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Nakashiba

Tohru Nakashiba, Osaka JP

Patent application numberDescriptionPublished
20110033614METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE - An object is to manufacture an optical waveguide having low optical loss, by smoothing the surface of a core. To this end, a method for manufacturing an optical waveguide includes: a core-forming layer formation step of forming a core-forming layer of a photosensitive polymer on a surface of a lower cladding layer formed on a substrate; a smoothing step of smoothing the surface by lowering a surface viscosity thereof through a heat treatment of the core-forming layer; and a photocuring step of forming a core through selective exposure of the smoothed core-forming layer.02-10-2011
20110243495METHOD FOR FORMING MIRROR-REFLECTING FILM IN OPTICAL WIRING BOARD, AND OPTICAL WIRING BOARD - An aspect of the present invention is directed to a method for forming a mirror-reflecting film on a waveguide in an optical wiring board, characterized in that a multilayer film, in which a base, a metal layer and an adhesive layer are layered in this order, is used, and the metal layer is transferred and bonded to an inclined face for mirror-reflecting film formation provided on the waveguide, with the adhesive layer of the multilayer film intervening. The present invention provides a method which, when forming a mirror-reflecting film on a waveguide in an optical wiring board, enables inexpensive and easy formation of the mirror-reflecting film, using the smallest quantity of metal possible and employing comparatively simple facilities and techniques.10-06-2011
20120014640METHOD OF MANUFACTURING OPTICAL WAVEGUIDE CORE, METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, AND OPTOELECTRIC COMPOSITE WIRING BOARD - In order to provide a method of efficiently manufacturing an optical waveguide core having an endface inclined at a predetermined angle, the following method of manufacturing an optical waveguide core is employed. The method includes: a core material layer forming step of forming a core material layer formed of a photosensitive material on a surface of a cladding layer that has been formed on a substrate; a high refractive index substance covering step of covering a surface of the core material layer with a substance having a refractive index higher than 1 by bringing the high refractive index substance into close contact with the core material layer surface; an exposure step of pattern exposing the core material layer in a predetermined core-forming shape to from a core by irradiating the core material layer on a side covered with the high refractive index substance with exposure light inclined at a predetermined angle with respect to the cladding layer surface; a high refractive index substance removing step of removing the high refractive index substance from the surface of the core material layer exposed in the exposure step; and an development step of developing the core material layer from which the high refractive index substance has been removed in the high refractive index substance removing step so as to form the core having an inclined endface.01-19-2012
20120020613METHOD OF MANUFACTURING OPTICAL WAVEGUIDE HAVING MIRROR FACE, AND OPTOELECTRONIC COMPOSITE WIRING BOARD - In order to provide a method of manufacturing an optical waveguide, which enables the formation of a smooth mirror face, the following method of manufacturing an optical waveguide having a mirror face is used. The method includes: a photocurable resin sheet laminating step of laminating an uncured photocurable resin sheet for forming a core on a surface of a first cladding layer that has been formed on a substrate; a mirror face forming step of forming a mirror face for guiding light to the core by pressing a die provided with a blade having, in a cross-section, a 45° inclined plane into the photocurable resin sheet; a core forming step of forming a core having the mirror face positioned at an end thereof by selectively exposing to light, and developing, the photocurable resin sheet; and a cladding layer forming step of forming a second cladding layer so as to bury the core.01-26-2012
20120033913OPTICAL WAVEGUIDE-FORMING EPOXY RESIN COMPOSITION, OPTICAL WAVEGUIDE-FORMING CURABLE FILM, OPTICAL-TRANSMITTING FLEXIBLE PRINTED CIRCUIT, AND ELECTRONIC INFORMATION DEVICE - An optical waveguide of excellent flex resistance which is to be formed on the surface of a flexible printed circuit is obtained by using an epoxy resin composition includes (A) a liquid epoxy compound, (B) a solid epoxy compound, and (C) a cationic curing initiator, wherein as the liquid epoxy compound (A), (A1) a liquid epoxy compound represented by general formula (I) below is included:02-09-2012

Tooru Nakashiba, Osaka-Shi JP

Patent application numberDescriptionPublished
20090049964Process of forming a deflection mirror in a light waveguide - A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.02-26-2009
20090104565METHOD FOR FORMING PHOTOELECTRIC COMPOSITE BOARD - In a method for forming a photoelectric composite board (04-23-2009
20090238963PROCESS OF FORMING A DEFLECTION MIRROR IN A LIGHT WAVEGUIDE - A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.09-24-2009

Yasutaka Nakashiba, Kawasaki-Shi JP

Patent application numberDescriptionPublished
20090212385SEMICONDUCTOR DEVICE INCLUDING VANADIUM OXIDE SENSOR ELEMENT WITH RESTRICTED CURRENT DENSITY - In a semiconductor device including a semiconductor substrate and at least one sensor element made of vanadium oxide formed over the semiconductor substrate, the sensor element is designed so that a density of a current flowing through the sensor element is between 0 and 100 μA/μm2.08-27-2009
20100258874SEMICONDUCTOR DEVICE - A distance “a” from a first gate electrode of a first transistor of a high-frequency circuit to a first contact is greater than a distance “b” from a second electrode of a second transistor of a digital circuit to a second contact. The first contact is connected to a drain or source of the first transistor, and the second contact is connected to a drain or source of the second transistor.10-14-2010
20100265024SEMICONDUCTOR DEVICE - In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls.10-21-2010

Yasutaka Nakashiba, Tokyo JP

Patent application numberDescriptionPublished
20120281125SOLID STATE IMAGE PICK-UP DEVICE - The solid state image pick-up device comprises a chip wherein an object to be photographed is put directly on the back surface of the chip, a light incident on the object enters the inner portion of the chip, signal electric charges generated in the inner portion of the chip by the light, the signal electric charges are collected in a photo detective region and the photo detective region has a barrier diffusion layer adjacent thereto so as to collect the signal electric charges effectively. The above-mentioned structure of the solid state image pick-up device can provide superior features that the chip of the solid state image pick-up device is protected from the deterioration of elements included in the chip and the destruction of the elements by Electro Static Discharge, resulting in the reliability improvement of the chip.11-08-2012