Patent application number | Description | Published |
20080220549 | Sealed light emitting diode assemblies including annular gaskets and methods of making same - An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device. | 09-11-2008 |
20080232103 | Flexible LED lighting strips - A flexible lighting strip includes an insulated flexible electrical power cord and spaced apart modules connected therewith. Each module includes a circuit board with a cavity, indentation, or opening and an encasing overmolding defining a fastener-receiving slot or opening aligned with the cavity, indentation, or opening of the circuit board. Power cord conductors are separated at the connection with each module to define a gap receiving a portion of the circuit board. A separate tiedown is secured to the power cord. Conductive elements receiving electrical power from the power cord and delivering electrical power to the circuit board include an insulation-displacing portion and a recess receiving at least a portion of the power cord and including a retaining barb or hook. An adhesive tape or strip is disposed over at least one overmolding opening to prevent water ingress to the circuit board. | 09-25-2008 |
20080232105 | Sealed lighting units - A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages. | 09-25-2008 |
20090186516 | LED STRING LIGHT ENGINE AND DEVICES THAT ARE ILLUMINATED BY THE STRING LIGHT ENGINE - A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor. | 07-23-2009 |
20090262531 | LED LIGHT ENGINE - A light engine comprises a plurality of LEDs and a plurality of optical elements each cooperating with a respective LED. The optical elements broaden the off-axis angle from the respective LEDs to provide a more uniform illumination at a target plane. | 10-22-2009 |
20120002418 | RAIL AND CLIP MOUNTING FOR LED MODULES FOR FLUORESCENT APPLICATION REPLACEMENT - In accordance with a first exemplary embodiment of the present disclosure, a mounting arrangement for use with an LED power strip module is provided. The mounting arrangement comprises one or more one frames having a first end and a second end, a first holding base configured to mate with the first end and a second holding base configured to mate with the second end, and at least one LED module having a first and second edge and comprising a plurality of LEDs, said LED module being adapted to removably attach to the one or more frames. The first and second holding bases are adapted to secure the one or more frames to an existing raceway structure. | 01-05-2012 |
20120063128 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 03-15-2012 |
20120066900 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 03-22-2012 |
20120153865 | LIGHT EMITTING DIODE MODULE REPLACEMENT FOR LINEAR FLUORESCENT - A lighting assembly for an existing linear fluorescent fixture includes a support, at least two opposing light emitting diodes (LED) on respective sides of the support configured to direct light in opposite general directions, a housing configured to cover the support and the at least two opposing LEDs; and end caps including electrical connectors to connect to electrical connections of the existing linear fluorescent fixture. | 06-21-2012 |
20130155681 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 06-20-2013 |
20140049968 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 ° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 02-20-2014 |
20140153244 | RAIL AND CLIP MOUNTING FOR LED MODULES FOR FLUORESCENT APPLICATION REPLACEMENT - In accordance with a first exemplary embodiment of the present disclosure, a mounting arrangement for use with an LED power strip module is provided. The mounting arrangement comprises one or more one frames having a first end and a second end, a first holding base configured to mate with the first end and a second holding base configured to mate with the second end, and at least one LED module having a first and second edge and comprising a plurality of LEDs, said LED module being adapted to removably attach to the one or more frames. The first and second holding bases are adapted to secure the one or more frames to an existing raceway structure. | 06-05-2014 |
20140237814 | LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING - One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. | 08-28-2014 |
Patent application number | Description | Published |
20080244944 | LED backlighting system for cabinet sign - A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels. | 10-09-2008 |
20080296607 | ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME - An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly. | 12-04-2008 |
20130042510 | LED LIGHT MODULE FOR BACKLIGHTING - An LED light module and a backlit sign using at least one of the LED light modules are described. The LED light module comprises at least two LED light sources that are spaced apart from each other. Each of the LED light sources is covered by a lens and at least two of the lenses have a different shape than each other. The LED light module produces a uniform intensity of light on a backlit surface. The LED light module can include three LED light sources. Two of the lenses covering the LED light sources emit light that is distributed off-axis and a third of the lenses covering the LED light sources emits light that is distributed substantially on-axis. The backlit sign comprises a housing, at least one LED light module disposed in the housing and a backlit surface on the housing extending over the LED modules. | 02-21-2013 |
20140254140 | LED BACKLIGHT SYSTEM FOR CABINET SIGN - A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels. | 09-11-2014 |
20140317975 | LED BACKLIGHT SYSTEM FOR CABINET SIGN - A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels. | 10-30-2014 |
20150007469 | LED BACKLIGHT SYSTEM FOR CABINET SIGN - A backlighting system for a cabinet sign may include a plurality of panels. Each panel includes a plurality of light emitting diodes (“LEDs”) attached to the panel. The diode has a box sign depth factor of less than about 1.4. An integrated circuit may also be located on the panel. A wire physically connects adjacent panels. | 01-08-2015 |
20150070879 | Showcase Member With Direct-Mounted Led Light Source - A showcase member of a glass showcase, the showcase member including a first portion having a plurality of apertures, a light emitting diode (LED) module positioned at one or more of the plurality of apertures and mounted to the showcase member, and a wiring harness electrically connected to the LED module, and configured to electrically connect the LED module to an LED driver circuit. The showcase member can include a second portion integral to the first portion and having tapers forming light shields protruding from the showcase member. | 03-12-2015 |
20150176786 | SYSTEMS AND METHODS FOR SIMULATING NEON LIGHTING USING LIGHT EMITTING DIODES - A system for simulating neon light comprising an elongated guide containing outer surface and a channel; a housing containing an engagement member and area for receiving a light engine; and the light engine. The light engine comprising a flexible printed circuit (FPC), a plurality of light emitting diodes (LEDs) attached to the FPC, and a plurality of electrical connectors all in contact with a power conductor. The FPC also includes a gathering of material between each of the plurality of electrical connectors. Also included is a method for reducing the stress within the light engine. | 06-25-2015 |