heat radiation property and is suppressed in the occurrence of peeling and warping of a reflector. The reflector having a housing portion that houses a light emitting diode element is disposed on a substrate a visible light converting layer is formed on the housing portion and a lens is disposed on the reflector. A circuit pattern, the light emitting diode element, the reflector, the visible light converting layer, and the lens are disposed on the substrate, and the reflector and the lens are respectively adhered using a same type of adhesive agent. The heat radiation property can thus be improved, the peeling and warping of the reflector, etc., is suppressed, and accordingly, the optical characteristics of the device can be maintained. | 10-02-2008 |
| 20100079087 | LIGHTING APPARATUS - The present invention comprises a lighting apparatus main body having a reflecting surface, a main light source arranged in the reflecting surface of the lighting apparatus main body, a sub-light source which is arranged at the lighting apparatus main body and illuminates the neighborhood of the main light source directly, and a control circuit which controls the main light source and the sub-light source. | 04-01-2010 |
| 20100124064 | LIGHTING DEVICE INCLUDING TRANSLUCENT COVER FOR DIFFUSING LIGHT FROM LIGHT SOURCE - A lighting device includes a light source configured to radiate light toward a floor from a ceiling, a reflecting mirror provided around the light source, and shading angle setting element configured to define a range in which the light from the light source is radiated by setting a shading angle with respect to the light radiated from the light source. The light source, the reflecting mirror and the shading angle setting element are covered by a translucent cover. The translucent cover has an in-line transmittance. An in-line transmittance of the translucent cover of a position corresponding to an optical axis of the light source and an in-line transmittance of the translucent cover of a position deviated from the optical axis are different from each other. | 05-20-2010 |
| 20100149783 | LIGHT-EMITTING MODULE AND ILLUMINATION APPARATUS - A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member. | 06-17-2010 |
| 20100188852 | ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS - An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members. | 07-29-2010 |
| 20110182073 | ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS - An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members. | 07-28-2011 |
| 20110273880 | ILLUMINATION APPARATUS HAVING A PLURALITY OF SEMICONDUCTOR LIGHT-EMITTING DEVICES - An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer. | 11-10-2011 |
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| 20080296760 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SAME - A semiconductor apparatus includes a semiconductor device having electrodes on its opposed frontside and backside, respectively, a first external electrode connected to the electrode at the frontside, the first external electrode having a first major surface generally parallel to the frontside of the semiconductor device, and a first side surface generally perpendicular to the first major surface, and a second external electrode having a second major surface generally parallel to the backside of the semiconductor device, a second side surface generally perpendicular to the second major surface, and a projection protruding perpendicular to the second major surface and connected to the electrode at the backside, The first side surface of the first external electrode and the second side surface of the second external electrode serve as mount surfaces. The semiconductor device is located between the first external electrode and the second external electrode. | 12-04-2008 |
| 20100233856 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - A method for manufacturing a semiconductor apparatus includes: forming a protrusion made of a conductor on each of the electrodes provided on a semiconductor wafer top face side of a plurality of semiconductor devices formed in a semiconductor wafer; making a trench in the top face between the plurality of semiconductor devices; filling an insulator into a gap between the protrusions and into the trench to form a sealing member; grinding a bottom face of the semiconductor wafer opposing the top face until the sealing member being exposed to divide the semiconductor wafer into each of the semiconductor devices; forming a first lead made of a conductor on each of the protrusions, the first lead forming a portion of a first external electrode; forming a conductive material layer directly to form a second lead on the bottom face of the plurality of semiconductor devices, the second lead forming the second external electrode; and cutting the sealing member between the plurality of semiconductor devices to separate the plurality of semiconductor devices from each other. | 09-16-2010 |
| 20110121463 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME - According to one embodiment, a semiconductor package is disclosed. The semiconductor package can include an insulative substrate having a first surface and a second surface opposed to the first surface, a first through hole formed in the insulative substrate from the first surface to the second surface, and a second through hole formed near the first through hole in the insulative substrate from the first surface to the second surface, a conductive body formed in the vicinity of the second through hole and penetrating into the insulative substrate, a first outer electrode formed on the first surface and connected to an one end of the conductive body, and a second outer electrode formed on the second surface and connected to the other end of the conductive body. | 05-26-2011 |
| 20110186982 | SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME - According to one embodiment, a surface mount diode including a diode chip including a first main surface and a second main surface, a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion, an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion, a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip, and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member. | 08-04-2011 |
