Patent application number | Description | Published |
20100270891 | SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member. | 10-28-2010 |
20110260577 | PIEZOELECTRIC RESONATOR DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device is provided with a piezoelectric resonator plate, and first and second sealing members that hermetically seal driving electrodes formed on the piezoelectric resonator plate. The piezoelectric resonator plate and the first sealing member are bonded together with a bonding material, and the piezoelectric resonator plate and the second sealing member are bonded together with a bonding material. Also, a multiple-surface bonding portion and a spread preventing portion are provided in at least either of a bonding area between the piezoelectric resonator plate and the first sealing member and a bonding area between the piezoelectric resonator plate and the second sealing member, the multiple-surface bonding portion allowing a bonding material to be bonded to multiple surfaces of different surface orientations, and the spread preventing portion being located on an outer side of the multiple-surface bonding portion and preventing a bonding region bonded to the bonding material from being enlarged. | 10-27-2011 |
20120012356 | PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING THE PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE USING THE PACKAGE MEMBER - [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face. | 01-19-2012 |
20120055708 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package includes a first sealing member and a second sealing member. The first sealing member has one principal surface on which an electronic component element is to be mounted. The second sealing member is opposite the first sealing member. The second sealing member hermetically encloses an electrode of the electronic component element. A through hole passes through between one principal surface and another principal surface of a substrate constituting the first sealing member. A conducting material fills the through hole. A resin material seals an open end portion of the through hole at a side of the other principal surface of the substrate. | 03-08-2012 |
20120067611 | SEALING MEMBER FOR ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material. | 03-22-2012 |
20120187805 | PIEZOELECTRIC RESONATOR PLATE AND MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR PLATE - In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed. | 07-26-2012 |
20120313721 | ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material. | 12-13-2012 |
20140047687 | PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR DEVICE, AND METHOD FOR ETCHING CONSTITUENT MEMBER OF PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface. | 02-20-2014 |
20140083735 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGE MANUFACTURING METHOD - An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W | 03-27-2014 |
20140346930 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE SEALING MEMBER AND METHOD FOR PRODUCING THE ELECTRONIC COMPONENT PACKAGE SEALING MEMBER - The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole | 11-27-2014 |