| Patent application number | Description | Published |
|---|
| 20080287028 | METHOD OF MANUFACTURING DISPLAY UNIT - A laminated structure is formed by placing a cover substrate over a device substrate with a projection structure in between in the vacuum atmosphere. Next, the laminated structure is taken out into the air in a state that a space between the device substrate and the cover substrate is maintained in the vacuum atmosphere. Subsequently, the portion of the organic layer formed on the auxiliary electrode is removed by irradiating laser light to the laminated structure. Since the space between the device substrate and the cover substrate is maintained in the vacuum atmosphere, even if the laser light is emitted to the laminated structure taken out into the air, the laser light is emitted to the portion of the organic layer formed on the auxiliary electrode in the vacuum atmosphere. | 11-20-2008 |
| 20090097673 | VEHICLE-MOUNTED DEVICE - The present invention is equipped with a USB interface | 04-16-2009 |
| 20100097411 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE - A display device and a method for manufacturing the display device are provided. The display device includes an organic layer on an auxiliary wiring is removed with high precision by one operation and, thereby, the yield and the productivity are improved. A lower electrode is formed by patterning in each pixel on a substrate. An auxiliary wiring including a light absorption layer is formed between individual pixels. An organic layer is formed on the substrate while covering the lower electrodes. Laser irradiation is conducted from the organic layer side, the laser light is converted to heat in the light absorption layer exposed at a portion under the organic layer, and the organic layer portion above the light absorption layer is removed selectively. An upper electrode is formed on the organic layer and is connected to the light absorption layer portion of the auxiliary wiring. | 04-22-2010 |
| 20100244664 | LIGHT-EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - A light-emitting display capable of maintaining low power consumption and improving display quality irrespective of the configuration of an auxiliary wiring is provided. A second electrode | 09-30-2010 |
| 20110037071 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes: a pixel including a plurality of light emitting elements each formed by sequentially stacking a first electrode layer, an organic layer, and a second electrode layer, spaced apart from each other in a first direction orthogonal to the stacking direction thereof, and emitting light emission colors different from each other; and an auxiliary wiring layer electrically connected to the second electrode layer. A plurality of the pixels are aligned in the first direction so as to include a gap which is larger than a gap between the light emitting elements adjacent to each other, and the auxiliary wiring layer is provided between the pixels adjacent to each other. | 02-17-2011 |
| Patent application number | Description | Published |
|---|
| 20080229827 | Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor - There is provided an electronic part that has a substrate, an insulating layer formed on the substrate and a pad formed on the insulating layer and is electrically connected with an external terminal and that further includes a cavity formed at least at either one of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer. It provides a highly reliable electronic part, its fabrication method as well as an acceleration sensor using the electronic part and its fabrication method. | 09-25-2008 |
| 20080235964 | Inclination position sensor and inclination position sensor manufacturing method - An inclination position sensor where, on a substrate on which wires are formed, plural electrodes electrically connected to the wires are disposed, a conductive ball that can simultaneously contact at least two of the plural electrodes is disposed, an enclosure that covers the plural electrodes and the conductive ball is disposed, and a circular arc is formed in places of the electrodes that contact the conductive ball. | 10-02-2008 |
| 20100015808 | Impact sensor and method for manufacturing the impact sensor - An impact sensor comprises a silicon substrate; an insulating layer formed over the silicon substrate; a plurality of beams having flexibility that are formed of conductive silicon material; a fixing portion to fix a fixed end of each of the beams, the fixing portion being formed of conductive silicon material; a fixed end line at whose one end is formed the fixing portion, the fixed end line being formed of conductive silicon material on the insulating layer; and a free end line having a pressing portion that faces a free end of each of the beams via a space, the free end line being formed of conductive silicon material on the insulating layer. Respective beam widths, each measured in a direction orthogonal to a length direction joining the fixed end and the free end, of the plurality of beams are set different from each other, thus reducing the space occupied by the sensor. | 01-21-2010 |
| 20100055841 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME - A method of producing a semiconductor device includes the steps of: preparing a semiconductor wafer having an MEMS (Micro Electro Mechanical Systems) element formed on a surface thereof; forming a groove portion surrounding the MEMS element in the surface of the semiconductor wafer; preparing a sealing wafer having a recess portion formed in a surface thereof and a protruding portion surrounding the recess portion; filling an adhesive in the groove portion; arranging the semiconductor wafer so that the surface of the semiconductor wafer faces the surface of the sealing wafer; fitting the protruding portion into the groove portion so that the recess portion covers the MEMS element; hardening the adhesive to form an MEMS element mounting wafer; and cutting the MEMS element mounting wafer into pieces to obtain the semiconductor device. Further, the adhesive is formed of a silicone type resin. | 03-04-2010 |
