Patent application number | Description | Published |
20130074582 | GAS SENSOR - A gas sensor including a plate-shaped detecting element is disclosed, wherein the detecting element has a pair of principle surfaces and a pair of side surfaces adjacent to the pair of principle surfaces, in a radical direction thereof, wherein a first chamfered portion is provided between at least one first principal surface of the pair of principal surfaces and the rear end surface of the detecting element, and wherein the angle between a first axis ridgeline portion formed by the first principal surface and a first side surface that is one of the pair of side surfaces and extending in the direction of the axis, and a first width ridgeline formed by the first principal surface and the first chamfered portion and extending in a width direction is larger than 90°. | 03-28-2013 |
20130075141 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes a substrate main body having a first main face and a second main face opposite the first main face; a resistor formed on the first main face; a plurality of first-main-face-side wiring layers which are each formed on the resistor and which each include a grounding metal layer formed of a metal having a resistance lower than that of the resistor and a conductor layer formed on the grounding metal layer; a second-main-face-side wiring layer formed on the second main face; and a via which is formed in the substrate main body and which establishes electrical connectivity between the first-main-face-side wiring layers and the second-main-face-side wiring layer. The wiring substrate further includes a conductive covering layer which covers an upper surface and substantially covers the side surfaces of each of the first-main-face-side wiring layers. | 03-28-2013 |
20130080035 | DETERIORATION SIGNAL GENERATION DEVICE FOR OXYGEN SENSOR - A deterioration signal generation device for an oxygen sensor having a power supply different than a power supply connected to an external device, including a connection unit for electrically connecting the ground lines of the respective power supplies; a first acquisition unit for electrically connecting to a first output line at a reference potential side and to a second output line at a sensor potential side of the oxygen sensor, to obtain first and second potentials, respectively; an operation unit that calculates a first differential value between the first and second potentials; a processing unit that performs an operation on the first differential value; a second acquisition unit that acquires a third potential of a first input line at a reference potential side of the external device; and an output unit that generates the deterioration signal by superposing the second differential value on the third potential. | 03-28-2013 |
20130081862 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region. | 04-04-2013 |
20130098670 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - Embodiments of the present invention provide a wiring substrate that includes a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among the plurality of projection electrodes has a larger outer diameter than an outer diameter of a via conductor and is a variant projection electrode which has a roughened upper surface. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode. | 04-25-2013 |
20130100626 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME - Embodiments of the present invention provide a wiring substrate having a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among a plurality of the projection electrodes is a variant projection electrode which has a recess portion on an upper surface, an outer diameter at the upper end that is larger than an outer diameter at the lower end, and a reverse trapezoidal cross-section shape. Embodiments of the present invention also provide methods for manufacturing wiring substrates having one or more of said variant projection electrode. | 04-25-2013 |
20130111746 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate includes: a first laminate structure formation step of forming a first laminate structure on a support substrate, the first laminate structure including at least one conductor layer and at least one resin insulation layer; a core substrate formation step of laminating a core substrate on the first laminate structure such that a lower main surface of the core substrate comes in contact with the first laminate structure, the core substrate having a metal layer provided on an upper main surface thereof; and a second laminate structure formation step of forming a second laminate structure on the core substrate such that the second laminate structure covers the metal layer, the second laminate structure including at least one conductor layer and at least one resin insulation layer. | 05-09-2013 |
20130112461 | CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole. | 05-09-2013 |
20130131997 | SENSOR CONTROL DEVICE AND SENSOR CONTROL SYSTEM - A sensor control device for connection to an oxygen sensor including a sensing element that measures oxygen concentration in an intake atmosphere of an internal combustion engine and a heater that heats the sensing element, including a detection unit that detects an output signal corresponding to the oxygen concentration output from the sensing element and a calculation unit that calculates a compensation coefficient of the output signal that is used when calculating the oxygen concentration. The calculation unit collects compensation information used in calculating the compensation coefficient when the internal combustion engine is in operation and in a specific operation state in which the oxygen concentration in the intake atmosphere is subject to estimation. Also disclosed is a sensor control system which includes an oxygen sensor and the sensor control device. | 05-23-2013 |
20130160290 | METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD - Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers. | 06-27-2013 |
20130160730 | CERAMIC HEATER AND MANUFACTURING METHOD THEREFOR, AND HEATING APPARATUS - A ceramic heater having a substrate and a heat-generating element. The substrate is formed from an electrically insulating ceramic and extends rearward from the forward end of the ceramic heater in the direction of the axis. The heat-generating element has a heat-generating portion formed from an electrically conductive ceramic which contains silicon nitride and an electrically conductive material, disposed in a forward end portion of the substrate, and having a shape resembling the letter U as viewed along the direction of the axis. The heat-generating portion has a fracture toughness of 4.3 MPa·m | 06-27-2013 |
20130161079 | MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Embodiments of the presently-disclosed subject matter include a multilayer wiring substrate including a first laminated structure that includes at least one conductive layer and at least one resin insulating layer; a core substrate that includes a reinforced fiber and that is laminated on the first laminated structure; and a second laminated structure that includes at least one conductive layer and at least one resin insulating layer and that is formed on the core substrate; and a plurality of via conductors which penetrate the first laminated structure, the core substrate, and the second laminated structure in the thickness direction, wherein the plurality of via conductors all expand in diameter in one direction, and the reinforced fiber is located above a center of the core substrate in the thickness direction. | 06-27-2013 |
20130180772 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H | 07-18-2013 |
20130180853 | GAS SENSOR PROCESSING APPARATUS - A gas sensor processing apparatus ( | 07-18-2013 |
20130192988 | GAS SENSOR ELEMENT AND GAS SENSOR - A gas sensor element in which an adhesion layer ( | 08-01-2013 |