Neaves
Evan R Neaves, Middletown, DE US
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20150308615 | Bed-Mounted Pet Feeder with Adjustable Stand - The invention provides a bed-mounted pet feeder that allows pet owners to have their pet's food and/or water dish mounted to a person's bed via box spring, footboard, bed post, or bed frame, so that their pets can easily access their food or water while still on the person's bed. The adjustable mounting mechanism allows the feeder to be mounted to the bed in a variety of ways, alleviating the need for pet owners to have to take their pets off the bed in the middle of the night or for their pets to go hungry or thirsty while their owners are sleeping. The adjustable stand also accommodates the many shapes and sizes of pets, allowing them to easily eat or drink whether they are standing or sitting on the bed. The bowls fit securely in the stand and create stability as the pet eats or drinks, reducing the risk of spilling on the bed. | 10-29-2015 |
Jeffrey E. Neaves, Duluth, GA US
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20080230496 | Universal rack mount mechanism - A system and method are described for a variable mount arm assembly for installing support structures within different types of rack systems. Embodiments of the invention disclose a rack system support member comprising a rotatable bracket having first and second mounting interfaces on first and second mounting faces of the bracket. The rotatable bracket can be secured in a first position to mount the support member in a rack system that uses the first mounting interface. The bracket can be released from the first position and rotated to a second position to mount the support member in a rack system that employs the second mounting interface. | 09-25-2008 |
Jeffrey Eugene Neaves, Duluth, GA US
Patent application number | Description | Published |
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20110080699 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves. | 04-07-2011 |
20120176753 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves. | 07-12-2012 |
Jeffrey Eugene Neaves, Cupertino, CA US
Patent application number | Description | Published |
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20140247567 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves. | 09-04-2014 |
Michael G. Neaves, Austin, TX US
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20150236584 | VOLTAGE GENERATOR WITH RAMP RATE CONTROL - A charge pump system includes a comparator having a first input coupled to a first reference voltage, a second input coupled to a feedback signal and an output coupled to control operation of a voltage controlled oscillator. The feedback signal is coupled to an output of the charge pump system. An amplifier has a first input coupled to a second reference voltage, a second input coupled to the feedback signal, and an output coupled as input to the voltage controlled oscillator. A gain of the amplifier is lower than a gain of the comparator. | 08-20-2015 |
Philip Neaves, Horsell Village GB
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20090072389 | STRUCTURE AND METHOD FOR FORMING A CAPACITIVELY COUPLED CHIP-TO-CHIP SIGNALING INTERFACE - A system and method for providing capacitively-coupled signaling in a system-in-package (SiP) device is disclosed. In one embodiment, the system includes a first semiconductor device and an opposing second semiconductor device spaced apart from the first device, a dielectric layer interposed between the first device and the second device, a first conductive pad positioned in the first device, and a second conductive pad positioned in the second device that capacitively communicate signals from the second device to the first device. In another embodiment, a method of forming a SiP device includes forming a first pad on a surface of a first semiconductor device, forming a second pad on a surface of a second semiconductor device, and interposing a dielectric layer between the first semiconductor device and the second semiconductor device that separates the first conductive signal pad and the second conductive signal pad. | 03-19-2009 |
20100283158 | STRUCTURE AND METHOD FOR FORMING A CAPACITIVELY COUPLED CHIP-TO-CHIP SIGNALING INTERFACE - A system and method for providing capacitively-coupled signaling in a system-in-package (SiP) device is disclosed. In one embodiment, the system includes a first semiconductor device and an opposing second semiconductor device spaced apart from the first device, a dielectric layer interposed between the first device and the second device, a first conductive pad positioned in the first device, and a second conductive pad positioned in the second device that capacitively communicate signals from the second device to the first device. In another embodiment, a method of forming a SiP device includes forming a first pad on a surface of a first semiconductor device, forming a second pad on a surface of a second semiconductor device, and interposing a dielectric layer between the first semiconductor device and the second semiconductor device that separates the first conductive signal pad and the second conductive signal pad. | 11-11-2010 |