Patent application number | Description | Published |
20130202873 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are a fiber-reinforced composite material excellent in heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Further provided are a fiber-reinforced composite material having less volatile matters during the curing time, and having excellent heat resistance and strength properties, an epoxy resin composition to obtain the fiber-reinforced composite material, and a prepreg obtained by using the epoxy resin composition. Provided are: an epoxy resin composition for a fiber-reinforced composite material, comprising an amine type epoxy resin [A], an aromatic amine curing agent [B], and a block copolymer [C] having a reactive group capable of reacting with an epoxy resin; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. Further provided are: an epoxy resin composition comprising an epoxy resin [A] having two or more of four- or more-membered ring structures, and having either one of a glycidyl amino group directly bonded to the ring structure or a glycidyl ether group directly bonded to the ring structure, epoxy resin [B] having three or more of functional groups, a curing agent [C], and an elastomer component [D]; a prepreg obtained by impregnating a reinforced fiber with the epoxy resin composition; and a fiber-reinforced composite material obtained by curing the prepreg. | 08-08-2013 |
20130281573 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are: a fiber-reinforced composite material which has mode I interlaminar fracture toughness, mode II interlaminar fracture toughness and compressive strength under heat and humidity conditions at the same time; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements (A), (B), (C) and (D). (A) An epoxy resin (B) Resin particles that satisfy the following conditions (b1)-(b3) and are insoluble in an epoxy resin (b1) The particle size distribution index is 1.0-1.8. (b2) The particle sphericity is 90 or more. (b3) The glass transition temperature of the particles is 80-180° C. (C) At least one elastomer component that is selected from among block copolymers containing a block having a glass transition temperature of 20° C. or less and rubber particles (D) An epoxy resin curing agent | 10-24-2013 |
20130303661 | EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING OF FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING SAME - An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator. | 11-14-2013 |
20140100320 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL - An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness. | 04-10-2014 |
20140162518 | PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL - The invention provides a fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition. | 06-12-2014 |
20140288214 | TWO-PACK TYPE EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, AND FIBER-REINFORCED COMPOSITE MATERIAL - A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative. | 09-25-2014 |
20140309337 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are: a fiber-reinforced composite material which is suppressed in morphology variation due to the molding conditions, while having excellent mode I interlaminar fracture toughness and excellent wet heat resistance; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements [A]-[F], and which is characterized by containing 5-25 parts by mass of constituent element [C] and 2-15 parts by mass of constituent element [E] per 100 parts by mass of the total epoxy resin blended therein. [A] A bifunctional amine type epoxy resin. [B] A tetrafunctional amine type epoxy resin. [C] A bisphenol F type epoxy resin having an epoxy equivalent weight of 450-4,500. [D] An aromatic amine curing agent. [E] A block copolymer having a reactive group that can be reacted with as epoxy resin. [F] Thermoplastic resin particles that are insoluble in an epoxy resin. | 10-16-2014 |
20150017450 | RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING SUBSTRATE OBTAINED BY MOLDING SAME - A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent. Also provided is a semiconductor mounting substrate which is obtained by molding the resin composition. | 01-15-2015 |