Patent application number | Description | Published |
20100025097 | CIRCUIT CONNECTION STRUCTURE - There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure | 02-04-2010 |
20100108365 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 05-06-2010 |
20100139947 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER - A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 μm and the thickness of the metal layer being 65-125 nm. | 06-10-2010 |
20100208444 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-19-2010 |
20100212943 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-26-2010 |
20100243303 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER - The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component. | 09-30-2010 |
20100277884 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE - The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. | 11-04-2010 |
20100307805 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME - The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability. | 12-09-2010 |
20110267791 | CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL - A circuit connection material | 11-03-2011 |