Patent application number | Description | Published |
20090032779 | CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent. | 02-05-2009 |
20090087580 | INK COMPOSITION, PATTERN FORMATION METHOD AND DROPLET DISCHARGE DEVICE - An ink composition includes a conductive fine particle, a dispersion medium in which the conductive fine particle is dispersed, and a combustion substance that starts a combustion reaction by receiving light. | 04-02-2009 |
20090090272 | CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink which can be stably ejected from a liquid droplet ejection head, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member using a liquid droplet ejecting method and comprised of a dispersion solution. The dispersion solution includes a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a drying suppressant contained in the water-based dispersion medium, the drying suppressant being contained for preventing drying of the dispersion solution. | 04-09-2009 |
20090110889 | CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink capable of forming a conductive pattern while preventing occurrence of disconnection thereof due to thermal expansion of a ceramic molded body, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern on a ceramic sintered body, wherein the ceramic sintered body with the conductive pattern is produced by the steps of applying the ink onto a ceramic molded body to obtain a pre-pattern on the ceramic molded body, and subjecting the ceramic molded body with the pre-pattern to a degreasing and sintering treatment. The ink contains a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a disconnection preventive agent composed of an organic matter and contained in the water-based dispersion medium, the disconnection preventive agent having a function of providing such a property that the pre-pattern can be deformed according to thermal expansion of the ceramic molded body due to the degreasing and sintering treatment to the pre-pattern, to thereby prevent occurrence of disconnection of the conductive pattern. | 04-30-2009 |
20090145519 | FILLING LIQUID - In a droplet ejection apparatus for forming a conductive pattern with a conductive pattern formation ink comprised of a water-based dispersion medium and metal particles dispersed in the water-based dispersion medium by an ink jet method, the droplet ejection apparatus includes a droplet ejection head having a reservoir with ink chambers for storing the conductive pattern formation ink and a plurality of nozzles from which droplets of the conductive pattern formation ink are to be ejected by the ink jet method. A filling liquid is used instead of the conductive pattern formation ink for filling the reservoir and the ink chambers to prevent the reservoir and the ink chambers from being dried when the droplet ejection apparatus is not used for a certain period of time. The filing liquid is comprised of the water-based dispersion medium, a sugar alcohol A and a surfactant A. The filling liquid can be easily and reliably replaced with the conductive pattern formation ink. | 06-11-2009 |
20090145638 | CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less. | 06-11-2009 |
20090145639 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; galactitol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.10 to 0.60; | 06-11-2009 |
20090145640 | CONDUCTIVE PATTERN FORMATION INK, METHOD OF FORMING CONDUCTIVE PATTERN, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink capable of forming a conductive pattern having high reliability, a conductive pattern having high reliability, a method of forming a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink from a liquid droplet ejection head on a surface of a ceramic molded body made of a material containing ceramic particles and a binder, the liquid droplet ejection head having ejection portions for ejecting the ink in the form of liquid droplets and an ejection surface on which the ejection portions open. The ink contains a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a surface tension adjuster that is contained in the water-based dispersion medium and adjusts surface tension of the ink, wherein in the ink whose surface tension is adjusted by the surface tension adjuster, a contact angle of the ink with respect to the ejection surface of the liquid droplet ejection head at 25° C. is in the range of 50 to 90°, and a contact angle of the ink with respect to the surface of the ceramic molded body at 25° C. is in the range of 45 to 85°. | 06-11-2009 |
20090146113 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; xylitol; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.70, and | 06-11-2009 |
20090146114 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; sorbitol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following Formula (I) is 0.20 to 0.80; | 06-11-2009 |
20090148671 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; mannitol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.10 to 0.65; | 06-11-2009 |
20090148676 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; erythritol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.15 to 0.80; | 06-11-2009 |
20090148679 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method, includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; sugar alcohol derived from a disaccharide; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.80. | 06-11-2009 |
20090148680 | CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBSTRATE - A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; inositol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.050 to 0.70; | 06-11-2009 |
20090308646 | CONDUCTOR PATTERN FORMING INK, CONDUCTOR PATTERN, AND WIRING SUBSTRATE - A conductor pattern forming ink for forming a conductor pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; and at least one of a compound expressed by Formula (I) below and alkanolamine. | 12-17-2009 |
20100124620 | PATTERNED SUBSTRATE MANUFACTURING METHOD, AND ELECTRIC-OPTICAL DEVICE MANUFACTURING METHOD - A patterned substrate manufacturing method is for manufacturing a patterned substrate having a plurality of patterns formed by drying liquid droplets containing a pattern forming material. The patterned substrate manufacturing method includes providing a photothermal conversion part that is configured to convert infrared light into heat on an outside perimeter of each of a plurality of pattern forming regions, each of the pattern forming regions corresponding to each of the patterns, arranging the liquid droplets within the pattern forming regions, shining infrared light on the patterned substrate, and drying the liquid droplets by heat resulting from the photothermal conversion by the photothermal conversion parts. | 05-20-2010 |
20110050786 | INK COMPOSITION AND PATTERN FORMING METHOD - An ink composition includes a metal microparticle, a dispersion medium having water as a main ingredient, a dispersant for dispersing the metal microparticle into the dispersion medium, and a water-soluble polyhydric alcohol that is trivalent to hexavalent and solid under normal conditions, and whose concentration is 5 to 20 weight % relative to a total weight of the ink composition. | 03-03-2011 |
20110169884 | METHOD FOR FORMING CONDUCTOR PATTERN, WIRING BOARD, AND LIQUID DROPLET EJECTING APAPRATUS - A method for forming a conductor pattern includes: forming a conductor pattern precursor by ejecting liquid droplets of a conductor pattern forming ink by a liquid droplet ejecting method onto a substrate, and drying the liquid droplets, thereby forming a conductor pattern precursor having a pad part and a wiring part connected to the pad part on the substrate; and firing the precursor, thereby forming the conductor pattern, wherein in the formation of the conductor pattern precursor, the liquid droplets of the conductor pattern forming ink are ejected in such a manner that positions where the liquid droplets of the conductor pattern forming ink are attached form plural concentric annular shapes within a pad forming region where the pad part is to be formed on the substrate. | 07-14-2011 |
20110212823 | CERAMIC SHAPED BODY AND WIRING BOARD - A ceramic shaped body for producing a wiring board includes a ceramic material, a binder, and a polyalcohol, the polyalcohol being present in at least a near-surface region of the ceramic shaped body. | 09-01-2011 |
20130196125 | RECORDING MATERIAL - A recording material produced by using an ultraviolet-curable composition for inkjet that includes a polymerized compound and a glittering powder includes a recording medium and a print layer formed on the recording medium. The thickness of the print layer is T (μm). When an area that is thickness 0.5T (μm) from an outer surface in the print layer is a first area and an area that is thickness 0.5T (μm) from a contact surface contacting the recording medium in the print layer is a second area, a ratio of the glittering powder included in the first area of the print layer is more than 70 percent by volume and less than 95 percent by volume, and a ratio of the glittering powder included in the second area of the print layer is more than 5 percent by volume and less than 30 percent by volume. | 08-01-2013 |
20130196126 | ULTRAVIOLET-CURABLE COMPOSITION FOR INKJET AND RECORDING MATERIAL - An ultraviolet-curable composition for inkjet, which is discharged by an inkjet method, includes a polymerized compound, a metal powder, and a dispersant. The metal powder is treated by a surface preparation with a fluorinated silane compound and/or a fluorinated phosphate ester as a surface preparation agent. The dispersant has a polymeric structure in a basic. | 08-01-2013 |
20130196127 | COMPOSITION FOR INKJET AND RECORDING MATERIAL - A composition for inkjet adapted to be discharged by an inkjet method includes a metal powder, an organic solvent, and a binder resin. The metal powder is treated by a surface preparation with a fluorinated silane compound and/or a fluorinated phosphate ester as a surface preparation agent. | 08-01-2013 |
20140302291 | RECORDING MATERIAL - A recording material includes an ultraviolet-curable composition for inkjet that includes a polymerized compound and a glittering powder to produce the recording material, a recording medium, and a print layer formed on the recording medium. The content rate of the glittering powder in the print layer is more than 0.1 percent by volume and less than 5.0 percent by volume. | 10-09-2014 |