Nevin
Nevin Altunyurt, Chandler, AZ US
Patent application number | Description | Published |
---|---|---|
20140203417 | MITIGATION OF FAR-END CROSSTALK INDUCED BY ROUTING AND OUT-OF-PLANE INTERCONNECTS - In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described. | 07-24-2014 |
20150228583 | RELIABLE MICROSTRIP ROUTING FOR ELECTRONICS COMPONENTS - Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die. | 08-13-2015 |
Nevin Altunyurt, Dearborn, MI US
Patent application number | Description | Published |
---|---|---|
20140264907 | STUBBY PADS FOR CHANNEL CROSS-TALK REDUCTION - A metal surface feature, such as a pad, terminating a vertical transition through a substrate, such as an IC package substrate, includes one or more stubs providing high edge surface area to couple with one or more complementary stubs on an adjacent metal surface feature to provide a desired amount of mutual capacitance that may at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent pads is provided for more than two pads to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, the pads have a large pitch (e.g., 1000 μm) suitable for interfacing to an interposer or PCB socket, while the gap between the stubs is small (e.g., 15 μm), as limited only by the minimum spacing allowed for metal features on the opposite side of the package employed for interfacing to the IC. | 09-18-2014 |
Nevin Altunyurt, Ann Arbor, MI US
Patent application number | Description | Published |
---|---|---|
20160031331 | INDUCTIVE WIRELESS POWER TRANSFER SYSTEM HAVING A COUPLER ASSEMBLY - A vehicle includes an inductive charge coupling arrangement that can be electrically connected with a traction battery. The arrangement includes a charge coil and a plurality of permeable panels surrounding the charge coil. The vehicle further includes at least one controller that, in response to an inductive charge request, causes the panels to move to positions selected to minimize electromagnetic field leakage between the charge coil and a charge station. | 02-04-2016 |
Nevin Bekir, Gebze TR
Patent application number | Description | Published |
---|---|---|
20130324747 | Process for Industrial Production of 2-Methyl-1,4-Naphthaquinone - The present invention describes a process for producing 2-methyl-1,4-naphthoquinone by oxidizing 2-methylnaphthalene with fresh hydrogen peroxide in the presence of glacial acetic acid without any mineral or transition metal catalyst. | 12-05-2013 |
Nevin Kleege, Vista, CA US
Patent application number | Description | Published |
---|---|---|
20090127412 | Track suspension device - A device for suspending equipment such as a lighting fixture or public address speaker from a ceiling mounted track ( | 05-21-2009 |
Nevin Naguib Sant, Aurora, IL US
Patent application number | Description | Published |
---|---|---|
20110239836 | COMPOSITION FOR IMPROVING DRYNESS DURING WIRE SAWING - The invention provides a composition for slicing a substrate using a wire saw wherein the composition comprises a liquid carrier and an abrasive. The invention further provides methods of slicing a substrate using a wire saw and a composition. | 10-06-2011 |
20110240002 | CUTTING FLUID COMPOSITION FOR WIRESAWING - The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen suppression agent. | 10-06-2011 |
20110303210 | WIRESAW CUTTING METHOD - The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method. | 12-15-2011 |
20140073226 | POLYPYRROLIDONE POLISHING COMPOSITION AND METHOD - The invention provides a polishing composition containing a pyrrolidone polymer, an aminophosphonic acid, a tetraalkylammonium salt, and water, wherein the composition has a pH of about 7 to about 11.7. The invention further provides a method of using such a polishing composition to polish a substrate, especially a substrate containing silicon. | 03-13-2014 |