| Patent application number | Description | Published |
|---|
| 20090085304 | GASKET AND AUTOMOTIVE COMPONENT - A gasket for use around a thread neck of an automotive component, the gasket dimensioned to prevent the gasket from falling off of the thread neck and to prevent a male screw portion from biting into the gasket. | 04-02-2009 |
| 20100242888 | SPARK PLUG FOR INTERNAL COMBUSTION ENGINE - In a spark plug having a precious metal tip joined to the front end portion of a ground electrode, the stable junction state of the precious metal tip is guaranteed for a long time. A precious metal tip | 09-30-2010 |
| 20100253203 | SPARK PLUG - An ignition part ( | 10-07-2010 |
| 20100264796 | SPARK PLUG - There is provided a spark section ( | 10-21-2010 |
| 20100264801 | SPARK PLUG AND PROCESS FOR PRODUCING THE SPARK PLUG - A spark plug in which an ignition portion of a ground electrode formed through joining of a noble metal chip to the ground electrode has high durability, and a method of manufacturing the spark plug. | 10-21-2010 |
| 20100264802 | SPARK PLUG AND PROCESS FOR PRODUCING THE SPARK PLUG - A spark plug in which an ignition portion of a ground electrode formed through joining of a noble metal chip to the ground electrode has high durability, and a method of manufacturing the spark plug. | 10-21-2010 |
| 20110025185 | SPARK PLUG - A spark member ( | 02-03-2011 |
| 20110163653 | SPARK PLUG - A spark plug includes a cylindrical metal shell; a cylindrical insulator that is held in the metal shell; a center electrode; and a ground electrode that comprises a ground electrode main body part and a noble metal tip, a spark discharge gap being formed between the leading end of the center electrode and the noble metal tip wherein at least a portion of the ground electrode main body part, to which the noble metal tip is joined, is made of Ni alloy containing 12 to 35 mass % of Cr, 7 mass % or less of Fe, 0.5 to 5 mass % of Al, 0.3 to 5 mass % of Si and 50 mass % or more of the balance, and wherein the joined portion and the noble metal tip are joined by laser welding or electron beam welding. | 07-07-2011 |
| 20120062099 | SPARK PLUG - An object of the invention is to restrain separation of an electrode tip from a ground electrode or from a center electrode. A spark plug satisfies a condition 0.8≦A1/A2≦1.9, where, as viewed on a section which contains a center axis (O) of an electrode tip, A1 [Hv] is hardness of the electrode tip as measured outside a circle having a radius of 0.2 mm, with a boundary point (PA) on a surface of the spark plug between a fusion zone and the electrode tip serving as the center of the circle, and A2 [Hv] is hardness of the electrode tip as measured within the circle having a radius of 0.2 mm. | 03-15-2012 |
| Patent application number | Description | Published |
|---|
| 20090089601 | Network system - Power consumption on GMPLS controlled networks can be reduced by cutting power consumption on spare paths that are not normally used. To achieve power consumption reduction, in the path setting process, a path is calculated while taking the power saving capability of each interface into account, and the applicable interface is set to the power-saving state when setting the spare path. When the spare path was set to the operating state, then the power-saving state on the applicable interface was canceled so that interface could operate normally. | 04-02-2009 |
| 20090310482 | Communication Node and Communication System - In a network wherein a data plane for communicating user data, and a control plane for managing data forwarders are configured of different media, the path teardown of the data plane which is forwarding the data is prevented when a fault has occurred in only the control plane. When the GMPLS controller of the control plane has detected refresh timeout with respect to an adjacent node ( | 12-17-2009 |
| 20100189118 | PACKET TRANSFER METHOD AND NODE APPARATUS - In a L2VPN, where Ethernet frames are encapsulated and transferred, when an edge node disposed at an entrance of the L2VPN encapsulates an Ethernet frame, the data type of the payload of the Ethernet frame is checked. If the payload data type includes time-to-live (TTL) information, whether to encapsulate or discard the frame is judged according to the TTL value. One material for judging whether to discard the frame is a condition that the TTL value is larger than ‘1’ and smaller than a predetermined threshold. | 07-29-2010 |
| 20110091212 | PACKET TRANSFER DEVICE - An optical multi-drop path is set to a downstream direction, an optical path between adjacent nodes is set to a upstream direction, a packet sorting unit is provided for appropriately controlling packet streams in the downstream direction and upstream direction, and one-to-one or one-to-N communication can be performed not only between servers and clients but also between the clients even when a multi-drop transmission is used in the downstream direction. | 04-21-2011 |
| Patent application number | Description | Published |
|---|
| 20090269598 | CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME - A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler. | 10-29-2009 |
| 20100101845 | Electronic Device and Manufacturing Method for Electronic Device - An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved. | 04-29-2010 |
| 20110095423 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD - A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it. | 04-28-2011 |
| 20110108997 | MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT - A semiconductor package component ( | 05-12-2011 |
| 20120073869 | CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME - A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L | 03-29-2012 |
