Patent application number | Description | Published |
20120234580 | CIRCUIT BOARD - A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises a conducting region surrounding a non-conducting region that is substantially centered around a point where the via intersects the surface; a smallest width dimension, e.g. diameter of the non-conducting region is greater than or equal to 4 times the diameter of the via; the via connects a conductive contact pad on one printed circuit board layer to a conductive contact pad on another printed circuit board layer, with the printed circuit board with the non-conducting region lying between the two connected layers; and the largest width dimension of the conductive contact pads on the surfaces of the printed circuit board layers connected by the via are less than the smallest width dimension of the non-conducting region. | 09-20-2012 |
20120279774 | CIRCUIT BOARD - A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via passing through at least one of the printed circuit board layers in a direction hereinafter referred to as the via direction; wherein a surface of a further one of the printed circuit board layers comprises a conducting region surrounding a non-conducting region; the non-conducting region is substantially centered around a point on the surface of the further printed circuit board layer where the via direction intersects the surface; a back-drilled hole passes through the point on the surface; and a smallest width dimension, that includes the point on the surface, of the non-conducting region (e.g. diameter) is greater than the diameter of the back-drilled hole. | 11-08-2012 |
20140176253 | RADIO FREQUENCY COMMUNICATION - A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction. | 06-26-2014 |