Nobuo Ando, Osaka JP
Nobuo Ando, Osaka JP
Patent application number | Description | Published |
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20080213695 | Chemically amplified resist composition - The present invention provides a chemically amplified resist composition comprising: (A) a salt represented by (I): | 09-04-2008 |
20080248417 | Polyhydric phenol compound and chemically amplified resist composition containing the same - The present invention provides a polyhydric phenol compound represented by the formula (I): | 10-09-2008 |
20090220886 | POLYHYDRIC COMPOUND AND CHEMICALLY AMPLIFIED RESIST COMPOSITION CONTAINING THE SAME - The present invention provides a polyhydric compound represented by the formula (I): | 09-03-2009 |
20090263742 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION - The present invention provides a chemically amplified resist composition comprising: | 10-22-2009 |
20090269695 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION - The present invention provides a chemically amplified resist composition comprising: | 10-29-2009 |
20100055609 | COMPOUND, METHOD FOR PREPARING THE COMPOUND AND RESIST COMPOSITION CONTAINING THE COMPOUND - A compounds represented by the Formula (I) or the Formula (I′). | 03-04-2010 |
20100136481 | RESIST COMPOSITION - A resist composition comprising: | 06-03-2010 |
20100151379 | COMPOUND AND CHEMICALLY AMPLIFIED RESIST COMPOSITION CONTAINING THE SAME - The present invention provides a compound represented by the formula (I): | 06-17-2010 |
20100151380 | RESIST COMPOSITION - A resist composition comprising: | 06-17-2010 |
20110165519 | RESIN SUITABLE FOR AN ACID GENERATOR AND A CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION CONTAINING THE SAME - The present invention provides a resin which generates an acid by irradiation and is a salt of an organic cation and an anionic polymer wherein the anionic polymer has no carbon-carbon unsaturated bond. The present invention further provides a chemically amplified resist composition comprising the same. | 07-07-2011 |
20110189618 | RESIST PROCESSING METHOD - A resist processing method comprises the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B), a cross-linking agent (C) and an acid amplifier (D) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern. | 08-04-2011 |