Patent application number | Description | Published |
20130082573 | CRYSTAL UNIT AND METHOD FOR FABRICATING THE SAME - A method for fabricating a crystal unit, including a preparing step, a bonding step, and a separating step, is provided. The preparing step prepares a quartz plate and a supporting substrate with a recess that is larger than the vibrating region on a surface of the supporting substrate. The recess corresponds to a vibrating region in the crystal unit. The bonding step bonds the quartz plate to the surface of the supporting substrate such that the quartz plate is separated from the supporting substrate in the recess. The separating step separates the quartz plate into the vibrating region and the framing portion by performing dry etching on the quartz plate such that the quartz plate has a shape that connects the vibrating region to the framing portion via a supporting beam. The framing portion surrounds the vibrating region. | 04-04-2013 |
20130088308 | ACOUSTIC WAVE FILTER - Disclosed is a pass band type acoustic wave filter capable of obtaining an excellent attenuation characteristic in attenuation bands, in which an IDT electrode having a meander structure is used as at least one of the input-side electrode and the output-side electrode, and the attenuation band is provided over/under the pass band. An electrode having a meander structure in which a plurality of IDT blocks are connected to each other in series between the input port or the output port and the ground port is arranged as the input-side IDT electrode and the output-side IDT electrode, and the electrode finger between the neighboring IDT blocks is removed, so as to suppress excitation of an undesired acoustic wave. | 04-11-2013 |
20130093538 | SURFACE ACOUSTIC WAVE DEVICE AND ELECTRONIC COMPONENT - Disclosed is a surface acoustic wave device which has IDT electrodes arranged over a lithium tantalate piezoelectric substrate and is capable of suppressing propagation losses even at a high frequency band equal to or higher than 2 GHz as low as possible in order to utilize surface acoustic waves including LSAW. For this purpose, 45° to 46° rotated YX-cut lithium tantalate substrate is used as the piezoelectric substrate, a thickness of the IDT electrode is set to 7.5% λ to 8% λ, and a metallization ratio in electrode fingers of the IDT electrode is set to 0.55 to 0.65. | 04-18-2013 |
20130119823 | Tuning-Fork Type Piezoelectric Vibrating Piece and Piezoelectric Device - A tuning-fork type piezoelectric vibrating piece ( | 05-16-2013 |
20130135055 | SURFACE MOUNT PIEZOELECTRIC OSCILLATOR - A surface mount piezoelectric oscillator includes a piezoelectric resonator, a mounting board, and an IC chip mounted on the mounting board. An oscillator circuit includes the IC chip and the piezoelectric resonator. The piezoelectric resonator is bonded to the mounting board with solder balls. The mounting board includes a ceramic plate. The mounting board includes connecting terminals and a wiring pattern on the one mounting board principal surface of the mounting board. The connecting terminals are connected to the terminals of the piezoelectric resonator via solder balls. The mounting board includes an intermediate layer on the one mounting board principal surface and integrally formed with the mounting board. The intermediate layer includes solder ball placement openings to position the solder balls in a center of each of the connecting terminals and an IC chip mounting opening to mount the IC chip. | 05-30-2013 |
20130140948 | RESONATOR - A resonator includes an interdigital transducer electrode, a resonance part, a supporting part, and two beam parts. The interdigital transducer electrode is disposed on a piezoelectric thin film. The resonance part is held on a substrate through an air gap. The supporting part supports the resonance part. The two beam parts connect the resonance part to the supporting part at both ends of the resonance part. The air gap forms a level difference at the supporting part or level differences at the respective two beam parts. | 06-06-2013 |
20130154442 | EXTERNAL FORCE DETECTION EQUIPMENT - To easily detect an external force applied to a piezoelectric element with high accuracy and suppress influence of electrostatic charges accumulated in the piezoelectric element. A crystal element is cantilevered inside the container. Excitation electrodes are formed on upper and lower faces, respectively, of the crystal element. A movable electrode connected to the excitation electrode is provided in a leading end portion of the lower face side of the crystal element, and a stationary electrode is provided in a bottom portion of the container. An oscillation loop including the excitation electrodes, the movable electrode, the stationary electrode, and the oscillator circuit is formed. A capacitance change between the electrodes caused by a deflection of the crystal element due to an external force is detected as a frequency. A switch for opening or closing the neutralization path to discharge electrostatic charges generated in the crystal element to the ground is provided. | 06-20-2013 |
20130162362 | SURFACE MOUNT PIEZOELECTRIC OSCILLATOR - A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator. | 06-27-2013 |
20130175897 | DISK RESONATOR AND ELECTRONIC COMPONENT - A contour mode disk resonator includes a substrate, a disk-shaped vibration plate, a pair of input electrodes, a pair of output electrodes, a supporting joist with one end, and an absorbing portion. The pair of input electrodes is disposed to face one another via the vibration plate in a planar view. The pair of output electrodes is disposed to face one another via the vibration plate in a direction intersecting with a direction where the pair of input electrodes faces one another in the planar view. The one end is integrally secured to a portion corresponding to a vibration node that occurs by a contour vibration in an outer periphery of the vibration plate. The supporting joist includes an absorbing portion configured to absorb strain energy generated by the contour vibration in the supporting joist. | 07-11-2013 |
20130187720 | TEMPERATURE COMPENSATION TYPE OSCILLATOR - An oscillator includes a first crystal resonator, a second crystal resonator, a first amplifier circuit for oscillation, a second amplifier circuit for oscillation, a mixer circuit, a frequency selection circuit, and a first frequency conversion circuit. Assuming that resonance frequencies of the first and the second crystal resonators at a reference temperature are respectively F | 07-25-2013 |
20130187723 | PIEZOELECTRIC MODULE - A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles. | 07-25-2013 |
20130193807 | QUARTZ CRYSTAL VIBRATING PIECE AND QUARTZ CRYSTAL DEVICE - An AT-cut quartz crystal vibrating piece with an excitation unit is in a rectangular shape. The quartz crystal vibrating piece includes a framing body, a connecting portion, a pair of excitation electrodes, and a pair of extraction electrodes. The excitation unit has a long side that is rotated at 61° or 119° with respect to the crystallographic axis X. The framing body has a long side that extends in 61° or 119° direction with respect to the crystallographic axis X. The connecting portion extends in 61° or 119° direction with respect to the crystallographic axis X. The connecting portion is perpendicular to a short side of the excitation unit and a short side of the framing body. | 08-01-2013 |