Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Nathan, IL
Ilana Nathan, Omer IL
| Patent application number | Description | Published |
|---|---|---|
| 20110237496 | ANTINECROTIC ACTIVITY OF ALPHA 1-ANTITRYPSIN - The present invention is related to the use of alpha-1-antitrypsin as an anti-necrotic agent. This invention provides a method for the treatment of tissue necrosis by administration of alpha-1-antitrypsin. This invention further provides methods for prophylactic treatment of tissue necrosis and for inhibition of tissue necrosis in culture by addition of alpha-1-antitrypsin. | 09-29-2011 |
Menachem Nathan, Tel Aviv IL
| Patent application number | Description | Published |
|---|---|---|
| 20090066964 | DISPLACEMENT SENSOR BASED ON PHOTONIC CRYSTAL WAVEGUIDES - A displacement sensor comprising at least one pair of co-planar photonic crystal waveguide (PCWG) sections aligned along or parallel to a common axis and separated by a gap, one PCWG section of a pair operative to perform a displacement relative to the other section of the pair. In some embodiments, the sensor is linear, comprising two PCWG sections separated by a gap that forms a cross PCWG, the displacement sensing performed preferrably differentially between two edges of the cross PCWG. In other embodiments, the sensor includes Mach Zehnder Interferometer (MZI) configurations with gaps between fixed and moving PCWG sections. Displacement induced changes in the gap widths are reflected in changes in an output parameter of the MZI. | 03-12-2009 |
| 20100013979 | SNAPSHOT SPECTRAL IMAGING SYSTEMS AND METHODS - Digital cameras for spectrally imaging an object or scene comprise an imaging component, a fixed one-dimensional disperser and an image sensor having sensor pixels, the disperser and image sensor arranged with matching optical parameters and in a predetermined spatial relationship. Each sensor pixel detects multiplexed spectral information from at least two adjacent object points and the spectral information detected by each sensor pixel is demultiplexed and processed into spectral-spatial data to provide spectral images. | 01-21-2010 |
| 20100073110 | SOLID STATE TERAHERTZ RADIATION FREQUENCY MULTIPLIER - A nonlinear solid-state device useful for frequency conversion of electromagnetic radiation and in particular for harmonic generation, comprising a waveguiding electromagnetically distributed structure (WEDS) which includes monolithically a synthetic nonlinear material (SNM). Input radiation coupled into the WEDS is converted into a higher frequency output radiation through a constricted oscillatory motion of charge carriers and phase matched harmonic frequency generation of radiation which builds up coherently over an interaction length many time larger than the radiation wavelengths. In one embodiment, microwave radiation is converted into terahertz radiation. In other embodiments, SNM based WEDS devices are adapted for frequency mixing and parametric oscillation. | 03-25-2010 |
| 20100231920 | LIGHT-EMITTING INTRA-CAVITY INTERFEROMETRIC SENSORS - Light-emitting intra-cavity interferometric (ICI) optical sensors based on channel waveguide structures which include an internal light emitting material and a functionalized region. In some embodiments, the waveguides are made of a sol-gel which incorporates the light emitting material. In some embodiments, the waveguide structure includes an ICI resonator backbone and the ICI sensor is a laser sensor. In some embodiments, the resonator backbone has an interferometric Y-branch shape. In some embodiments, the resonator backbone has a Mach Zehnder interferometer shape. In some embodiments, an ICI laser sensor has an interferometric arrayed waveguide grating shape. In some embodiments, an ICI sensor may be remotely optically pumped and remotely read. | 09-16-2010 |
| 20110238132 | Self Powered Ostogenesis and Osseointegration Promotion and Maintenance Device for Endosseous Implant - Osteogenesis and osseointegration promotion and maintenance devices for osseous implants include an implant member having a first electrode, an inlaid second electrode positioned on the member so that it is electrically isolated from and substantially flush with the member surface, and an electrical stimulation mechanism preferably located at the member and operative to provide electrical stimulation signals to endosseous tissue surrounding the implant through the first and second electrodes. The first electrode may be the member itself or a second inlaid electrode. The implant is thus electrically functionalized for osteogenesis and osseointgration acceleration. The device is applicable to both non-dental and dental implants. In all embodiments, the use of inlaid electrode(s) enables the general appearance, external surface and mechanical integrity of the implant to be left essentially unchanged. | 09-29-2011 |
Menachem Nathan, Tel Aviv-Yafo IL
| Patent application number | Description | Published |
|---|---|---|
| 20090142656 | 3-D MICROBATTERIES BASED ON INTERLACED MICRO-CONTAINER STRUCTURES - An electrical energy storage device ( | 06-04-2009 |
Ofer J. Nathan, Kiryat Tivon IL
| Patent application number | Description | Published |
|---|---|---|
| 20090132844 | Method, Apparatus, and System for optimizing Frequency and Performance in a Multi-Die Microprocessor - With the progress toward multi-core processors, each core is can not readily ascertain the status of the other dies with respect to an idle or active status. A proposal for utilizing an interface to transmit core status among multiple cores in a multi-die microprocessor is discussed. Consequently, this facilitates thermal management by allowing an optimal setting for setting performance and frequency based on utilizing each core status. | 05-21-2009 |
Roger Nathan, Herzlia B IL
| Patent application number | Description | Published |
|---|---|---|
| 20090177131 | GAIT MODULATION SYSTEM AND METHOD - An electrical stimulation orthosis and method therefor, the orthosis including: (a) an at least semi-rigid frame configured to substantially envelop a limb segment, the frame having at least one first complementary mechanical fastener associated therewith; (b) a surface electrical stimulation electrode assembly associated with, and supported by, the frame, the assembly having a surface stimulation electrode for contacting at least one stimulation point on the limb segment, the surface electrode assembly having an electrode base for electrically associating, via the frame, with a stimulator unit for providing a stimulation signal to the surface electrode, the electrode base having a top face for receiving the stimulation electrode, and a bottom face having at least one second complementary mechanical fastener, the first and second fasteners adapted for reversible attachment and detachment, at a plurality of locations on the frame, thereby enabling the electrical stimulation electrode assembly to be adjustably and reversibly positioned on the frame. | 07-09-2009 |
Roger H. Nathan, Nof-Yam IL
| Patent application number | Description | Published |
|---|---|---|
| 20110152968 | ORTHOSIS FOR A GAIT MODULATION SYSTEM - A functional electrical stimulation (FES) orthosis for FES to a limb segment, including: (a) a semi-rigid, self-retaining C-shaped frame, the frame configured to substantially envelop the limb segment, the frame including a first flexible and elongated circumferentially retaining element and at least a first and a second opposing flexible and elongated circumferentially retaining elements disposed on the circumferentially opposite side of the frame, the first retaining element and the first opposing retaining element forming a pair of opposing retaining elements, and (b) a surface electrical stimulation electrode for contacting at least one stimulation point on a surface of the limb segment, associated with, and supported by, the frame, the surface electrode for electrically associating, via the frame, with a neuroprosthetic stimulator unit, so as to provide FES, wherein the opposing retaining elements are configured to be radially spring-loaded towards a center of the frame, such that in donning the orthosis around the limb segment, the limb segment applies a counter-pressure from within the frame, against the opposing retaining elements, such that the orthosis is firmly and fixedly self-retained in a pre-determined position on the surface. | 06-23-2011 |
Roi Nathan, Halfa IL
| Patent application number | Description | Published |
|---|---|---|
| 20100032075 | PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD - A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip. | 02-11-2010 |
Roi Nathan, Haifa IL
| Patent application number | Description | Published |
|---|---|---|
| 20080204533 | A Method of Ink Supply to Inkjet Print Head Array - Disclosed is an inkjet print head array with improved ink supply system. The system includes an ink manifold having at least two ink supply channels, a plurality of print head modules disposed along ink supply channels and forming the array, with each of the print head modules having at least two ink inlet ports. The ports are in fluid communication with the ink supply channels. Each of the ink supply channels supplies ink to each of the ports at a different flow rate, although the resulting ink supply flow rate is equal for each print head module. | 08-28-2008 |
| 20090135219 | METHOD OF COOLING AND SERVICING AN INKJET PRINT HEAD ARRAY - A compliant cooling conduit is employed to extract heat from an inkjet print head array. The cooler conduit is implemented as a flexible conduit placed between the heat emitting surfaces. Cooling fluid pressure presses the conduit to the heat emitting parts of the print head modules. When fluid pressure is removed the conduit collapses and provides convenient access for print head service. | 05-28-2009 |
