Nang
Harrison Lau Lik Nang, Kajang MY
Patent application number | Description | Published |
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20110105775 | METHOD OF CONVERTING FREE FATTY ACID (FFA) FROM OIL TO METHYL ESTER - The present invention provides a method of converting free fatty acid (FFA) from oil to methyl ester, the method includes the steps (a) esterifying the FFA using an acidic catalyst dissolved in an alcohol, (b) separating excess alcohol, solid acid catalyst, water, glycerol, soap and other non-lipid soluble impurities from oil obtained from step (a), (c) neutralizing the oil from step (b), (d) drying the oil from step (c) and (e) transesterifying the oil from step (d) using an alkaline catalyst and an alcohol. | 05-05-2011 |
Harrison Lau Nik Nang, Kajang MY
Patent application number | Description | Published |
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20090199463 | PALM DIESEL WITH LOW POUR POINT FOR COLD CLIMATE COUNTRIES - The processes of producing the low pour point palm diesel particularly but not exclusively via esterification of C18, C18:1 and C18:2 mixed fatty acids with methanol or ethanol, or fractional distillation of methyl or ethyl esters of palm oil, palm kernel oil and palm oil products, or fractional distillation of methyl or ethyl esters of palm oil, palm kernel oil and palm oil products, followed by crystallisation, or crystallisation of methyl or ethyl esters of palm oil, palm kernel oil and palm oil products, or crystallisation of methyl or ethyl esters of palm oil, palm kernel oil and palm oil products, followed by fractional distillation. | 08-13-2009 |
Hnin Nway San Nang, Kawasaki JP
Patent application number | Description | Published |
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20120067635 | Package substrate unit and method for manufacturing package substrate unit - A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts. | 03-22-2012 |