Niibori
Hiroyuki Niibori, Tokyo JP
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20090298354 | Spring connector and connector - A spring connector, includes: an electrically conductive metal tube, having a bottomed hole; a plunger, which is provided in the bottomed hole so as to freely move in an axial direction and so as not to slip out from the bottomed hole, and an tip end portion of which is protruded from the bottomed hole; and a spring coil, provided in the bottomed hole, and elastically urging the plunger in a protruding direction. The electrically conductive metal tube includes a small diameter tube part having a smaller outer diameter at a distal end side thereof from which the plunger protrudes, and a soldering part being larger than the small diameter tube part in width in a direction perpendicular to the axial direction, at a backward side of the small diameter tube part in the axial direction, and a face of a distal end side of the small diameter tube part is separated from the soldering part in the direction perpendicular to the axial direction. | 12-03-2009 |
Kenji Niibori, Hiratsuka-Shi JP
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20120248950 | HERMETICALLY SEALED CONTAINER, IMAGE DISPLAY APPARATUS, AND THEIR MANUFACTURING METHODS - A hermetic container comprises first and second substrates and bonded by bonding members to form a hermetically sealed space therebetween. Second bonding members placed on both sides of a first bonding member to form the hermetically sealed space between the substrates are sandwiched between the substrates, thereby bonding the substrates together with the first bonding member. A height of first bonding member is higher than that of second bonding member and at least one of the substrates is elastically deformed and is bonded by the first bonding member and the second bonding members. Thus, the hermetic container in which a compressing force has been applied to a height direction of the first bonding member is obtained. | 10-04-2012 |
Tetsuya Niibori, Mito JP
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20130167665 | SAMPLE OBSERVATION APPARATUS - Test pieces necessary to conduct a failure analysis of defects discovered with a defect review apparatus are produced with high quality, with excellent reproducibility, in a short period of time, and at low costs. An impression marking apparatus which can be driven in a direction perpendicular to a surface of a semiconductor wafer and is equipped with an impression needle fixed on the leading end of the mechanism is attached to a wafer defect review apparatus. A position to which impression marking is applied is determined on the basis of coordinate information on a defect previously acquired with the wafer defect review apparatus. In addition, the feed rate of the impression marking mechanism in the vertical direction thereof is determined on the basis of height information acquired with a height detection sensor for detecting the height of a wafer surface provided in the wafer defect review apparatus. | 07-04-2013 |
20130284924 | CHARGED PARTICLE BEAM APPARATUS - There is provided an apparatus which can accurately carry out focusing of an optical microscope mounted on a charged particle beam apparatus while restraining an increase in an apparatus cost and a reduction in a throughput. An approximate polynomial is formed based on a focus map of the optical microscope which is previously measured, and a control amount which adds a difference between a piece of wafer height information at that occasion and a piece of wafer height information in actual observation to the approximate polynomial is inputted as a focus control value of the optical microscope. | 10-31-2013 |
Tetsuya Niibori, Tokyo JP
Patent application number | Description | Published |
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20140084159 | SCANNING ELECTRON MICROSCOPE AND METHOD FOR PREPARING SPECIMEN - In related art, when a location to be analyzed is selected from inspection data, a relatively highly critical defect among entire defects is not selected as a defect to be analyzed. Further, when a mark is placed in a fixed position associated with a defect, the mark affects the defect itself depending on the shape and size of the defect, which is problematic in the following analysis made in an analysis apparatus. Moreover, in the case of a wafer with no pattern, a defect invisible to a SEM cannot be marked. | 03-27-2014 |
20140210983 | OPTICAL MICROSCOPE DEVICE AND TESTING APPARATUS COMPRISING SAME - The present invention allows observation or capturing of a high-contrast image of a sample for which sufficient contrast cannot be obtained in bright-field observation, such as a wafer having a pattern with a small pattern height. According to the present invention, a sample is illuminated through an objective lens used for capturing an image, and an imaging optics are provided with an aperture filter so that an image is captured while light of bright-field observation components is significantly attenuated. | 07-31-2014 |