| Patent application number | Description | Published |
|---|
| 20090002973 | Mount Board and Electronic Device - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 01-01-2009 |
| 20090096080 | SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE - Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip. | 04-16-2009 |
| 20090135573 | Circuit board device, wiring board interconnection method, and circuit board module device - A circuit board device includes: plurality of wiring boards ( | 05-28-2009 |
| 20090161331 | Circuit Board Device, Wiring Board Connecting Method, and Circuit Board Module Device - A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards | 06-25-2009 |
| 20090266586 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer | 10-29-2009 |
| 20100126708 | HEAT DISSIPATING STRUCTURE AND PORTABLE PHONE - A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature. | 05-27-2010 |
| 20100148335 | SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - A highly reliable semiconductor package in which faulty connections do not occur even when an external substrate is curved. The semiconductor package includes a semiconductor chip | 06-17-2010 |
| 20110242780 | MOUNT BOARD AND ELECTRONIC DEVICE - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 10-06-2011 |
