Patent application number | Description | Published |
20120181668 | INK JET PRINTABLE ETCHING INKS AND ASSOCIATED PROCESS - The present invention refers to a method for contactless deposition of new etching compositions onto surfaces of semiconductor devices as well as to the subsequent etching of functional layers being located on top of these semiconductor devices. Said functional layers may serve as surface passivation layers and/or anti-reflective coatings (ARCs). | 07-19-2012 |
20140131627 | INDACENO DERIVATIVES AS ORGANIC SEMICONDUCTORS - The invention relates to novel organic semiconducting compounds containing one or more dialkylidene-s-indacenodiheteroarene groups, methods for their preparation and educts or intermediates used therein, polymers, blends, mixtures and formulations containing them, the use of the compounds, polymers, blends, mixtures and formulations as semiconductor in organic electronic (OE) devices, especially in organic photovoltaic (OPV) devices, and to OE and OPV devices comprising these compounds, polymers, blends, mixtures or formulations. | 05-15-2014 |
20140131628 | CONJUGATED POLYMERS - The invention relates to novel polymers containing one or more units derived from fused bis(thienothiophene) moieties, methods for their preparation and monomers used therein, blends, mixtures and formulations containing them, the use of the polymers, blends, mixtures and formulations as semiconductor in organic electronic (OE) devices, especially in organic photovoltaic (OPV) devices, and to OE and OPV devices comprising these polymers, blends, mixtures or formulations. | 05-15-2014 |
20140252279 | ORGANIC SEMICONDUCTORS - The invention relates to novel organic semiconducting compounds containing one or more dithieno[2,3-b:7,8-b′]-s-indaceno[1,2-b:5,6-b′]dithiophene (IDTT) units that are functionalised at the 6,12-positions with electron withdrawing groups and are optionally substituted at the 3,9-positions with solubilising groups, to methods for their preparation and educts or intermediates used therein, to polymers, blends, mixtures and formulations containing them, to the use of the compounds, polymers, polymer blends, mixtures and formulations as semiconductors in organic electronic (OE) devices, especially in organic photovoltaic (OPV) devices and organic photodetectors (OPD), and to OE, OPV and OPD devices comprising these compounds, polymers, polymer blends, mixtures or formulations. | 09-11-2014 |
20150076418 | CONJUGATED POLYMERS - The invention relates to novel conjugated polymers comprising in their backbone one or more divalent donor units, like for example benzo[1,2-b:4,5-b′]dithiophene-2,6-diyl (BDT), that are linked on both sides to an acceptor unit, to methods of preparing the polymers and educts or intermediates used in such preparation, to polymer blends, mixtures and formulations containing the polymers, to the use of the polymers, polymer blends, mixtures and formulations as semiconductors organic electronic (OE) devices, especially in organic photovoltaic (OPV) devices and organic photodetectors (OPD), and to OE, OPV and OPD devices comprising these polymers, polymer blends, mixtures or formulations. | 03-19-2015 |
Patent application number | Description | Published |
20120256137 | COMPOSITIONS COMPRISING ORGANIC SEMICONDUCTING COMPOUNDS - The present invention relates to novel compositions comprising an organic semiconductor (OSC) and a wetting agent, to their use as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and organic light emitting diode (OLED) devices, to methods for preparing OE devices using the novel compositions, and to OE devices, especially OLED devices and OPV cells prepared from such methods and compositions. The efficiency of an OE device with the inclusion of 1% volatile surfactant was 13.5 cd/A at 100 cd/m2 | 10-11-2012 |
20120273736 | COMPOSITIONS COMPRISING POLYMERIC BINDERS - The present invention relates to novel compositions comprising light emitting materials and/or charge transport materials and a polymeric binder, to their use as conducting inks for the preparation of organic light emitting diode (OLED) devices, to methods for preparing OLED devices using the novel formulations, and to OLED devices prepared from such methods and formulations. | 11-01-2012 |
20130026421 | COMPOSITION AND METHOD FOR PREPARATION OF ORGANIC ELECTRONIC DEVICES - The present invention relates to novel compositions comprising an organic semiconductor (OSC) and one or more organic solvents. The composition is solid at a temperature of 25° C. and fluid at a higher temperature and the boiling point of the solvent is at most 400° C. Furthermore, the present invention describes the use of these compositions as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel compositions, and to OE devices, OLED devices and OPV cells prepared from such methods and compositions. | 01-31-2013 |
Patent application number | Description | Published |
20100218194 | SYSTEM AND METHOD FOR THREAD SCHEDULING IN PROCESSORS - A method for controlling a data processing system, a data processing system executing a similar method, and a computer readable medium with instructions for a similar method. The method includes receiving, by an operating system executing on a data processing system, an execution request from an application, the execution request including at least one resource-defining attribute corresponding to an execution thread of the application. The method also includes allocating processor resources to the execution thread by the operating system according to the at least one resource-defining attribute, and allowing execution of the execution thread on the data processing system according to the allocated processor resources. | 08-26-2010 |
20120007864 | Data Processing System with Construction Geometry - A CAD system, method, and computer readable medium. A method for modeling a topological structure includes receiving a definition of a topological structure. The method also includes receiving a definition of a construction element and receiving a geometrical relationship between the construction element and an element of the topological structure. The method further includes receiving a change to the topological structure and, in response to the change, changing the first construction element according to the geometrical relationship. | 01-12-2012 |
20120078581 | Variational Modeling with Removal Features - Systems, methods, and computer readable mediums. A method includes receiving a geometric model including at least one removal feature having at least one face. The method includes designating at least one face as a remain variational face and adding a constraint to the designated face. The method includes performing a variational edit on the model using the constraints to the designated face and storing the edited model. | 03-29-2012 |
20120078582 | Variational Modeling with Discovered Interferences - A system, method, and computer readable medium. A method includes receiving a geometric model in an initial state including at least a first feature and a second feature, at least one of the first and second features being a removal feature. The method includes detecting an interaction between the first and second features, and applying a dependency rule to the first feature and the second feature. The method includes performing a variational edit process including removing the first feature and the second feature according to the dependency rule. The method includes solving and recreating the edited model. | 03-29-2012 |
20120221297 | Global Deformation for a Modeled Object - A CAD system, method, and machine-readable medium. A method selecting a first plurality of points on an original surface of a 3D model and producing a first plurality of deformed points corresponding to the first plurality of points. The method includes creating a first deformed surface from the first plurality of deformed points. The method includes selecting a second plurality of points on the original surface of the model and producing a second plurality of deformed points corresponding to the second plurality of points. The method includes modifying the first deformed surface according to the second plurality of deformed points, including matching the first deformed surface to other deformed features of the model, and storing the deformed surface as part of a deformed model. | 08-30-2012 |
20120271595 | NOTCH RE-BLEND IN AN OBJECT MODEL - A method for a CAD system, a CAD system, and instructions for a CAD system. A method includes receiving an object model including a plurality of features. The method includes creating a blend as part of the object model, using at least one of the features, and removing the used features. The method includes creating a construction body corresponding to the object model, and storing the removed features in the construction body. The method includes performing a CAD operation on the object model using the features stored in the construction body. | 10-25-2012 |
20140058707 | VARIATIONAL MODELING WITH REMOVAL FEATURES - Systems, methods, and computer readable mediums. A method includes receiving a geometric model including at least one removal feature having at least one face, the removal feature being a feature that is removed prior to variational solving and recreated after a variational solution has been applied into the geometric model. The method includes designating at least one face of the removal feature as a remain variational face that will not be removed during a variational edit. The method includes adding a constraint to the remain variational face of the removal feature and performing the variational edit on the model to produce an edited model, including applying the constraint. The method includes storing the edited model. | 02-27-2014 |
20140316751 | SYSTEM AND METHOD OF GENERATING GEOMETRY OF A SWEPT VOLUME OF A SPUN TOOL - A method includes receiving a representation of a spun tool and receiving a path for the spun tool. The method also includes calculating a profile of the spun tool and simulating movement of the spun tool over the path. The method includes determining critical positions along the path at which the composition of the profile of the spun tool changes based on the path, and re-calculating the composition of the profile of the spun tool for each side of a critical position. The method further includes re-calculating the shape of the profile of the spun tool at non-critical positions of the path. The method further includes determining a volume defined by moving the spun tool along the path between a first critical position and a second critical position, changing the profile of the spun tool at each critical position, and calculating a total volume based on the path. | 10-23-2014 |