Patent application number | Description | Published |
20110149441 | MAGNETIC RECORDING DISK DRIVE WITH WRITE DRIVER TO WRITE HEAD TRANSMISSION LINE HAVING NON-UNIFORM SECTIONS FOR OPTIMAL WRITE CURRENT PULSE OVERSHOOT - An interconnect between the write driver and the write head in a magnetic recording disk drive enables an inherent write current overshoot. The interconnect includes an integrated lead suspension (ILS) and a short flex cable that connects the write driver circuitry to the ILS. The interconnect is a two-segment transmission line, with the first segment connected to the write driver having multiple sub-segments or sections with non-uniform impedance levels. The section of the first segment that connects to the write driver is the short flex cable and has an impedance substantially higher than the source impedance Z | 06-23-2011 |
20110149442 | CONDUCTOR SUSPENSION STRUCTURE FOR HARD DISK DRIVES - An integrated conductor/suspension structure for supporting and electrically connecting a write/read head in a hard disk drive and methods of making the conductor/suspension structure are provided. The integrated conductor/suspension structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The suspension structure includes apertures formed therein that result in a reduction in the lossy material and its effect on the electrical signals. In addition, the conductor/suspension structure of the present invention provides shielding to reduce the interference from external electric fields. | 06-23-2011 |
20120008237 | WIDE-BANDWIDTH DIELECTRIC WINDOWING FOR CONDUCTOR SUSPENSION STRUCTURE - Approaches for a hard-disk drive suspension interconnect having a wide bandwidth. A suspension interconnect includes a substrate layer, a dielectric layer disposed on the substrate layer, and a plurality of transmission-line (TL) conductors disposed within the dielectric layer. Air gaps may be disposed around the TL conductors to minimize the tendency of the dielectric material to act as an electrical shunt, which impedes high bandwidth signal transmission. An air gap may exist in the dielectric layer between adjacent TL conductors. Additionally, the area adjacent to the plurality of TL conductors, along the direction of signal travel, may alternate between dielectric material and air gaps. Indeed, there need not be any solid material enclosing the TL conductors save for a plurality of dielectric cross ties that provide structural support thereto. The substrate layer may also comprise one or more air gaps underneath a portion of the plurality of TL conductors. | 01-12-2012 |
20120033319 | READ PATH COMPENSATION FOR SNR AND SIGNAL TRANSFER - A method and apparatus is provided for extending a read bandwidth and increasing a high-frequency signal-to-noise ratio (SNR) of a front-end of a read path of a hard disk drive (HDD) by introducing a high impedance section at the front-end of the read path. The high impedance section may mitigate capacitive effects found at the front-end of the read path, thereby improving signal transfer by extending the read bandwidth. | 02-09-2012 |
20120140360 | INTEGRATED LEAD SUSPENSION (ILS) FOR USE WITH A DUAL STAGE ACTUATOR (DSA) - Approaches for integrated lead suspension that provides many benefits, such as enabling a dual stage actuator (DSA) to be used with a single layer flex with a reduced amount of crosstalk. An integrated lead suspension comprises a tail end having a plurality of conductive pads positioned thereat. The plurality of conductive pads includes a first and second dual stage actuator (DSA) pad. The first and second DSA pads are electrically coupled to a conductive member by way of conductive vias. The conductive member may be a stainless steel island. The first DSA pad conducts a signal to a first terminal at each of a plurality of dual stage actuators, while a second terminal at each of the plurality of dual stage actuators is connected to ground. | 06-07-2012 |
20120160538 | INTERLEAVED CONDUCTOR STRUCTURE WITH OFFSET TRACES - An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections. | 06-28-2012 |
20120160548 | INTERLEAVED CONDUCTOR STRUCTURE WITH TRACES OF VARYING WIDTH - An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections. | 06-28-2012 |
20120162825 | INTERLEAVED CONDUCTOR STRUCTURE WITH WRAP AROUND TRACES - An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections. | 06-28-2012 |