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Neaves

Jeffrey E. Neaves, Duluth, GA US

Patent application number	Description	Published
20080230496	Universal rack mount mechanism - A system and method are described for a variable mount arm assembly for installing support structures within different types of rack systems. Embodiments of the invention disclose a rack system support member comprising a rotatable bracket having first and second mounting interfaces on first and second mounting faces of the bracket. The rotatable bracket can be secured in a first position to mount the support member in a rack system that uses the first mounting interface. The bracket can be released from the first position and rotated to a second position to mount the support member in a rack system that employs the second mounting interface.	09-25-2008

Jeffrey Eugene Neaves, Duluth, GA US

Patent application number	Description	Published
20110080699	EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.	04-07-2011

Philip Neaves, Horsell Village GB

Patent application number	Description	Published
20090072389	STRUCTURE AND METHOD FOR FORMING A CAPACITIVELY COUPLED CHIP-TO-CHIP SIGNALING INTERFACE - A system and method for providing capacitively-coupled signaling in a system-in-package (SiP) device is disclosed. In one embodiment, the system includes a first semiconductor device and an opposing second semiconductor device spaced apart from the first device, a dielectric layer interposed between the first device and the second device, a first conductive pad positioned in the first device, and a second conductive pad positioned in the second device that capacitively communicate signals from the second device to the first device. In another embodiment, a method of forming a SiP device includes forming a first pad on a surface of a first semiconductor device, forming a second pad on a surface of a second semiconductor device, and interposing a dielectric layer between the first semiconductor device and the second semiconductor device that separates the first conductive signal pad and the second conductive signal pad.	03-19-2009
20100283158	STRUCTURE AND METHOD FOR FORMING A CAPACITIVELY COUPLED CHIP-TO-CHIP SIGNALING INTERFACE - A system and method for providing capacitively-coupled signaling in a system-in-package (SiP) device is disclosed. In one embodiment, the system includes a first semiconductor device and an opposing second semiconductor device spaced apart from the first device, a dielectric layer interposed between the first device and the second device, a first conductive pad positioned in the first device, and a second conductive pad positioned in the second device that capacitively communicate signals from the second device to the first device. In another embodiment, a method of forming a SiP device includes forming a first pad on a surface of a first semiconductor device, forming a second pad on a surface of a second semiconductor device, and interposing a dielectric layer between the first semiconductor device and the second semiconductor device that separates the first conductive signal pad and the second conductive signal pad.	11-11-2010